XPT™, GenX3™ Series, Single IGBTs

Results:
37
Manufacturer
Series
Current - Collector (Ic) (Max)
Switching Energy
Current - Collector Pulsed (Icm)
Td (on/off) @ 25°C
Vce(on) (Max) @ Vge, Ic
Gate Charge
Reverse Recovery Time (trr)
Power - Max
Test Condition
Supplier Device Package
Package / Case
Mounting Type
Voltage - Collector Emitter Breakdown (Max)
Operating Temperature
IGBT Type
Input Type
Grade
Qualification
Results remaining37
Applied Filters:
XPT™, GenX3™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePackage / CaseSupplier Device PackageIGBT TypeOperating TemperatureGradeCurrent - Collector (Ic) (Max)Voltage - Collector Emitter Breakdown (Max)Reverse Recovery Time (trr)SeriesCurrent - Collector Pulsed (Icm)Vce(on) (Max) @ Vge, IcPower - MaxSwitching EnergyInput TypeGate ChargeTd (on/off) @ 25°CTest ConditionQualification
IXYP10N65C3D1M
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-220-3 Full Pack, Isolated Tab
TO-220 Isolated Tab
-
-55°C ~ 175°C (TJ)
-
15 A
650 V
26 ns
XPT™, GenX3™
50 A
2.6V @ 15V, 10A
53 W
240µJ (on), 170µJ (off)
Standard
18 nC
20ns/77ns
400V, 10A, 50Ohm, 15V
-
IXYA20N65C3
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263AA
-
-55°C ~ 175°C (TJ)
-
20 A
650 V
34 ns
XPT™, GenX3™
105 A
2.5V @ 15V, 20A
230 W
430µJ (on), 650µJ (off)
Standard
30 nC
19ns/80ns
400V, 20A, 20Ohm, 15V
-
IXYP10N65B3D1
DISC IGBT XPT-GENX3 TO-220AB/FP
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-220-3
TO-220
PT
-55°C ~ 175°C (TJ)
-
32 A
650 V
29 ns
XPT™, GenX3™
62 A
1.95V @ 15V, 10A
160 W
300µJ (on), 200µJ (off)
Standard
20 nC
17ns/125ns
400V, 10A, 50Ohm, 15V
-
IXYP20N65B3D1
DISC IGBT XPT-GENX3 TO-220AB/FP
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-220-3
TO-220
PT
-55°C ~ 175°C (TJ)
-
58 A
650 V
25 ns
XPT™, GenX3™
108 A
2.1V @ 15V, 20A
230 W
500µJ (on), 450µJ (off)
Standard
29 nC
12ns/103ns
400V, 20A, 20Ohm, 15V
-
IXXH30N60C3
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247AD
-
-55°C ~ 175°C (TJ)
-
60 A
600 V
33 ns
XPT™, GenX3™
110 A
2.4V @ 15V, 24A
270 W
500µJ (on), 270µJ (off)
Standard
37 nC
23ns/77ns
400V, 24A, 10Ohm, 15V
-
IXXQ30N60B3M
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-3P-3, SC-65-3
TO-3P
-
-55°C ~ 175°C (TJ)
-
33 A
600 V
36 ns
XPT™, GenX3™
140 A
1.85V @ 15V, 24A
90 W
550µJ (on), 800µJ (off)
Standard
39 nC
23ns/150ns
400V, 24A, 10Ohm, 15V
-
IXXA30N65C3HV
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263HV
-
-55°C ~ 175°C (TJ)
-
52 A
650 V
33 ns
XPT™, GenX3™
113 A
2.2V @ 15V, 24A
230 W
500µJ (on), 450µJ (off)
Standard
37 nC
33ns/125ns
400V, 24A, 10Ohm, 15V
-
IXXX200N60B3
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3 Variant
PLUS247™-3
-
-55°C ~ 175°C (TJ)
-
380 A
600 V
100 ns
XPT™, GenX3™
900 A
1.7V @ 15V, 100A
1630 W
2.85mJ (on), 4.4mJ (off)
Standard
315 nC
48ns/160ns
360V, 100A, 1Ohm, 15V
-
IXYH20N65B3
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247AD
PT
-55°C ~ 175°C (TJ)
-
58 A
650 V
25 ns
XPT™, GenX3™
108 A
2.1V @ 15V, 20A
230 W
500µJ (on), 450µJ (off)
Standard
29 nC
12ns/103ns
400V, 20A, 20Ohm, 15V
-
IXYH40N65B3D1
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXTH)
-
-55°C ~ 175°C (TJ)
-
86 A
650 V
37 ns
XPT™, GenX3™
195 A
2V @ 15V, 40A
300 W
800µJ (on), 1.25mJ (off)
Standard
68 nC
20ns/140ns
400V, 30A, 10Ohm, 15V
-
IXYH20N65C3D1
DISC IGBT XPT-GENX4 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXYH)
PT
-55°C ~ 175°C (TJ)
-
50 A
650 V
34 ns
XPT™, GenX3™
105 A
2.5V @ 15V, 20A
230 W
430µJ (on), 350µJ (off)
Standard
30 nC
19ns/80ns
400V, 20A, 20Ohm, 15V
-
IXXA50N60B3
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263AA
-
-55°C ~ 175°C (TJ)
-
120 A
600 V
40 ns
XPT™, GenX3™
200 A
1.8V @ 15V, 36A
600 W
670µJ (on), 1.2mJ (off)
Standard
70 nC
27ns/150ns
360V, 36A, 5Ohm, 15V
-
IXYH30N65B3D1
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXYH)
PT
-55°C ~ 175°C (TJ)
-
70 A
650 V
38 ns
XPT™, GenX3™
160 A
2.1V @ 15V, 30A
270 W
830µJ (on), 640µJ (off)
Standard
45 nC
17ns/87ns
400V, 30A, 10Ohm, 15V
-
IXXH75N60B3
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247AD (IXXH)
PT
-55°C ~ 175°C (TJ)
-
160 A
600 V
75 ns
XPT™, GenX3™
300 A
1.85V @ 15V, 60A
750 W
1.7mJ (on), 1.5mJ (off)
Standard
107 nC
35ns/118ns
400V, 60A, 5Ohm, 15V
-
IXYA20N120C3HV
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263HV
-
-55°C ~ 175°C (TJ)
-
40 A
1200 V
29 ns
XPT™, GenX3™
96 A
3.4V @ 15V, 20A
278 W
1.3mJ (on), 1mJ (off)
Standard
53 nC
20ns/90ns
600V, 20A, 10Ohm, 15V
-
IXYH50N65C3D1
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXTH)
-
-55°C ~ 175°C (TJ)
-
132 A
650 V
36 ns
XPT™, GenX3™
250 A
2.1V @ 15V, 36A
600 W
800µJ (on), 800µJ (off)
Standard
86 nC
20ns/90ns
400V, 36A, 5Ohm, 15V
-
IXXP50N60B3
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-220-3
TO-220-3
-
-55°C ~ 175°C (TJ)
-
120 A
600 V
40 ns
XPT™, GenX3™
200 A
1.8V @ 15V, 36A
600 W
670µJ (on), 1.2mJ (off)
Standard
70 nC
27ns/150ns
360V, 36A, 5Ohm, 15V
-
IXYT20N120C3D1HV
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
TO-268HV (IXYT)
-
-55°C ~ 150°C (TJ)
-
36 A
1200 V
29 ns
XPT™, GenX3™
88 A
3.4V @ 15V, 20A
230 W
1.3mJ (on), 1mJ (off)
Standard
53 nC
20ns/90ns
600V, 20A, 10Ohm, 15V
-
IXYH75N65C3D1
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXYH)
PT
-55°C ~ 175°C (TJ)
-
175 A
650 V
65 ns
XPT™, GenX3™
360 A
2.3V @ 15V, 60A
750 W
2mJ (on), 950µJ (off)
Standard
122 nC
26ns/93ns
400V, 60A, 3Ohm, 15V
-
IXYH120N65C3
DISC IGBT XPT-GENX3 TO-247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
TO-247-3
TO-247 (IXYH)
PT
-55°C ~ 175°C (TJ)
-
260 A
650 V
29 ns
XPT™, GenX3™
620 A
2.8V @ 15V, 100A
1360 W
1.25mJ (on), 500µJ (off)
Standard
265 nC
28ns/127ns
400V, 50A, 2Ohm, 15V
-

