XL-25 Series, Heat Sinks

Results:
44
Manufacturer
Series
Length
Width
Fin Height
Package Cooled
Attachment Method
Shape
Material
Type
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material Finish
Power Dissipation @ Temperature Rise
Diameter
Results remaining44
Applied Filters:
XL-25
Select
ImageProduct DetailPriceAvailabilityECAD ModelShapeWidthMaterialDiameterLengthSeriesTypePackage CooledFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial FinishAttachment Method
XL25W-12-12-10
CERAMIC HEAT SINK 12X12X10MM WHI
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Square
0.472" (12.00mm)
Ceramic
-
0.472" (12.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.394" (10.00mm)
-
-
-
-
Thermal Tape
XL25W-TO220-20-14-0.64
CERAMIC HEAT SPREADER 20X14MM WH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
0.551" (14.00mm)
Ceramic
-
0.787" (20.00mm)
XL-25
Heat Spreader
TO-220
0.025" (0.64mm)
-
-
-
-
Thermal Tape
XL25W-TO220-20-14-1
CERAMIC HEAT SPREADER 20X14MM WH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
0.551" (14.00mm)
Ceramic
-
0.787" (20.00mm)
XL-25
Heat Spreader
TO-220
0.039" (1.00mm)
-
-
-
-
Thermal Tape
XL25W-TO264-28-22-0.64
CERAMIC HEAT SPREADER 28X22MM WH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
0.866" (22.00mm)
Ceramic
-
1.102" (28.00mm)
XL-25
Heat Spreader
TO-264
0.025" (0.64mm)
-
-
-
-
Thermal Tape
XL25-10-10-2.0
XL25 CERAMIC BOARD 10X10X2MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.394" (10.00mm)
Ceramic
-
0.394" (10.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.079" (2.00mm)
-
-
-
-
-
XL25-40-40-2.0
XL25 CERAMIC BOARD 40X40X2MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.575" (40.00mm)
Ceramic
-
1.575" (40.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.079" (2.00mm)
-
-
-
-
-
XL25-30-30-2.0
XL25 CERAMIC BOARD 30X30X2MM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.181" (30.00mm)
Ceramic
-
1.181" (30.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.079" (2.00mm)
-
-
-
-
-
XLI98-10-10-2.25
XL25 CERAMIC 10X10MM W/LI98C ADH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.394" (10.00mm)
Ceramic
-
0.394" (10.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.089" (2.25mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XLI98-20-20-2.25
XL25 CERAMIC 20X20MM W/LI98C ADH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.787" (20.00mm)
Ceramic
-
0.787" (20.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.089" (2.25mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XLI98C-20-20-2.15
XL25 CERAMIC 20X20MM W/LI98C ADH
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.787" (20.00mm)
Ceramic
-
0.787" (20.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.085" (2.15mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XLI98C-30-30-2.15
XL25 CERAMIC 30X30MM W/LI98C ADH
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.181" (30.00mm)
Ceramic
-
1.181" (30.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.085" (2.15mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XLI98C-10-10-2.15
XL25 CERAMIC 10X10MM W/LI98C ADH
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.394" (10.00mm)
Ceramic
-
0.394" (10.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.085" (2.15mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XL25D-TO264-28-22-0.64
CERAMIC HEAT SPREADER 28X22X0.63
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
0.866" (22.00mm)
Ceramic
-
1.102" (28.00mm)
XL-25
Heat Spreader
TO-264
0.025" (0.64mm)
-
-
-
-
Thermal Tape
XL25W-TO247-22-17-0.64
CERAMIC HEAT SPREADER 22X17MM WH
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Rectangular
0.669" (17.00mm)
Ceramic
-
0.866" (22.00mm)
XL-25
Heat Spreader
TO-247
0.025" (0.64mm)
-
-
-
-
Thermal Tape
XL25-30-30-5
CERAMIC HEAT SPREADER 30X30MM GR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.181" (30.00mm)
Ceramic
-
1.181" (30.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.197" (5.00mm)
-
-
-
-
-
XL25-40-40-5
CERAMIC HEAT SPREADER 40X40MM GR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.575" (40.00mm)
Ceramic
-
1.575" (40.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.197" (5.00mm)
-
-
-
-
-
XL25-40-40-10
CERAMIC HEAT SPREADER 40X40MM GR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.575" (40.00mm)
Ceramic
-
1.575" (40.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.394" (10.00mm)
-
-
-
-
-
XL25-35-35-10-T1-0.25
CERAMIC HEAT SPREADER 35X35MM GR
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.378" (35.00mm)
Ceramic
-
1.378" (35.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.394" (10.00mm)
-
-
-
-
Thermal Tape, Adhesive (Included)
XL25-35-35-10
CERAMIC HEAT SPREADER 35X35MM GR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
1.378" (35.00mm)
Ceramic
-
1.378" (35.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.394" (10.00mm)
-
-
-
-
-
XL25B-10-10-3
XL25 CERAMIC W/BUMPS 10X10X2MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Square
0.394" (10.00mm)
Ceramic
-
0.394" (10.00mm)
XL-25
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
0.118" (3.00mm)
-
-
-
-
-

About  Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.