GenX3™ Series, Single IGBTs

Results:
136
Manufacturer
Series
Switching Energy
Vce(on) (Max) @ Vge, Ic
Td (on/off) @ 25°C
Gate Charge
Test Condition
Current - Collector Pulsed (Icm)
Current - Collector (Ic) (Max)
Power - Max
Reverse Recovery Time (trr)
Supplier Device Package
Package / Case
Voltage - Collector Emitter Breakdown (Max)
Operating Temperature
Mounting Type
IGBT Type
Input Type
Grade
Qualification
Results remaining136
Applied Filters:
GenX3™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperaturePackage / CaseSupplier Device PackageIGBT TypeVoltage - Collector Emitter Breakdown (Max)GradeSeriesCurrent - Collector (Ic) (Max)Current - Collector Pulsed (Icm)Vce(on) (Max) @ Vge, IcPower - MaxSwitching EnergyInput TypeGate ChargeTd (on/off) @ 25°CTest ConditionReverse Recovery Time (trr)Qualification
IXGH60N60C3
IGBT 600V 75A 380W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
-
GenX3™
75 A
360 A
2.5V @ 15V, 40A
380 W
800µJ (on), 450µJ (off)
Standard
115 nC
21ns/70ns
480V, 40A, 3Ohm, 15V
-
-
IXGH72N60C3
IGBT 600V 75A 540W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
-
GenX3™
75 A
360 A
2.5V @ 15V, 50A
540 W
1.03mJ (on), 480µJ (off)
Standard
174 nC
27ns/77ns
480V, 50A, 2Ohm, 15V
-
-
IXGK320N60A3
IGBT 600V 320A 1000W TO264AA
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-264-3, TO-264AA
TO-264 (IXGK)
PT
600 V
-
GenX3™
320 A
700 A
1.25V @ 15V, 100A
1000 W
-
Standard
560 nC
-
-
-
-
IXGA48N60A3-TRL
IXGA48N60A3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
600 V
-
GenX3™
120 A
300 A
1.35V @ 15V, 32A
300 W
950µJ (on), 2.9mJ (off)
Standard
110 nC
25ns/334ns
480V, 32A, 5Ohm, 15V
30 ns
-
IXGR48N60C3D1
IGBT 600V 56A 125W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
ISOPLUS247™
PT
600 V
-
GenX3™
56 A
230 A
2.7V @ 15V, 30A
125 W
410µJ (on), 230µJ (off)
Standard
77 nC
19ns/60ns
400V, 30A, 3Ohm, 15V
25 ns
-
IXGA20N120A3-TRL
IXGA20N120A3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
1200 V
-
GenX3™
40 A
120 A
2.5V @ 15V, 20A
180 W
2.85mJ (on), 6.47mJ (off)
Standard
50 nC
16ns/290ns
960V, 20A, 10Ohm, 15V
44 ns
-
IXGA20N120B3-TRL
IXGA20N120B3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
1200 V
-
GenX3™
36 A
80 A
3.1V @ 15V, 16A
180 W
920µJ (on), 560µJ (off)
Standard
51 nC
16ns/150ns
600V, 16A, 15Ohm, 15V
31 ns
-
IXGH48N60C3
IGBT 600V 75A 300W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
-
GenX3™
75 A
250 A
2.5V @ 15V, 30A
300 W
410µJ (on), 230µJ (off)
Standard
77 nC
19ns/60ns
400V, 30A, 3Ohm, 15V
-
-
IXGK320N60B3
IGBT 600V 500A 1700W TO264
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-264-3, TO-264AA
TO-264 (IXGK)
PT
600 V
-
GenX3™
500 A
1200 A
1.6V @ 15V, 100A
1700 W
2.7mJ (on), 3.5mJ (off)
Standard
585 nC
44ns/250ns
480V, 100A, 1Ohm, 15V
-
-
IXGH36N60B3
IGBT 600V 92A 250W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
-
GenX3™
92 A
200 A
1.8V @ 15V, 30A
250 W
540µJ (on), 800µJ (off)
Standard
80 nC
19ns/125ns
400V, 30A, 5Ohm, 15V
-
-
IXGH40N120C3
IGBT 1200V 75A 380W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
-
GenX3™
75 A
200 A
4.4V @ 15V, 30A
380 W
1.8mJ (on), 550µJ (off)
