Nexperia's introduces the LFPAK56D, a groundbreaking solution that accommodates two MOSFETs within a single, robust package while maintaining outstanding performance. This innovative design allows for increased power density within the compact Power-SO8 footprint.
The LFPAK56D leverages Nexperia’s advanced copper clip technology, enabling exceptional current handling, ultra-low package resistance, and unparalleled robustness and reliability. These features make it an ideal choice for applications where space constraints are critical, and high power performance is essential.
This product is well-suited for automotive (AEC-Q101) and industrial applications, meeting stringent standards for reliability and durability. Whether in automotive systems or industrial settings, the LFPAK56D delivers superior performance and space-saving benefits, making it a valuable solution for various power management requirements.
Copper clip for low package inductance and resistance
High ID max rating up to 40 A per channel
Flexible leads for improved reliability
Exposed leads allow for easy optical inspection
Separate drain connections
High current transient robustness
Logic and standard level
Battery protection
Brushed motor drives
BLDC motor drives
DC/DC power supplies
Load switching
Automation
Fan drives
Printers
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