GenX3™ Series, Single IGBTs

Results:
136
Manufacturer
Series
Switching Energy
Vce(on) (Max) @ Vge, Ic
Td (on/off) @ 25°C
Gate Charge
Test Condition
Current - Collector Pulsed (Icm)
Current - Collector (Ic) (Max)
Power - Max
Reverse Recovery Time (trr)
Supplier Device Package
Package / Case
Voltage - Collector Emitter Breakdown (Max)
Operating Temperature
Mounting Type
IGBT Type
Input Type
Grade
Qualification
Results remaining136
Applied Filters:
GenX3™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperatureIGBT TypeVoltage - Collector Emitter Breakdown (Max)GradeCurrent - Collector (Ic) (Max)Package / CaseSeriesCurrent - Collector Pulsed (Icm)Vce(on) (Max) @ Vge, IcPower - MaxSwitching EnergyInput TypeGate ChargeTd (on/off) @ 25°CTest ConditionSupplier Device PackageReverse Recovery Time (trr)Qualification
IXGK120N120B3
IGBT 1200V 200A 830W TO264
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
1200 V
-
200 A
TO-264-3, TO-264AA
GenX3™
370 A
3V @ 15V, 100A
830 W
5.5mJ (on), 5.8mJ (off)
Standard
470 nC
36ns/275ns
600V, 100A, 2Ohm, 15V
TO-264 (IXGK)
-
-
MMIX1G320N60B3
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
PT
600 V
-
400 A
24-PowerSMD, 21 Leads
GenX3™
1000 A
1.5V @ 15V, 100A
1000 W
2.7mJ (on), 5mJ (off)
Standard
585 nC
44ns/250ns
480V, 100A, 1Ohm, 15V
24-SMPD
66 ns
-
IXGH30N120B3
DISC IGBT PT-MID FREQUENCY TO-24
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
1200 V
-
60 A
TO-247-3
GenX3™
150 A
3.5V @ 15V, 30A
300 W
3.47mJ (on), 2.16mJ (off)
Standard
87 nC
16ns/127ns
960V, 30A, 5Ohm, 15V
TO-247AD
37 ns
-
IXGK64N60B3D1
IGBT 600V 460W TO264
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
-
TO-264-3, TO-264AA
GenX3™
400 A
1.8V @ 15V, 50A
460 W
1.5mJ (on), 1mJ (off)
Standard
168 nC
25ns/138ns
480V, 50A, 3Ohm, 15V
TO-264 (IXGK)
35 ns
-
IXGK72N60A3H1
IGBT 600V 75A 540W TO264
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
75 A
TO-264-3, TO-264AA
GenX3™
400 A
1.35V @ 15V, 60A
540 W
1.4mJ (on), 3.5mJ (off)
Standard
230 nC
31ns/320ns
480V, 50A, 3Ohm, 15V
TO-264 (IXGK)
140 ns
-
IXGP48N60C3
IGBT 600V 75A 300W TO220AB
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
75 A
TO-220-3
GenX3™
250 A
2.5V @ 15V, 30A
300 W
410µJ (on), 230µJ (off)
Standard
77 nC
19ns/60ns
400V, 30A, 3Ohm, 15V
TO-220-3
-
-
IXGR72N60A3H1
IGBT 600V 75A 200W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
75 A
TO-247-3
GenX3™
400 A
1.45V @ 15V, 60A
200 W
1.4mJ (on), 3.5mJ (off)
Standard
230 nC
31ns/320ns
480V, 50A, 3Ohm, 15V
ISOPLUS247™
140 ns
-
IXGH90N60B3
IGBT 600V 75A 660W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
75 A
TO-247-3
GenX3™
500 A
1.8V @ 15V, 90A
660 W
1.32mJ (on), 1.37mJ (off)
Standard
172 nC
31ns/150ns
480V, 60A, 2Ohm, 15V
TO-247AD
-
-
MMIX1G120N120A3V1
IGBT 1200V 220A 400W SMPD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
PT
1200 V
-
220 A
24-PowerSMD, 21 Leads
GenX3™
700 A
2.2V @ 15V, 100A
400 W
10mJ (on), 33mJ (off)
Standard
420 nC
40ns/490ns
960V, 100A, 1Ohm, 15V
24-SMPD
700 ns
-
IXGT32N120A3
IGBT 1200V 75A 300W TO268
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
PT
1200 V
-
75 A
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
GenX3™
230 A
2.35V @ 15V, 32A
300 W
-
Standard
89 nC
-
-
TO-268AA
-
-
IXGH120N30B3
IGBT 300V 75A 540W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
300 V
-
75 A
TO-247-3
GenX3™
480 A
1.7V @ 15V, 120A
540 W
-
Standard
225 nC
-
-
TO-247AD
-
-
IXGH120N30C3
IGBT 300V 75A 540W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
300 V
-
75 A
TO-247-3
GenX3™
600 A
2.1V @ 15V, 120A
540 W
230µJ (on), 730µJ (off)
Standard
230 nC
28ns/109ns
200V, 60A, 2Ohm, 15V
TO-247AD
-
-
IXGH36N60B3D4
IGBT 600V 250W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
-
TO-247-3
GenX3™
200 A
1.8V @ 15V, 30A
250 W
540µJ (on), 800µJ (off)
Standard
80 nC
19ns/125ns
400V, 30A, 5Ohm, 15V
TO-247AD
60 ns
-
IXGH36N60A3D4
IGBT 600V 220W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
-
TO-247-3
GenX3™
200 A
1.4V @ 15V, 30A
220 W
740µJ (on), 3mJ (off)
Standard
80 nC
18ns/330ns
400V, 30A, 5Ohm, 15V
TO-247AD
3 ns
-
IXGH72N60B3
IGBT 600V 75A 540W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
75 A
TO-247-3
GenX3™
400 A
1.8V @ 15V, 60A
540 W
1.38mJ (on), 1.05mJ (off)
Standard
230 nC
31ns/150ns
480V, 50A, 3Ohm, 15V
TO-247AD
-
-
IXGK28N140B3H1
IGBT 1400V 60A 300W TO264
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
1400 V
-
60 A
TO-264-3, TO-264AA
GenX3™
150 A
3.6V @ 15V, 28A
300 W
3.6mJ (on), 3.9mJ (off)
Standard
88 nC
16ns/190ns
960V, 28A, 5Ohm, 15V
TO-264 (IXGK)
350 ns
-
IXGP20N120A3
IGBT 1200V 40A 180W TO220
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
1200 V
-
40 A
TO-220-3
GenX3™
120 A
2.5V @ 15V, 20A
180 W
2.85mJ (on), 6.47mJ (off)
Standard
50 nC
16ns/290ns
960V, 20A, 10Ohm, 15V
TO-220-3
-
-
IXGH48N60A3
IGBT 600V 120A 300W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
PT
600 V
-
120 A
TO-247-3
GenX3™
300 A
1.35V @ 15V, 32A
300 W
950µJ (on), 2.9mJ (off)
Standard
110 nC
25ns/334ns
480V, 32A, 5Ohm, 15V
TO-247AD
-
-
IXGA30N120B3
IGBT 1200V 60A 300W TO263
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
PT
1200 V
-
60 A
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
GenX3™
150 A
3.5V @ 15V, 30A
300 W
3.47mJ (on), 2.16mJ (off)
Standard
87 nC
16ns/127ns
960V, 30A, 5Ohm, 15V
TO-263AA
-
-
IXGH30N60C3D1
IGBT 600V 60A 220W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
-
600 V
-
60 A
TO-247-3
GenX3™
150 A
3V @ 15V, 20A
220 W
270µJ (on), 90µJ (off)
Standard
38 nC
16ns/42ns
300V, 20A, 5Ohm, 15V
TO-247AD
25 ns
-

