SMD Comm C0G Flex Series, Ceramic Capacitors

Results:
229
Manufacturer
Series
Capacitance
Thickness (Max)
Tolerance
Size / Dimension
Voltage - Rated
Package / Case
Operating Temperature
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Temperature Coefficient
Ratings
Features
Failure Rate
Lead Style
Results remaining229
Applied Filters:
SMD Comm C0G Flex
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ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)ToleranceOperating TemperatureRatingsPackage / CaseVoltage - RatedCapacitanceTemperature CoefficientMounting TypeApplicationsFeaturesLead StyleFailure RateSeriesThickness (Max)Lead SpacingSize / Dimension
C1206X223KAGAC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
-55°C ~ 125°C
-
1206 (3216 Metric)
250V
0.022 µF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.071" (1.80mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C0805X472F3GAC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±1%
-55°C ~ 125°C
-
0805 (2012 Metric)
25V
4700 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.047" (1.20mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C0805X471F1GAC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±1%
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
470 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.039" (0.98mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C0805X473J3GAC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0805 (2012 Metric)
25V
0.047 µF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.055" (1.40mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C1206X221J2GAC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1206 (3216 Metric)
200V
220 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.039" (0.98mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C2220X474J5GAC7800
CAP CER 0.47UF 50V C0G/NP0 2220
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
2220 (5750 Metric)
50V
0.47 µF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.073" (1.85mm)
-
0.232" L x 0.197" W (5.90mm x 5.00mm)
C1206X472J5GAC7800
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1206 (3216 Metric)
50V
4700 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.043" (1.10mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C0603X121J5GAC7867
CAP CER 120PF 50V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
120 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.034" (0.87mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0603X101F2GAC7867
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±1%
-55°C ~ 125°C
-
0603 (1608 Metric)
200V
100 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.037" (0.95mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0603X270J5GAC7867
CAP CER 27PF 50V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
27 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.034" (0.87mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0603X200J5GAC7867
CAP CER 20PF 50V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
20 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.037" (0.95mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0805X223F5GAC7800
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±1%
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
0.022 µF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.047" (1.20mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C1206X331J5GAC7800
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1206 (3216 Metric)
50V
330 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.039" (0.98mm)
-
0.130" L x 0.063" W (3.30mm x 1.60mm)
C1812X104J2GAC7800
CAP CER 0.1UF 200V NP0 1812
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
1812 (4532 Metric)
200V
0.1 µF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.087" (2.20mm)
-
0.177" L x 0.126" W (4.50mm x 3.20mm)
C0603X100J1GAC7867
CAP CER 10PF 100V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
10 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.037" (0.95mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0603X160J5GAC7867
CAP CER 16PF 50V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
16 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.037" (0.95mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0603X339B5GAC7867
CAP CER 3.3PF 50V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±0.1pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
3.3 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.037" (0.95mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0805X222J5GAC7800
CAP CER 2200PF 50V C0G/NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
2200 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.035" (0.88mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
C0603X680J5GAC7867
CAP CER 68PF 50V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
68 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.034" (0.87mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)
C0805X470J2GAC7800
CAP CER 47PF 200V NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±5%
-55°C ~ 125°C
-
0805 (2012 Metric)
200V
47 pF
C0G, NP0
Surface Mount, MLCC
Boardflex Sensitive
Low ESL, Soft Termination
-
-
SMD Comm C0G Flex
0.039" (0.98mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.