Border Cap® Series, Ceramic Capacitors

Results:
45
Manufacturer
Series
Capacitance
Temperature Coefficient
Size / Dimension
Tolerance
Voltage - Rated
Features
Applications
Package / Case
Operating Temperature
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Thickness (Max)
Failure Rate
Lead Style
Results remaining45
Applied Filters:
Border Cap®
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ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)ToleranceCapacitanceOperating TemperatureRatingsVoltage - RatedPackage / CaseSize / DimensionMounting TypeLead StyleFailure RateSeriesTemperature CoefficientFeaturesApplicationsThickness (Max)Lead Spacing
D10UX101M2BX
CAP CER 100PF 25V UX SMD
1+
¥3.8890
5+
¥3.6730
10+
¥3.4569
Quantity
2,500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
25V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
UX
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D12BV101K1BX
CAP CER 100PF 100V BV SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.012" L x 0.012" W (0.31mm x 0.31mm)
Surface Mount, SLCC
-
-
Border Cap®
BV
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BD100M1BX
CAP CER 10PF 100V BD SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BD
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BJ101K1BX
CAP CER 100PF 100V BG SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BG
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D25BN101M1BX
CAP CER 100PF 100V BN SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.025" L x 0.025" W (0.64mm x 0.64mm)
Surface Mount, SLCC
-
-
Border Cap®
BN
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10BL100M1BX
CAP CER 10PF 100V BL SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
BL
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30NS100M1BX
CAP CER 10PF 100V NS SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
NS
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30BJ101M1BX
CAP CER 100PF 100V BJ SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
100 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30UX102MCBX
CAP CER 1000PF 16V UX SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
1000 pF
-55°C ~ 125°C
-
16V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
UX
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BD100M1BX
CAP CER 10PF 100V BD SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
100V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BD
Bonding Mountable, Single Layer
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10BJ100K5PX
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
10 pF
-55°C ~ 125°C
-
50V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BN820K1BX
CAP CER 82PF 100V BN 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
82 pF
-55°C ~ 125°C
-
100V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BN
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D10BL9R1K1BX
CAP CER 9.1PF 100V BL SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
9.1 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.010" L x 0.010" W (0.25mm x 0.25mm)
Surface Mount, SLCC
-
-
Border Cap®
BL
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D35BV621K1BX
CAP CER 620PF 100V BV SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
620 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.035" L x 0.035" W (0.89mm x 0.89mm)
Surface Mount, SLCC
-
-
Border Cap®
BV
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BE150K5EX
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
15 pF
-55°C ~ 125°C
-
50V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BE
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D30UX102M2BX
CAP CER 1000PF 25V UX SMD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
1000 pF
-55°C ~ 125°C
-
25V
Nonstandard SMD
0.030" L x 0.030" W (0.76mm x 0.76mm)
Surface Mount, SLCC
-
-
Border Cap®
UX
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D50BV102M1BX
CAP CER 1000PF 100V BV SMD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
1000 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.050" L x 0.050" W (1.27mm x 1.27mm)
Surface Mount, SLCC
-
-
Border Cap®
BV
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D15CFR08A1BX
CAP CER 0.08PF 100V CF SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±0.05pF
0.08 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.015" L x 0.015" W (0.38mm x 0.38mm)
Surface Mount, SLCC
-
-
Border Cap®
CF
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D15PGR08A1BX
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±0.05pF
0.08 pF
-55°C ~ 125°C
-
100V
Nonstandard SMD
0.015" L x 0.015" W (0.38mm x 0.38mm)
Surface Mount, SLCC
-
-
Border Cap®
PG
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-
D20BJ500K5BX
CAP CER 50PF 50V BJ 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
50 pF
-55°C ~ 125°C
-
50V
0202 (0505 Metric)
0.020" L x 0.020" W (0.51mm x 0.51mm)
Surface Mount, SLCC
-
-
Border Cap®
BJ
Bonding Mountable
RF, Microwave, High Frequency, Bypass, Decoupling
0.009" (0.22mm)
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.