IDC, W Series, Ceramic Capacitors

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117
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IDC, W
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesHeight - Seated (Max)ToleranceOperating TemperatureRatingsCapacitanceVoltage - RatedTemperature CoefficientMounting TypeApplicationsLead StyleFailure RateFeaturesPackage / CaseSize / DimensionThickness (Max)Lead Spacing
W2L14C334MAT1A
CAP CER 0.33UF 4V X7R 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.33 µF
4V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W2L14Z105MAT1S
CAP CER 1UF 4V X7S 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
1 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.022" (0.55mm)
-
W2L1ZC104MAT1S
CAP CER 0.1UF 10V X7R 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.1 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.022" (0.55mm)
-
W2L16C684KAT3S
CAP CER 0.68UF 6.3V X7R 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±10%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.022" (0.55mm)
-
W3L1YD474MAT1A
CAP CER 0.47UF 16V X5R 0612
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 85°C
-
0.47 µF
16V
X5R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W2L16C105MAT1A
CAP CER 1UF 6.3V X7R 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
1 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W2L14D225MAT1A
CAP CER 2.2UF 4V X5R 0508
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 85°C
-
2.2 µF
4V
X5R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W3L1ZC105MAT1A
CAP CER 1UF 10V X7R 0612
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
1 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W2L1ZD105MAT1A
CAP CER 1UF 10V X5R 0508
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 85°C
-
1 µF
10V
X5R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W3L1ZC105KAT1A
CAP CER 1UF 10V X7R 0612
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±10%
-55°C ~ 125°C
-
1 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W3L13C473MAT1A
CAP CER 0.047UF 25V X7R 0612
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Quantity
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PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.047 µF
25V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W3L16C473MAT1A
CAP CER 0.047UF 6.3V X7R 0612
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.047 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W3L1YC473MAT1A
CAP CER 0.047UF 16V X7R 0612
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.047 µF
16V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W2L14D155MAT1A
CAP CER 1.5UF 4V X5R 0508
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 85°C
-
1.5 µF
4V
X5R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W3L1ZC105MAT3A
CAP CER 1UF 10V X7R 0612
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
1 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W2L16C684KAT1A
CAP CER 0.68UF 6.3V X7R 0508
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±10%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W2L16C684MAT1A
CAP CER 0.68UF 6.3V X7R 0508
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
0.68 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W2L1YC104KAT1A
CAP CER 0.1UF 16V X7R 0508
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±10%
-55°C ~ 125°C
-
0.1 µF
16V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0508 (1220 Metric)
0.050" L x 0.080" W (1.27mm x 2.03mm)
0.037" (0.95mm)
-
W3L1ZD225MAT1A
CAP CER 2.2UF 10V X5R 0612
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 85°C
-
2.2 µF
10V
X5R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-
W3L16C155MAT1A
CAP CER 1.5UF 6.3V X7R 0612
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
IDC, W
-
±20%
-55°C ~ 125°C
-
1.5 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
Low ESL (Multi-Terminal)
0612 (1632 Metric)
0.063" L x 0.126" W (1.60mm x 3.20mm)
0.037" (0.95mm)
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.