H Series, Ceramic Capacitors

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ImageProduct DetailPriceAvailabilityECAD ModelSeriesFeaturesMounting TypeHeight - Seated (Max)ApplicationsPackage / CaseToleranceOperating TemperatureRatingsVoltage - RatedTemperature CoefficientSize / DimensionLead StyleFailure RateThickness (Max)Lead Spacing
HTEBG154MB
Radial Leaded, 1000V, X7R, 15000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HWGBG104KB
Radial Leaded, 2000V, X7R, 10000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
2000V (2kV)
X7R
-
-
-
-
-
HTFBG274KB
Radial Leaded, 1000V, X7R, 27000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HTCBG273KB
Radial Leaded, 1000V, X7R, 27000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HTEBG823KB
Radial Leaded, 1000V, X7R, 82000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HTFNPO473KB
Radial Leaded, 1000V, NP0, 47000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
1000V (1kV)
NP0
-
-
-
-
-
HSFX7R335MB
Radial Leaded, 500V, X7R, 330000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
500V
X7R
-
-
-
-
-
HTBBG153MB150
Radial Leaded, 1000V, X7R, 15000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HTEBG394MB
Radial Leaded, 1000V, X7R, 39000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HWGBG334KB
Radial Leaded, 2000V, X7R, 33000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
2000V (2kV)
X7R
-
-
-
-
-
HWDBG183MB
Radial Leaded, 2000V, X7R, 18000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
2000V (2kV)
X7R
-
-
-
-
-
HSGX7R575MB
Radial Leaded, 500V, X7R, 570000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
500V
X7R
-
-
-
-
-
HTDBG104MB
Radial Leaded, 1000V, X7R, 10000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HTABY101JB
Radial Leaded, 1000V, X7R, 100 p
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±5%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HXCBG103MB
Radial Leaded, 3000V, X7R, 10000
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
3000V (3kV)
X7R
-
-
-
-
-
0603H101N2R7BCT
CAP CER 2.7PF 100V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
H
High Q, Low Loss, Ultra Low ESR
Surface Mount, MLCC
-
RF, Microwave, High Frequency
0603 (1608 Metric)
±0.1pF
-55°C ~ 125°C
-
100V
C0G, NP0
0.063" L x 0.031" W (1.60mm x 0.80mm)
-
-
0.034" (0.87mm)
-
0603H500N750GCT
CAP CER 75PF 50V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
H
High Q, Low Loss, Ultra Low ESR
Surface Mount, MLCC
-
RF, Microwave, High Frequency
0603 (1608 Metric)
±2%
-55°C ~ 125°C
-
50V
C0G, NP0
0.063" L x 0.031" W (1.60mm x 0.80mm)
-
-
0.034" (0.87mm)
-
0402H101N101FCT
CAP CER 100PF 100V C0G/NP0 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
H
High Q, Low Loss, Ultra Low ESR
Surface Mount, MLCC
-
RF, Microwave, High Frequency
0402 (1005 Metric)
±1%
-55°C ~ 125°C
-
100V
C0G, NP0
0.039" L x 0.020" W (1.00mm x 0.50mm)
-
-
0.022" (0.55mm)
-
HTABG272MB
Radial Leaded, 1000V, X7R, 2700
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±20%
-55°C ~ 125°C
-
1000V (1kV)
X7R
-
-
-
-
-
HXENPO472KB
Radial Leaded, 3000V, NP0, 4700
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Quantity
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PCB Symbol, Footprint & 3D Model
H
-
Through Hole
-
-
-
±10%
-55°C ~ 125°C
-
3000V (3kV)
NP0
-
-
-
-
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.