HSB Series, Heat Sinks

Results:
30
Manufacturer
Series
Thermal Resistance @ Natural
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Length
Width
Fin Height
Attachment Method
Material
Shape
Type
Material Finish
Diameter
Package Cooled
Results remaining30
Applied Filters:
HSB
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ImageProduct DetailPriceAvailabilityECAD ModelMaterialLengthDiameterSeriesWidthAttachment MethodTypePackage CooledShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
HSB10-232306
HEAT SINK, BGA, 23 X 23 X 6 MM
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.906" (23.00mm)
-
HSB
0.906" (23.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.236" (6.00mm)
3.0W @ 75°C
9.60°C/W @ 200 LFM
25.46°C/W
Black Anodized
HSB28-606022
HEAT SINK, BGA, 60 X 60 X 22 MM,
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
2.362" (60.00mm)
-
HSB
2.362" (60.00mm)
Push Pin
Top Mount
BGA
Square, Pin Fins
0.866" (22.00mm)
15.83W @ 75°C
1.40°C/W @ 200 LFM
4.74°C/W
Black Anodized
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.787" (20.00mm)
-
HSB
0.787" (20.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Black Anodized
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.575" (40.00mm)
-
HSB
1.575" (40.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Black Anodized
HSB20-353525
HEAT SINK, BGA, 35 X 35 X 25 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.378" (35.00mm)
-
HSB
1.378" (35.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.984" (25.00mm)
11.3W @ 75°C
2.70°C/W @ 200 LFM
6.65°C/W
Black Anodized
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.335" (8.50mm)
-
HSB
0.335" (8.50mm)
Adhesive (Not Included)
Top Mount
BGA
Square, Pin Fins
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Black Anodized
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.669" (17.00mm)
-
HSB
0.669" (17.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Black Anodized
HSB24-252510
HEAT SINK, BGA,25 X 25 X 10 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.984" (25.00mm)
-
HSB
0.984" (25.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.394" (10.00mm)
4.14W @ 75°C
6.50°C/W @ 200 LFM
18.10°C/W
Black Anodized
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
1+
$1.0648
5+
$1.0056
10+
$0.9465
Quantity
500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.394" (10.00mm)
-
HSB
0.394" (10.00mm)
Adhesive (Not Included)
Top Mount
BGA
Square, Pin Fins
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Black Anodized
HSB03-141406
HEAT SINK, BGA, 14 X 14 X 6 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.551" (14.00mm)
-
HSB
0.551" (14.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.236" (6.00mm)
2.1W @ 75°C
15.80°C/W @ 200 LFM
35.98°C/W
Black Anodized
HSB13-303014
HEAT SINK, BGA, 30.7 X 30.7 X 14
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.209" (30.70mm)
-
HSB
1.209" (30.70mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.551" (14.00mm)
6.1W @ 75°C
4.70°C/W @ 200 LFM
12.36°C/W
Black Anodized
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.709" (18.00mm)
-
HSB
0.709" (18.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Black Anodized
HSB14-353518
HEAT SINK, BGA, 35 X 35 X 18 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.378" (35.00mm)
-
HSB
1.378" (35.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.709" (18.00mm)
8.4W @ 75°C
3.60°C/W @ 200 LFM
8.97°C/W
Black Anodized
HSB19-272718
HEAT SINK, BGA, 27 X 27 X 18 MM
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Quantity
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PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.063" (27.00mm)
-
HSB
1.063" (27.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.709" (18.00mm)
6.8W @ 75°C
4.50°C/W @ 200 LFM
11.11°C/W
Black Anodized
HSB16-404018
HEAT SINK, BGA, 40 X 40 X 18 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.575" (40.00mm)
-
HSB
1.575" (40.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.709" (18.00mm)
9.4W @ 75°C
2.60°C/W @ 200 LFM
7.96°C/W
Black Anodized
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.906" (23.00mm)
-
HSB
0.906" (23.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Black Anodized
HSB08-212106
HEAT SINK, BGA, 21 X 21 X 6 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.827" (21.00mm)
-
HSB
0.827" (21.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.236" (6.00mm)
3.0W @ 75°C
9.70°C/W @ 200 LFM
25.40°C/W
Black Anodized
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
1.063" (27.00mm)
-
HSB
1.063" (27.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Black Anodized
HSB03-121218
HEAT SINK, BGA, 12 X 12 X 18 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.472" (12.00mm)
-
HSB
0.472" (12.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.709" (18.00mm)
3.1W @ 75°C
9.60°C/W @ 200 LFM
24.01°C/W
Black Anodized
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Aluminum Alloy
0.827" (21.00mm)
-
HSB
0.827" (21.00mm)
Adhesive
Top Mount
BGA
Square, Pin Fins
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.