HSS Series, Heat Sinks

Results:
69
Manufacturer
Series
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Power Dissipation @ Temperature Rise
Fin Height
Length
Width
Attachment Method
Shape
Package Cooled
Material
Type
Material Finish
Diameter
Results remaining69
Applied Filters:
HSS
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ImageProduct DetailPriceAvailabilityECAD ModelShapeMaterialDiameterAttachment MethodSeriesLengthTypePackage CooledWidthFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
HSS13-B20-NP
HEAT SINK, STAMPING, TO-220, 31
1+
$1.8735
5+
$1.7694
10+
$1.6654
Quantity
1,193 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Rectangular
Aluminum Alloy
-
-
HSS
1.220" (31.00mm)
Board Level, Vertical
TO-220
0.994" (25.25mm)
0.508" (12.90mm)
4.8W @ 75°C
7.70°C/W @ 200 LFM
15.50°C/W
Black Anodized
HSS-B20-CP-01
HEATSINK TO-220 2.6W ALUMINUM
1+
$1.2264
5+
$1.1582
10+
$1.0901
Quantity
600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Clip
HSS
0.375" (9.53mm)
Board Level
TO-220
0.900" (22.86mm)
0.740" (18.79mm)
2.6W @ 75°C
6.32°C/W @ 200 LFM
28.85°C/W
Black Anodized
HSS-C2591-SMT-TR
HEAT SINK TO-263 COPPER
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Copper
-
-
HSS
0.591" (15.00mm)
Top Mount
TO-263 (D²Pak)
1.020" (25.91mm)
0.375" (9.52mm)
2.1W @ 75°C
8.15°C/W @ 200 LFM
35.71°C/W
Tin
HSS28-B20-P39
HEAT SINK, STAMPING, TO-218/TO-2
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Quantity
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PCB Symbol, Footprint & 3D Model
Square, Fins
Aluminum Alloy
-
Bolt On and PC Pin
HSS
0.748" (19.00mm)
Board Level
TO-218, TO-220
0.748" (19.00mm)
0.374" (9.50mm)
2.71W @ 75°C
12.00°C/W @ 200 LFM
27.66°C/W
Black Anodized
HSS-B20-053H-01
HEATSINK TO-220 4.8W ALUMINUM
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Bolt On and PC Pin
HSS
0.500" (12.70mm)
Board Level
TO-220
1.000" (25.40mm)
1.181" (30.00mm)
4.8W @ 75°C
5.83°C/W @ 200 LFM
15.79°C/W
Black Anodized
HSS-B20-0635H
HEATSINK TO-220 2.6W ALUMINUM
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
PC Pin
HSS
0.520" (13.20mm)
Board Level, Vertical
TO-220
0.250" (6.35mm)
0.748" (19.00mm)
2.6W @ 75°C
10.68°C/W @ 200 LFM
28.85°C/W
Black Anodized
HSS-B20-061H-03
HEATSINK TO-220 2.9W ALUMINUM
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
PC Pin
HSS
0.512" (13.00mm)
Board Level
TO-220
0.512" (13.00mm)
0.748" (19.00mm)
2.9W @ 75°C
5.72°C/W @ 200 LFM
25.86°C/W
Black Anodized
HSS-B20-NP-04
HEATSINK TO-220 6.5W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Bolt On
HSS
1.450" (36.83mm)
Board Level
TO-220
1.750" (44.45mm)
0.370" (9.40mm)
6.5W @ 75°C
3.76°C/W @ 200 LFM
11.54°C/W
Black Anodized
HSS-B20-0508H-01R
HEATSINK TO-220 4.7W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Bolt On and Board Mounts
HSS
0.500" (12.70mm)
Board Level
TO-220
1.000" (25.40mm)
1.180" (29.97mm)
4.7W @ 75°C
5.87°C/W @ 200 LFM
15.83°C/W
Black Anodized
HSS-B20-0953H-01
HEATSINK TO-220 2.3W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
PC Pin
HSS
0.500" (12.70mm)
Board Level
TO-220
0.504" (12.80mm)
0.590" (15.00mm)
2.3W @ 75°C
11.04°C/W @ 200 LFM
33.28°C/W
Black Anodized
HSS-B20-NP
HEATSINK TO-220 4W ALUMINUM
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
-
HSS
1.500" (38.10mm)
Board Level
TO-220
0.504" (12.80mm)
0.500" (12.70mm)
4.0W @ 75°C
5.01°C/W @ 200 LFM
18.63°C/W
Black Anodized
HSS14-B20-NP
HEAT SINK, STAMPING, TO-220, 19.
