MG Chemicals’ heatsink paste features a soft consistency which allows for easy compression to achieve thin bond lines, minimizing thermal resistance.
MG Chemicals' 8618 silicone-free thermal grease is a heatsink paste with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure that the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump-out common with other pastes. The 8618 has a wide operating temperature range, making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied, circuits can be powered up immediately offering exceptional convenience. The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance.
This thermal paste is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells, and power resistors.
Thermal conductivity of 6 W/(m·K)
One-component compound
Silicone-free, will not contaminate surfaces
Wide operating temperature, ideal for aggressive thermal cycling conditions
Low bond line thickness
Thermal management for computers and game system consoles
Heat dissipation for motors and LEDs
Bonding heat sinks
Power semiconductor devices
Flip-chip BGA heat spreaders
Battery modules and battery packs
Power supplies
Telecommunication towers
Data servers
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