MG Chemicals' 8617A silicone-free thermal grease is a high-quality heatsink compound with excellent thermal conductivity and superior wetting properties. Its thixotropic consistency ensures that the paste conforms to intricate geometries at the component/heatsink interface without the common issues of bleed and pump-out found in other pastes. With a wide operating temperature range, 8617A is a practical choice for applications that require high heat dissipation and thermal cycling stability. Once applied, circuits can be powered up immediately, providing exceptional convenience.
This particular thermal paste is commonly utilized as a gap filler on heatsinks for CPUs, LEDs, and various electronic components. Given its high thermal conductivity, it is well-suited for use in energy-intensive devices such as thermal sensors, IGBTs, thermal wells, and power resistors. Additionally, the paste's soft consistency allows for easy compression to achieve thin bond lines, thereby minimizing thermal resistance.
Thermal conductivity of 3 W/(m·K)
One-component compound
Silicone-free, will not contaminate surfaces
Wide operating temperature, ideal for aggressive thermal cycling conditions
Low bond line thickness
Thermal management for computers and game system consoles
Heat dissipation for motors and LEDs
Bonding heatsinks
Power semiconductor devices
Flip-chip BGA heat spreaders
Battery modules and battery packs
Power supplies
Telecommunication towers
Data servers
Tell us what you're after