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Aluminum Alloy
-
-
HSS
0.980" (24.89mm)
Board Level, Vertical
TO-220
0.750" (19.05mm)
0.157" (4.00mm)
3.1W @ 75°C
11.60°C/W @ 200 LFM
23.91°C/W
Black Anodized
HSS-B20-065V
HEATSINK TO-220 4W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
PC Pin
HSS
0.500" (12.70mm)
Board Level
TO-220
0.504" (12.80mm)
1.500" (38.10mm)
4.0W @ 75°C
5.01°C/W @ 200 LFM
18.63°C/W
Black Anodized
HSS26-B20-P38
HEAT SINK, STAMPING, TO-218/TO-2
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum Alloy
-
Bolt On and PC Pin
HSS
2.000" (50.80mm)
Board Level, Vertical
TO-218, TO-220
1.378" (35.00mm)
0.335" (8.50mm)
4.5W @ 75°C
9.20°C/W @ 200 LFM
16.66°C/W
Black Anodized
HSS09-B20-P431
HEAT SINK, STAMPING, TO-220, 29.
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
Aluminum Alloy
-
Bolt On and PC Pin
HSS
1.180" (29.97mm)
Board Level, Vertical
TO-220
1.000" (25.40mm)
0.500" (12.70mm)
4.0W @ 75°C
7.70°C/W @ 200 LFM
18.82°C/W
Black Anodized
HSS27-B20-P43
HEAT SINK, STAMPING, TO-218/TO-2
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum Alloy
-
Bolt On and PC Pin
HSS
1.193" (30.30mm)
Board Level, Vertical
TO-218, TO-220
0.874" (22.20mm)
0.211" (5.35mm)
3.03W @ 75°C
13.20°C/W @ 200 LFM
24.79°C/W
Black Anodized
HSS-B20-0503H
HEATSINK TO-220 4.6W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
PC Pin
HSS
0.500" (12.70mm)
Board Level, Vertical
TO-220
1.000" (25.40mm)
1.180" (29.97mm)
4.6W @ 75°C
5.44°C/W @ 200 LFM
16.30°C/W
Black Anodized
HSS-B20-NP-12
HEATSINK TO-220 6.8W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Bolt On
HSS
1.450" (36.83mm)
Board Level
TO-220
0.700" (17.80mm)
0.850" (21.60mm)
6.8W @ 75°C
3.47°C/W @ 200 LFM
14.33°C/W
Black Anodized
HSS-B20-043H-01
HEATSINK TO-220 2.9W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Angled Fins
Aluminum
-
PC Pin
HSS
0.211" (5.35mm)
Board Level, Vertical
TO-220
0.874" (22.20mm)
1.250" (31.75mm)
2.9W @ 75°C
8.18°C/W @ 200 LFM
26.13°C/W
Black Anodized
HSS-B20-NP-11
HEATSINK TO-220 4.4W ALUMINUM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular, Fins
Aluminum
-
Bolt On
HSS
0.700" (17.78mm)
Board Level
TO-220
0.779" (19.80mm)
0.850" (21.60mm)
4.4W @ 75°C
6.86°C/W @ 200 LFM
17.05°C/W
Black Anodized

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.