GenX3™ Series, Single IGBTs

Results:
136
Manufacturer
Series
Switching Energy
Vce(on) (Max) @ Vge, Ic
Td (on/off) @ 25°C
Gate Charge
Test Condition
Current - Collector Pulsed (Icm)
Current - Collector (Ic) (Max)
Power - Max
Reverse Recovery Time (trr)
Supplier Device Package
Package / Case
Voltage - Collector Emitter Breakdown (Max)
Operating Temperature
Mounting Type
IGBT Type
Input Type
Grade
Qualification
Results remaining136
Applied Filters:
GenX3™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperaturePackage / CaseIGBT TypeVoltage - Collector Emitter Breakdown (Max)Power - MaxGradeReverse Recovery Time (trr)Supplier Device PackageSeriesCurrent - Collector (Ic) (Max)Current - Collector Pulsed (Icm)Vce(on) (Max) @ Vge, IcSwitching EnergyInput TypeGate ChargeTd (on/off) @ 25°CTest ConditionQualification
IXGR72N60B3H1
IGBT 600V 75A 200W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
PT
600 V
200 W
-
140 ns
ISOPLUS247™
GenX3™
75 A
450 A
1.8V @ 15V, 60A
1.4mJ (on), 1mJ (off)
Standard
225 nC
31ns/152ns
480V, 50A, 3Ohm, 15V
-
IXGK400N30A3
IGBT 300V 400A 1000W TO264AA
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-264-3, TO-264AA
PT
300 V
1000 W
-
-
TO-264 (IXGK)
GenX3™
400 A
1200 A
1.15V @ 15V, 100A
-
Standard
560 nC
-
-
-
IXGH30N120B3D1
IGBT 1200V 300W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
PT
1200 V
300 W
-
100 ns
TO-247AD
GenX3™
-
150 A
3.5V @ 15V, 30A
3.47mJ (on), 2.16mJ (off)
Standard
87 nC
16ns/127ns
960V, 30A, 5Ohm, 15V
-
IXGH60N60C3D1
IGBT 600V 75A 380W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
PT
600 V
380 W
-
25 ns
TO-247AD
GenX3™
75 A
300 A
2.5V @ 15V, 40A
800µJ (on), 450µJ (off)
Standard
115 nC
21ns/70ns
480V, 40A, 3Ohm, 15V
-
IXGA36N60A3
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
PT
600 V
220 W
-
23 ns
TO-263AA
GenX3™
-
200 A
1.4V @ 15V, 30A
740µJ (on), 3mJ (off)
Standard
80 nC
18ns/330ns
400V, 30A, 5Ohm, 15V
-
IXGR48N60B3D1
IGBT 600V 60A 150W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
PT
600 V
150 W
-
100 ns
ISOPLUS247™
GenX3™
60 A
280 A
2.1V @ 15V, 40A
840µJ (on), 660µJ (off)
Standard
115 nC
22ns/130ns
480V, 30A, 5Ohm, 15V
-
IXGX320N60A3
IGBT 600V 320A 1000W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PT
600 V
1000 W
-
-
PLUS247™-3
GenX3™
320 A
700 A
1.25V @ 15V, 100A
-
Standard
560 nC
-
-
-
IXGA48N60A3
IGBT 600V 120A 300W TO263AA
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
PT
600 V
300 W
-
-
TO-263AA
GenX3™
120 A
300 A
1.35V @ 15V, 32A
950µJ (on), 2.9mJ (off)
Standard
110 nC
25ns/334ns
480V, 32A, 5Ohm, 15V
-
IXGP48N60B3
DISC IGBT PT-MID FREQUENCY TO-22
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3
PT
600 V
300 W
-
25 ns
TO-220
GenX3™
48 A
280 A
1.8V @ 15V, 32A
840µJ (on), 660µJ (off)
Standard
115 nC
22ns/130ns
480V, 30A, 5Ohm, 15V
-
IXGR72N60C3
DISC IGBT PT-HIFREQUENCY ISOPLUS
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
PT
600 V
200 W
-
37 ns
ISOPLUS247™
GenX3™
80 A
400 A
2.7V @ 15V, 50A
1.03mJ (on), 480µJ (off)
Standard
175 nC
27ns/77ns
480V, 50A, 2Ohm, 15V
-
IXGT64N60B3
DISC IGBT PT-MID FREQUENCY TO-26
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
PT
600 V
460 W
-
41 ns
TO-268
GenX3™
64 A
400 A
1.8V @ 15V, 50A
1.5mJ (on), 1mJ (off)
Standard
168 nC
25ns/138ns
480V, 50A, 3Ohm, 15V
-
IXGK120N60B3
DISC IGBT PT-MID FREQUENCY TO-26
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-264-3, TO-264AA
PT
600 V
780 W
-
87 ns
TO-264 (IXGK)
GenX3™
280 A
600 A
1.8V @ 15V, 100A
2.9mJ (on), 3.5mJ (off)
Standard
465 nC
40ns/227ns
480V, 100A, 2Ohm, 15V
-
IXGP28N60A3M
DISC IGBT PT-LOW FREQUENCY TO-22
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3 Full Pack, Isolated Tab
PT
600 V
64 W
-
26 ns
TO-220 Isolated Tab
GenX3™
38 A
200 A
1.4V @ 15V, 24A
-
Standard
66 nC
18ns/300ns
480V, 24A, 10Ohm, 15V
-
IXGA30N60C3
IGBT 600V 60A 220W TO-263AA
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
PT
600 V
220 W
-
26 ns
TO-263 (D2Pak)
GenX3™
60 A
150 A
3V @ 15V, 20A
270µJ (on), 90µJ (off)
Standard
38 nC
16ns/42ns
300V, 20A, 5Ohm, 15V
-
IXGX400N30A3
IGBT 300V 400A 1000W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PT
300 V
1000 W
-
-
PLUS247™-3
GenX3™
400 A
1200 A
1.15V @ 15V, 100A
-
Standard
560 nC
-
-
-
IXGP12N120A3
IGBT 1200V 22A 100W TO220
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3
PT
1200 V
100 W
-
-
TO-220-3
GenX3™
22 A
60 A
3V @ 15V, 12A
-
Standard
20.4 nC
-
-
-

