W Series, Heat Sinks

Results:
12
Manufacturer
Series
Thermal Resistance @ Natural
Package Cooled
Thermal Resistance @ Forced Air Flow
Length
Material Finish
Width
Power Dissipation @ Temperature Rise
Material
Shape
Fin Height
Type
Attachment Method
Diameter
Results remaining12
Applied Filters:
W
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMaterialDiameterLengthTypePackage CooledAttachment MethodShapeWidthFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
WA-T264-101E
TO-264 AUTO CLIP HEAT SINK
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Quantity
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PCB Symbol, Footprint & 3D Model
W
Aluminum Alloy
-
1.260" (32.00mm)
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
3.0W @ 50°C
8.00°C/W @ 500 LFM
11.00°C/W
Black Anodized
WV-T247-101E
TO-247 AUTO CLIP HEAT SINK
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum Alloy
-
1.260" (32.00mm)
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
3.0W @ 50°C
8.00°C/W @ 500 LFM
12.00°C/W
Degreased
WA-T220-101E
TO-220 AUTO CLIP HEAT SINK
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.201" (30.50mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.720" (18.29mm)
0.630" (16.00mm)
1.0W @ 20°C
-
12.00°C/W
Black Anodized
WV-T264-101E
TO-264 AUTO CLIP HEAT SINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum Alloy
-
1.260" (32.00mm)
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
3.0W @ 50°C
8.00°C/W @ 500 LFM
12.00°C/W
Degreased
WA-T220-101E
HEATSINK AND CLIP FOR TO-220 BLK
1+
$2.7380
5+
$2.5859
10+
$2.4338
Quantity
3,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.201" (30.50mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.720" (18.29mm)
0.630" (16.00mm)
1.0W @ 20°C
-
12.00°C/W
Black Anodized
WA-T247-101E
HEATSINK AND CLIP FOR TO-247 BLK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.260" (32.00mm)
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
7.00°C/W
Black Anodized
WV-T247-101E
HEATSINK AND CLIP FOR TO-247
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.260" (32.00mm)
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
9.00°C/W
Degreased
WA-T264-101E
HEATSINK W/CLIP FOR TO-264
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.260" (32.00mm)
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
11.00°C/W
Black Anodized
WV-T220-101E
HEATSINK AND CLIP FOR TO-220
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.201" (30.50mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.720" (18.29mm)
0.630" (16.00mm)
1.0W @ 20°C
-
13.00°C/W
Degreased
WV-DT2-101E
HEATSINK DUAL FOR TO-220/247
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.200" (30.48mm)
Board Level, Vertical
TO-220, TO-247 (Dual)
Clip and PC Pin
Rectangular, Fins
1.710" (43.43mm)
0.630" (16.00mm)
4.0W @ 40°C
6.00°C/W @ 200 LFM
6.00°C/W
Degreased
WA-DT2-101E
HEATSINK DUAL FOR TO-220/247 BLK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.200" (30.48mm)
Board Level, Vertical
TO-220, TO-247 (Dual)
Clip and PC Pin
Rectangular, Fins
1.710" (43.43mm)
0.630" (16.00mm)
4.0W @ 40°C
6.00°C/W @ 200 LFM
5.00°C/W
Black Anodized
WV-T264-101E
HEATSINK W/CLIP FOR TO-264
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
W
Aluminum
-
1.260" (32.00mm)
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
0.921" (23.40mm)
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
12.00°C/W
Unfinished

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.