About  Single IGBTs

Single Insulated-Gate Bipolar Transistors (IGBTs) are sophisticated semiconductor devices composed of multiple layers and equipped with three terminals. These devices are specifically designed to handle high currents and offer rapid switching capabilities. They are highly valued in a wide range of applications. The performance and characteristics of single IGBTs are defined by several key parameters. These parameters include the device type, collector-emitter breakdown voltage, collector current rating, pulsed collector current rating, VCE(ON), switching energy, and gate charge. The device type refers to the specific model or variant of the IGBT. Different models may possess distinct features and characteristics tailored to meet the requirements of different applications. The collector-emitter breakdown voltage represents the maximum voltage that the device can withstand across its collector and emitter terminals without experiencing a breakdown or failure. The collector current rating indicates the maximum continuous current that the IGBT can handle while maintaining proper functionality. The pulsed collector current rating specifies the maximum current that the IGBT can endure for short durations, typically in pulsed or transient conditions. VCE(ON) signifies the voltage drop across the collector-emitter junction when the IGBT is fully turned on and conducting current. This parameter is crucial for power loss calculations and efficiency analysis. Switching energy refers to the amount of energy dissipated during the switching process of the IGBT. Minimizing switching energy is vital for reducing power losses and enhancing overall efficiency. Lastly, gate charge denotes the amount of charge required to turn the IGBT on or off. Gate charge influences the switching speed and control characteristics of the device. By considering these parameters, engineers and designers can carefully select the most suitable single IGBT that aligns with the specific requirements of their application, ensuring optimal performance and reliability.