Wave 3x Series, Heat Sinks

Results:
7
Manufacturer
Series
Thermal Resistance @ Forced Air Flow
Fin Height
Length
Width
Shape
Material
Type
Thermal Resistance @ Natural
Material Finish
Attachment Method
Power Dissipation @ Temperature Rise
Diameter
Package Cooled
Results remaining7
Applied Filters:
Wave 3x
Select
ImageProduct DetailPriceAvailabilityECAD ModelWidthMaterialDiameterLengthAttachment MethodSeriesTypePackage CooledShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
WAVE-32-12
ANCHOR HEATSINK 32X32X12MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.260" (32.00mm)
Aluminum Alloy
-
1.260" (32.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.472" (12.00mm)
-
4.64°C/W @ 200 LFM
-
Black Anodized
WAVE-35-15
ANCHOR HEATSINK 35X35X15MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.378" (35.00mm)
Aluminum Alloy
-
1.378" (35.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.590" (15.00mm)
-
3.15°C/W @ 200 LFM
-
Black Anodized
WAVE-35-125
ANCHOR HEATSINK 35X35X12.5MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.378" (35.00mm)
Aluminum Alloy
-
1.378" (35.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.492" (12.50mm)
-
3.63°C/W @ 200 LFM
-
Black Anodized
WAVE-35-12
ANCHOR HEATSINK 35X35X12MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.378" (35.00mm)
Aluminum Alloy
-
1.378" (35.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.472" (12.00mm)
-
3.83°C/W @ 200 LFM
-
Black Anodized
WAVE-366-175
ANCHOR HEATSINK 36.6X36.6X17.5MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.441" (36.60mm)
Aluminum Alloy
-
1.441" (36.60mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.689" (17.50mm)
-
2.55°C/W @ 200 LFM
-
Black Anodized
WAVE-34-21
ANCHOR HEATSINK 34X34X21MM
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Quantity
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PCB Symbol, Footprint & 3D Model
1.339" (34.00mm)
Aluminum Alloy
-
1.339" (34.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.827" (21.00mm)
-
2.19°C/W @ 200 LFM
-
Black Anodized
WAVE-35-21
ANCHOR HEATSINK 35X35X21MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
1.378" (35.00mm)
Aluminum Alloy
-
1.378" (35.00mm)
Clip
Wave 3x
Board Level
BGA
Square, Angled Fins
0.827" (21.00mm)
-
2.11°C/W @ 200 LFM
-
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.