D Series, Heat Sinks

Results:
29
Manufacturer
Series
Thermal Resistance @ Forced Air Flow
Power Dissipation @ Temperature Rise
Width
Fin Height
Material Finish
Package Cooled
Shape
Material
Type
Length
Thermal Resistance @ Natural
Attachment Method
Diameter
Results remaining29
Applied Filters:
D
Select
ImageProduct DetailPriceAvailabilityECAD ModelMaterialLengthDiameterSeriesWidthTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
DV-T268-101E-TR
TO-268 HEAT SINK TAPE
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.220" (30.99mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.400" (10.16mm)
7.0W @ 35°C
5.00°C/W @ 500 LFM
-
Degreased
DA-T268-301E-TR
TO-268 SMD HEAT SINK ANODZD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
4.00°C/W @ 700 LFM
-
Black Anodized
DV-T263-301E-TR
TO-263 SMD HEAT SINK ANODZD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.390" (35.31mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
6.0W @ 40°C
7.00°C/W @ 500 LFM
-
Degreased
DV-T268-401E-TR
TO-268 SMD HEAT SINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.220" (30.99mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
-
-
-
Degreased
DV-T268-301E-TR
TO-268 SMD HEAT SINK ANODZD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
5.00°C/W @ 500 LFM
-
Degreased
DA-T263-101E-TR
TO-263 HEAT SINK / POLY TAPE
1+
¥22.5000
5+
¥21.2500
10+
¥20.0000
Quantity
2,305 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.400" (10.16mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Black Anodized
DV-T263-101E
HEATSINK FOR TO-263
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.400" (10.16mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Degreased
DA-T263-201E
TO-263 SMD HEAT SINK ANODZD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Black Anodized
DA-T268-301E
TO-268 SMD HEAT SINK ANODZD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
4.00°C/W @ 700 LFM
-
Black Anodized
DV-T263-201E
TO-263 SMD HEAT SINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Degreased
DV-T268-301E
TO-268 SMD HEAT SINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
4.00°C/W @ 700 LFM
-
Degreased
DA-T263-301E
HEATSINK D2PAK TO-263 ANODIZED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.390" (35.31mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
6.0W @ 40°C
7.00°C/W @ 500 LFM
-
Black Anodized
DV-T263-301E
HEATSINK D2PAK TO-263 DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.390" (35.31mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
6.0W @ 40°C
7.00°C/W @ 500 LFM
-
Degreased
DV-T268-101E-TR
TO-268 HEAT SINK /POLY TAPE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.220" (30.99mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.400" (10.16mm)
5.0W @ 35°C
6.00°C/W @ 600 LFM
-
Degreased
DV-T263-101E-TR
TO-263 HEAT SINK / POLY TAPE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.400" (10.16mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Degreased
DA-T268-301E-TR
HEATSINK FOR TO-268
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
4.00°C/W @ 700 LFM
-
Black Anodized
DV-T268-301E-TR
HEATSINK FOR TO-268
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.580" (40.13mm)
Top Mount
TO-268 (D³Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
7.0W @ 35°C
4.00°C/W @ 700 LFM
-
Degreased
DV-T263-201E-TR
HEATSINK FOR TO-263
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Degreased
DA-T263-201E-TR
HEATSINK FOR TO-263
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.020" (25.91mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Black Anodized
DV-T263-301E-TR
HEATSINK D2PAK TO-263 DEGREASED
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum
0.500" (12.70mm)
-
D
1.390" (35.31mm)
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.460" (11.68mm)
6.0W @ 40°C
7.00°C/W @ 500 LFM
-
Degreased

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.