C Series, Heat Sinks

Results:
36
Manufacturer
Series
Length
Thermal Resistance @ Forced Air Flow
Package Cooled
Power Dissipation @ Temperature Rise
Attachment Method
Fin Height
Material Finish
Width
Shape
Material
Thermal Resistance @ Natural
Type
Diameter
Results remaining36
Applied Filters:
C
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ImageProduct DetailPriceAvailabilityECAD ModelMaterialSeriesWidthDiameterLengthTypePackage CooledAttachment MethodShapeFin HeightThermal Resistance @ NaturalMaterial FinishThermal Resistance @ Forced Air Flow
C247-025-1AE
25MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
6°C/W @ 350 LFM
C220-050-2AE
50MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
1.969" (50.00mm)
Board Level, Vertical
TO-220
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
-
CR401-50AE
50MM SINGLE SIDED HEAT SINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
2.953" (75.00mm)
-
1.969" (50.00mm)
Board Level, Vertical
TO-247, TO-264
2 Clips and PC Pin
Rectangular, Fins
2.950" (74.93mm)
3.80°C/W
Black Anodized
-
C247-075-3AE
75MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
2.953" (75.00mm)
Board Level, Vertical
TO-247
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
2.00°C/W @ 300 LFM
C126-025-1VE
25MM LG, DEGREASED HEAT SINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.280" (32.51mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-126
Clip and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
Degreased
6.00°C/W @ 500 LFM
C247-050-2VE
50MM LG, DEGREASED HEAT SINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
1.969" (50.00mm)
Board Level, Vertical
TO-247
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Degreased
5.00°C/W @ 200 LFM
C264-030-1AE
30MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
1.181" (30.00mm)
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
-
C220-075-3AE
75MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
2.953" (75.00mm)
Board Level, Vertical
TO-220
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
-
C264-058-2AE
58MM LG, BLK ANODIZED HEATSINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
C
1.500" (38.10mm)
-
2.283" (58.00mm)
Board Level, Vertical
TO-264
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
-
C247-025-1AE
HEATSINK FOR TO-247 WITH 1 CLIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
6.00°C/W @ 350 LFM
C247-050-2AE
HEATSINK FOR TO-247 WITH 2 CLIPS
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
1.969" (50.00mm)
Board Level, Vertical
TO-247
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
5.00°C/W @ 200 LFM
C126-025-1AE
HEATSINK FOR TO-126 25MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.280" (32.51mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-126
Clip and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
Black Anodized
6.00°C/W @ 500 LFM
C126-040-2VE
HEATSINK FOR TO-126 40MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.280" (32.51mm)
-
1.575" (40.00mm)
Board Level, Vertical
TO-126
2 Clips and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
Degreased
-
C126-040-2AE
HEATSINK FOR TO-126 40MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.280" (32.51mm)
-
1.575" (40.00mm)
Board Level, Vertical
TO-126
2 Clips and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
Black Anodized
-
C126-025-1VE
HEATSINK FOR TO-126 25MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
C
1.280" (32.51mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-126
Clip and PC Pin
Rectangular, Fins
0.732" (18.60mm)
-
Degreased
6.00°C/W @ 500 LFM
C220-025-1AE
HEATSINK AND CLIP FOR TO-220
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
0.984" (25.00mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Black Anodized
-
C220-050-2VE
HEATSINK AND CLIP FOR 2 TO-220
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
1.969" (50.00mm)
Board Level, Vertical
TO-220
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Degreased
-
C220-075-3VE
HEATSINK AND CLIPS FOR 3 TO-220
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
2.953" (75.00mm)
Board Level, Vertical
TO-220
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Degreased
-
C264-085-3VE
HEATSINK AND CLIPS FOR 3 TO-264
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
3.346" (85.00mm)
Board Level, Vertical
TO-264
3 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Degreased
-
C264-058-2VE
HEATSINK AND CLIPS FOR 2 TO-264
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
C
1.500" (38.10mm)
-
2.283" (58.00mm)
Board Level, Vertical
TO-264
2 Clips and PC Pin
Rectangular, Fins
0.710" (18.03mm)
-
Degreased
-

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.