About  Single IGBTs

Single Insulated-Gate Bipolar Transistors (IGBTs) are sophisticated semiconductor devices composed of multiple layers and equipped with three terminals. These devices are specifically designed to handle high currents and offer rapid switching capabilities. They are highly valued in a wide range of applications. The performance and characteristics of single IGBTs are defined by several key parameters. These parameters include the device type, collector-emitter breakdown voltage, collector current rating, pulsed collector current rating, VCE(ON), switching energy, and gate charge. The device type refers to the specific model or variant of the IGBT. Different models may possess distinct features and characteristics tailored to meet the requirements of different applications. The collector-emitter breakdown voltage represents the maximum voltage that the device can withstand across its collector and emitter terminals without experiencing a breakdown or failure. The collector current rating indicates the maximum continuous current that the IGBT can handle while maintaining proper functionality. The pulsed collector current rating specifies the maximum current that the IGBT can endure for short durations, typically in pulsed or transient conditions. VCE(ON) signifies the voltage drop across the collector-emitter junction when the IGBT is fully turned on and conducting current. This parameter is crucial for power loss calculations and efficiency analysis. Switching energy refers to the amount of energy dissipated during the switching process of the IGBT. Minimizing switching energy is vital for reducing power losses and enhancing overall efficiency. Lastly, gate charge denotes the amount of charge required to turn the IGBT on or off. Gate charge influences the switching speed and control characteristics of the device. By considering these parameters, engineers and designers can carefully select the most suitable single IGBT that aligns with the specific requirements of their application, ensuring optimal performance and reliability.