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Manufacturer:
CUI DevicesDescription:
HEAT SINK, BGA, 23 X 23 X 6 MM
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TYPE | DESCRIPTION |
---|---|
Manufacturer | CUI Devices |
Series | HSB |
Material | Aluminum Alloy |
Length | 0.906" (23.00mm) |
Shape | Square, Pin Fins |
Type | Top Mount |
Width | 0.906" (23.00mm) |
Package Cooled | BGA |
Attachment Method | Adhesive |
Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
Thermal Resistance @ Natural | 25.46°C/W |
Fin Height | 0.236" (6.00mm) |
Material Finish | Black Anodized |
HSB10-232306 - From Manufacturer: CUI Devices, it is an HEAT SINK, BGA, 23 X 23 X 6 MM, part of Fans, Thermal Management, Thermal, Heat Sinks. HSB10-232306 stock status: need to confirm with us, contact us! Quick Reply.