About  Single IGBTs

Single Insulated-Gate Bipolar Transistors (IGBTs) are sophisticated semiconductor devices composed of multiple layers and equipped with three terminals. These devices are specifically designed to handle high currents and offer rapid switching capabilities. They are highly valued in a wide range of applications. The performance and characteristics of single IGBTs are defined by several key parameters. These parameters include the device type, collector-emitter breakdown voltage, collector current rating, pulsed collector current rating, VCE(ON), switching energy, and gate charge. The device type refers to the specific model or variant of the IGBT. Different models may possess distinct features and characteristics tailored to meet the requirements of different applications. The collector-emitter breakdown voltage represents the maximum voltage that the device can withstand across its collector and emitter terminals without experiencing a breakdown or failure. The collector current rating indicates the maximum continuous current that the IGBT can handle while maintaining proper functionality. The pulsed collector current rating specifies the maximum current that the IGBT can endure for short durations, typically in pulsed or transient conditions. VCE(ON) signifies the voltage drop across the collector-emitter junction when the IGBT is fully turned on and conducting current. This parameter is crucial for power loss calculations and efficiency analysis. Switching energy refers to the amount of energy dissipated during the switching process of the IGBT. Minimizing switching energy is vital for reducing power losses and enhancing overall efficiency. Lastly, gate charge denotes the amount of charge required to turn the IGBT on or off. Gate charge influences the switching speed and control characteristics of the device. By considering these parameters, engineers and designers can carefully select the most suitable single IGBT that aligns with the specific requirements of their application, ensuring optimal performance and reliability.