KPS-MCC Indust C0G HT200C Series, Ceramic Capacitors

Results:
10
Manufacturer
Series
Capacitance
Voltage - Rated
Height - Seated (Max)
Lead Spacing
Size / Dimension
Package / Case
Operating Temperature
Applications
Tolerance
Mounting Type
Temperature Coefficient
Ratings
Thickness (Max)
Features
Failure Rate
Lead Style
Results remaining10
Applied Filters:
KPS-MCC Indust C0G HT200C
Select
ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperatureToleranceRatingsVoltage - RatedTemperature CoefficientSize / DimensionApplicationsFailure RateSeriesCapacitanceFeaturesPackage / CaseHeight - Seated (Max)Thickness (Max)Lead SpacingLead Style
L1GN40D274KA05
CAP CER 0.27UF 1KV C0G/NP0 8LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
1000V (1kV)
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.27 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.600" (15.24mm)
-
0.400" (10.16mm)
Straight
L1GN50G253KA05
CAP CER 0.025UF 2KV C0G 6 LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
2000V (2kV)
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.025 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.600" (15.24mm)
-
0.250" (6.35mm)
Straight
L1GN50B563KA02
CAP CER 0.056UF 630V C0G 6 LEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
630V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.056 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.280" (7.11mm)
-
0.250" (6.35mm)
Straight
L1GN501604KA02
CAP CER 0.6UF 100V C0G/NP0 6LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
100V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.6 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.280" (7.11mm)
-
0.250" (6.35mm)
Straight
L1GN40C474KA04
CAP CER 0.47UF 500V C0G 8 LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
500V
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.47 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.490" (12.45mm)
-
0.400" (10.16mm)
Straight
L1GN501155KA05
CAP CER 1.5UF 100V C0G/NP0 6LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
100V
C0G, NP0
0.250" L x 0.300" W (6.35mm x 7.62mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
1.5 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 6 Lead
0.600" (15.24mm)
-
0.250" (6.35mm)
Straight
L1GN402105KA03
CAP CER 1UF 200V C0G/NP0 8 LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
200V
C0G, NP0
0.400" L x 0.440" W (10.16mm x 11.18mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
1 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 8 Lead
0.390" (9.91mm)
-
0.400" (10.16mm)
Straight
L1GN30G204KA10
CAP CER 0.2UF 2KV C0G/NP0 20LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
2000V (2kV)
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.2 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.600" (15.24mm)
-
0.450" (11.43mm)
Straight
L1GN30D334KA04
CAP CER 0.33UF 1KV C0G 20 LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
1000V (1kV)
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
0.33 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.280" (7.11mm)
-
0.450" (11.43mm)
Straight
L1GN30C205KA10
CAP CER 2UF 500V C0G/NP0 20 LEAD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 200°C
±10%
-
500V
C0G, NP0
1.009" L x 0.500" W (25.64mm x 12.70mm)
SMPS Filtering
-
KPS-MCC Indust C0G HT200C
2 µF
Low ESL (Stacked), High Temperature
Stacked DIP, 20 Lead
0.600" (15.24mm)
-
0.450" (11.43mm)
Straight

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.