624 Series, Heat Sinks

Results:
23
Manufacturer
Series
Fin Height
Thermal Resistance @ Forced Air Flow
Attachment Method
Shape
Material
Type
Length
Thermal Resistance @ Natural
Material Finish
Width
Power Dissipation @ Temperature Rise
Diameter
Package Cooled
Results remaining23
Applied Filters:
624
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ImageProduct DetailPriceAvailabilityECAD ModelMaterialLengthDiameterWidthSeriesTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
624-35ABT4
HEATSINK CPU 25MM SQUARE W/TAPE
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.350" (8.89mm)
-
15.00°C/W @ 400 LFM
-
Black Anodized
624-60AB
HEATSINK FOR 21MM BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.600" (15.24mm)
-
1.00°C/W @ 400 LFM
-
Black Anodized
624-25ABT1E
HEATSINK FOR 21MM BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-35ABT1E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.350" (8.89mm)
-
15.00°C/W @ 400 LFM
-
Black Anodized
624-35ABT3
HEATSINK FOR 21MM BGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.350" (8.89mm)
-
15.00°C/W @ 400 LFM
-
Black Anodized
624-60ABT1E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.600" (15.24mm)
-
1.00°C/W @ 400 LFM
-
Black Anodized
624-25ABT3
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-45AB-T4E
HEATSINK CPU 21MM SQ
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Black Anodized
624-45ABT1E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Black Anodized
624-25ABT5
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-25ABT4E
HEATSINK CPU 21MM SQ W/DBL TAPE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-45ABT3
HEATSINK CPU 21MM SQ W/ADH BLK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Black Anodized
624-25AB
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-35AB
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.350" (8.89mm)
-
15.00°C/W @ 400 LFM
-
Black Anodized
624-45AB
HEATSINK CPU 21MM SQ W/OUT ADH
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Black Anodized
624-25ABT4
HEATSINK CPU 21MM SQ W/DBL TAPE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.250" (6.35mm)
-
25.00°C/W @ 200 LFM
-
Black Anodized
624-35ABT4E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.350" (8.89mm)
-
15.00°C/W @ 400 LFM
-
Black Anodized
624-60ABT5
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.600" (15.24mm)
-
1.00°C/W @ 400 LFM
-
Black Anodized
624-60ABT4E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.600" (15.24mm)
-
1.00°C/W @ 400 LFM
-
Black Anodized
624-45ABT4E
HEATSINK FOR 21MM BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.827" (21.00mm)
-
0.827" (21.00mm)
624
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.