CR Series, Heat Sinks

Results:
29
Manufacturer
Series
Thermal Resistance @ Natural
Length
Width
Package Cooled
Fin Height
Attachment Method
Material Finish
Shape
Material
Type
Thermal Resistance @ Forced Air Flow
Power Dissipation @ Temperature Rise
Diameter
Results remaining29
Applied Filters:
CR
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ImageProduct DetailPriceAvailabilityECAD ModelMaterialSeriesDiameterLengthWidthTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
CR401-25VE
ALUMINUM HEATSINK 25MM DEGREASED
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
0.984" (25.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
5.40°C/W
Degreased
CR401-25AE
ALUMINUM HEATSINK 25MM BLK ANODI
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
0.984" (25.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
5.40°C/W
Black Anodized
CR101-50VE
ALUMINUM HEATSINK 50MM DEGREASED
1+
$6.4609
5+
$6.1019
10+
$5.7430
Quantity
197 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
1.969" (50.00mm)
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
-
-
-
5.30°C/W
Degreased
CR301-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
2.362" (60.00mm)
Board Level, Vertical
TO-301
2 Clips and PC Pin
Rectangular, Fins
-
-
-
4.50°C/W
Black Anodized
CR101-50AE
ALUMINUM HEATSINK 50MM BLK ANODI
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
1.969" (50.00mm)
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
-
-
-
5.30°C/W
Black Anodized
CR301-50AE
ALUMINUM HEATSINK 50MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
2.362" (60.00mm)
Board Level, Vertical
TO-301
2 Clips and PC Pin
Rectangular, Fins
-
-
-
5.70°C/W
Black Anodized
CR201-50AE
ALUMINUM HEATSINK 50MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
-
-
-
3.30°C/W
Black Anodized
CR201-75VE
ALUMINUM HEATSINK 75MM DEGREASED
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
-
-
-
2.60°C/W
Degreased
CR201-25VE
ALUMINUM HEATSINK 25MM DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
0.984" (25.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
-
-
-
4.70°C/W
Degreased
CR201-50VE
ALUMINUM HEATSINK 50MM DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
-
-
-
3.30°C/W
Degreased
CR401-50AE
ALUMINUM HEATSINK 50MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
3.80°C/W
Black Anodized
CR401-75VE
ALUMINUM HEATSINK 75MM DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
3.00°C/W
Degreased
CR401-50VE
ALUMINUM HEATSINK 50MM DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.969" (50.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
3.80°C/W
Degreased
CR101-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
1.969" (50.00mm)
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
-
-
-
4.20°C/W
Black Anodized
CR202-64VE
CR202 HEATSINK 63.5MM LONG
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.520" (64.00mm)
-
Board Level, Vertical
TO-202
Clip and PC Pin
Rectangular, Fins
-
-
-
-
Degreased
CR202-38VE
CR202 HEATSINK 38.1MM LONG
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
1.496" (38.00mm)
-
Board Level, Vertical
TO-202
Clip and PC Pin
Rectangular, Fins
-
-
-
-
Degreased
CR202-95VE
CR202 HEATSINK 95.25MM LONG
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
3.740" (95.00mm)
-
Board Level, Vertical
TO-202
Clip and PC Pin
Rectangular, Fins
-
-
-
-
Degreased
CR101-75VE
ALUMINUM HEATSINK 75MM DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
1.969" (50.00mm)
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
-
-
-
4.20°C/W
Degreased
CR201-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
-
-
-
2.60°C/W
Black Anodized
CR401-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
CR
-
2.953" (75.00mm)
2.953" (75.00mm)
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
-
-
-
3.00°C/W
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.