Amphenol Communications Solutions

Amphenol Communications Solutions

Amphenol Communications Solutions is a leading provider of advanced communication infrastructure solutions for various industries, including telecom, broadband, and wireless networks. The company offers a wide range of products and services that are designed to meet the specific needs of its customers, including fiber optic connectors, cable assemblies, antennas, and RF components. With a strong commitment to innovation and customer service, Amphenol Communications Solutions is renowned for its ability to deliver high-quality connectivity solutions that enable seamless data transmission and network performance. The company's comprehensive engineering support and customization capabilities allow for the creation of tailored solutions that align with the unique requirements of clients, ensuring optimal results. Additionally, Amphenol Communications Solutions places great importance on quality and safety, upholding strict manufacturing standards and adhering to international regulations. With a global presence and a vast distribution network, the company provides exceptional technical support and prompt service to customers worldwide. As communication technology continues to evolve, Amphenol Communications Solutions remains at the forefront, driving innovation and delivering cutting-edge solutions that enable businesses to stay connected and thrive in today's digital landscape.

IC Sockets

Results:
324
Series
Number of Positions or Pins (Grid)
Housing Material
Contact Finish Thickness - Mating
Type
Contact Finish - Mating
Operating Temperature
Contact Material - Post
Contact Finish Thickness - Post
Contact Material - Mating
Mounting Type
Pitch - Post
Contact Finish - Post
Pitch - Mating
Features
Termination
Results remaining324
Applied Filters:
Amphenol Communications Solutions
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ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostOperating TemperatureNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
DILB18P-223TLF
CONN IC DIP SOCKET 18POS TINLEAD
1+
$0.4873
5+
$0.4602
10+
$0.4331
Quantity
45,240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
18 (2 x 9)
Polyamide (PA), Nylon
DILB
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB16P-223TLF
1+
$0.2282
5+
$0.2155
10+
$0.2028
Quantity
286 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
16 (2 x 8)
Polyamide (PA), Nylon
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB14P-223TLF
1+
$0.4056
5+
$0.3831
10+
$0.3606
Quantity
184 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
14 (2 x 7)
Polyamide (PA), Nylon
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB40P-223TLF
1+
$0.8620
5+
$0.8141
10+
$0.7662
Quantity
74 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
40 (2 x 20)
Polyamide (PA), Nylon
-
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB24P-223TLF
CONN IC DIP SOCKET 24POS TINLEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-55°C ~ 125°C
24 (2 x 12)
Polyamide (PA), Nylon
DILB
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
69802-144LF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
-55°C ~ 125°C
44 (4 x 11)
Polyphenylene Sulfide (PPS)
-
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
54020-44030LF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
44 (4 x 11)
Polyphenylene Sulfide (PPS)
-
PLCC
100.0µin (2.54µm)
Copper Alloy
Closed Frame
100.0µin (2.54µm)
Copper Alloy
69802-444LF
CONN SOCKET PLCC 44POS TINLEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.050" (1.27mm)
Tin-Lead
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-55°C ~ 125°C
44 (4 x 11)
Polyphenylene Sulfide (PPS), Glass Filled
69802
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Open Frame
150.0µin (3.81µm)
Phosphor Bronze
DILB28P-223TLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
28 (2 x 14)
Polyamide (PA), Nylon
-
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
DILB20P-223TLF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
20 (2 x 10)
Polyamide (PA), Nylon
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
SIP1X07-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
7 (1 x 7)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SPF080-1X08-998Z
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
-
-
-
-
8 (1 x 8)
-
SPF080-1x
SIP
200.0µin (5.08µm)
-
Closed Frame
-
-
SPF080-1X04-998Z
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
-
-
-
-
4 (1 x 4)
-
SIP
200.0µin (5.08µm)
-
Closed Frame
-
-
SPF080-1X10-998Z
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin-Lead
Through Hole
-
-
-
-
10 (1 x 10)
-
SIP
200.0µin (5.08µm)
-
Closed Frame
-
-
69802-184LF
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
*
-
-
-
-
-
-
DILB8P-223TLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-55°C ~ 105°C
8 (2 x 4)
Polyamide (PA), Nylon
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Copper Alloy
Open Frame
100.0µin (2.54µm)
Copper Alloy
SIP1X15-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
DIP624-011BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-
24 (2 x 12)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
SIP1X04-014BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
4 (1 x 4)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X06-011BLF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
-
6 (1 x 6)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.