C Series, Heat Sinks

Results:
27
Manufacturer
Series
Length
Thermal Resistance @ Forced Air Flow
Power Dissipation @ Temperature Rise
Package Cooled
Attachment Method
Material Finish
Shape
Material
Fin Height
Width
Type
Thermal Resistance @ Natural
Diameter
Results remaining27
Applied Filters:
C
Select
ImageProduct DetailPriceAvailabilityECAD ModelMaterialLengthSeriesWidthDiameterTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
C264-085-3AE
HEATSINK AND CLIPS FOR 3 TO-264
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
3.346" (85.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C247-050-2AE
HEATSINK FOR TO-247 WITH 2 CLIPS
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
1.969" (50.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
2.5W @ 30°C
5.00°C/W @ 200 LFM
-
Black Anodized
C247-025-1AE
HEATSINK FOR TO-247 WITH 1 CLIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.984" (25.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
5.0W @ 60°C
6.00°C/W @ 350 LFM
-
Black Anodized
C220-075-3VE
HEATSINK AND CLIPS FOR 3 TO-220
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
2.953" (75.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C220-050-2VE
HEATSINK AND CLIP FOR 2 TO-220
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
1.969" (50.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C220-025-1AE
HEATSINK AND CLIP FOR TO-220
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.984" (25.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C126-025-1VE
HEATSINK FOR TO-126 25MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.984" (25.00mm)
C
1.280" (32.51mm)
-
Board Level, Vertical
TO-126
Clip and PC Pin
Rectangular, Fins
0.732" (18.60mm)
3.5W @ 28°C
6.00°C/W @ 500 LFM
-
Degreased
C126-040-2VE
HEATSINK FOR TO-126 40MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
1.575" (40.00mm)
C
1.280" (32.51mm)
-
Board Level, Vertical
TO-126
2 Clips and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
-
-
Degreased
C264-085-3VE
HEATSINK AND CLIPS FOR 3 TO-264
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
3.346" (85.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C264-030-1VE
HEATSINK AND CLIP FOR TO-264
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
1.181" (30.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C264-058-2VE
HEATSINK AND CLIPS FOR 2 TO-264
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
2.283" (58.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C220-075-3AE
HEATSINK AND CLIPS FOR 3 TO-220
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
2.953" (75.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C247-075-3AE
HEATSINK FOR TO-247 WITH 3 CLIPS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
2.953" (75.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
2.5W @ 20°C
2.00°C/W @ 300 LFM
-
Black Anodized
C264-058-2AE
HEATSINK AND CLIPS FOR 2 TO-264
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
2.283" (58.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C247-050-2VE
HEATSINK FOR TO-247 WITH 2 CLIPS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
1.969" (50.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
2.5W @ 30°C
5.00°C/W @ 200 LFM
-
Degreased
C220-050-2AE
HEATSINK AND CLIPS FOR 2 TO-220
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
1.969" (50.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C247-025-1VE
HEATSINK FOR TO-247 WITH 1 CLIP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.984" (25.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
5.0W @ 60°C
6.00°C/W @ 350 LFM
-
Degreased
C264-030-1AE
HEATSINK AND CLIP FOR TO-264
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
1.181" (30.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Black Anodized
C220-025-1VE
HEATSINK AND CLIP FOR TO-220
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.984" (25.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
-
-
Degreased
C247-075-3VE
HEATSINK FOR TO-247 WITH 3 CLIPS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
2.953" (75.00mm)
C
1.500" (38.10mm)
-
Board Level, Vertical
TO-247
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
2.5W @ 20°C
2.00°C/W @ 300 LFM
-
Degreased

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.