GoldMax 300 Comm X7R Series, Ceramic Capacitors

Results:
1,245
Manufacturer
Series
Capacitance
Height - Seated (Max)
Size / Dimension
Voltage - Rated
Lead Spacing
Tolerance
Thickness (Max)
Lead Style
Applications
Operating Temperature
Temperature Coefficient
Mounting Type
Ratings
Package / Case
Failure Rate
Features
Results remaining1,245
Applied Filters:
GoldMax 300 Comm X7R
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesMounting TypeHeight - Seated (Max)ToleranceCapacitanceOperating TemperaturePackage / CaseRatingsVoltage - RatedTemperature CoefficientApplicationsFailure RateSeriesSize / DimensionThickness (Max)Lead SpacingLead Style
C322C104M5R5CA7305
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±20%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C330C684K5R5CA7303
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.68 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C104K1R5CA7317
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C333C104K1R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C320C224K5R5TA7318
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.22 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C321C104K1R5CA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.250" (6.35mm)
Formed Leads
C333C474K5R5CA7317
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C330C334K5R5CA7303
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C474K5R5TA7318
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C330C474K5R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±10%
0.47 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C333C334M5R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked
C320C104M5R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±20%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C320C104K1R5CA7303
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C322C104K1R5TA7318
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K1R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
100V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C330C334M5R5CA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.360" (9.14mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K5R5CA7305
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C322C104K5R5CA7301
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.260" (6.60mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.200" (5.08mm)
Formed Leads
C320C104K5R5CA7303
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.290" (7.36mm)
±10%
0.1 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.200" L x 0.125" W (5.08mm x 3.18mm)
-
0.100" (2.54mm)
Straight
C333C334M5R5TA7318
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Through Hole
0.400" (10.16mm)
±20%
0.33 µF
-55°C ~ 125°C
Radial
-
50V
X7R
Bypass, Decoupling
-
GoldMax 300 Comm X7R
0.280" L x 0.160" W (7.11mm x 4.07mm)
-
0.200" (5.08mm)
Formed Leads - Kinked

Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.