Standard
142 nC
17ns/130ns
600V, 30A, 3Ohm, 15V
-
-
IXGT64N60B3-TRL
IXGT64N60B3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
TO-268
PT
600 V
-
GenX3™
64 A
400 A
1.8V @ 15V, 50A
460 W
1.5mJ (on), 1mJ (off)
Standard
168 nC
25ns/138ns
480V, 50A, 3Ohm, 15V
41 ns
-
IXGP28N60A3
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3
TO-220-3
PT
600 V
-
GenX3™
75 A
170 A
1.4V @ 15V, 24A
190 W
700µJ (on), 2.4mJ (off)
Standard
66 nC
18ns/300ns
480V, 24A, 10Ohm, 15V
26 ns
-
IXGP24N120C3
IGBT 1200V 48A 250W TO220
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3
TO-220-3
PT
1200 V
-
GenX3™
48 A
96 A
4.2V @ 15V, 20A
250 W
1.16mJ (on), 470µJ (off)
Standard
79 nC
16ns/93ns
600V, 20A, 5Ohm, 15V
-
-
IXGH24N120C3H1
IGBT 1200V 48A 250W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
-
GenX3™
48 A
96 A
4.2V @ 15V, 20A
250 W
1.16mJ (on), 470µJ (off)
Standard
79 nC
16ns/93ns
600V, 20A, 5Ohm, 15V
70 ns
-
IXGT72N60A3-TRL
IXGT72N60A3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
TO-268
PT
600 V
-
GenX3™
75 A
400 A
1.35V @ 15V, 60A
540 W
1.38mJ (on), 3.5mJ (off)
Standard
230 nC
31ns/320ns
480V, 50A, 3Ohm, 15V
34 ns
-
IXGH30N120C3H1
IGBT 1200V 48A 250W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
-
GenX3™
48 A
115 A
4.2V @ 15V, 24A
250 W
1.45mJ (on), 470µJ (off)
Standard
80 nC
18ns/106ns
600V, 24A, 5Ohm, 15V
70 ns
-
IXGR24N120C3D1
IGBT 1200V 48A 200W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
ISOPLUS247™
PT
1200 V
-
GenX3™
48 A
96 A
4.2V @ 15V, 20A
200 W
1.37mJ (on), 470µJ (off)
Standard
79 nC
16ns/93ns
600V, 20A, 5Ohm, 15V
220 ns
-
IXGH24N120C3
IGBT 1200V 48A 250W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
-
GenX3™
48 A
96 A
4.2V @ 15V, 20A
250 W
1.16mJ (on), 470µJ (off)
Standard
79 nC
16ns/93ns
600V, 20A, 5Ohm, 15V
-
-
IXGH48N60A3D1
IGBT 600V 300W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
-
GenX3™
-
300 A
1.35V @ 15V, 32A
300 W
950µJ (on), 2.9mJ (off)
Standard
110 nC
25ns/334ns
480V, 32A, 5Ohm, 15V
25 ns
-

About  Single IGBTs

Single Insulated-Gate Bipolar Transistors (IGBTs) are sophisticated semiconductor devices composed of multiple layers and equipped with three terminals. These devices are specifically designed to handle high currents and offer rapid switching capabilities. They are highly valued in a wide range of applications. The performance and characteristics of single IGBTs are defined by several key parameters. These parameters include the device type, collector-emitter breakdown voltage, collector current rating, pulsed collector current rating, VCE(ON), switching energy, and gate charge. The device type refers to the specific model or variant of the IGBT. Different models may possess distinct features and characteristics tailored to meet the requirements of different applications. The collector-emitter breakdown voltage represents the maximum voltage that the device can withstand across its collector and emitter terminals without experiencing a breakdown or failure. The collector current rating indicates the maximum continuous current that the IGBT can handle while maintaining proper functionality. The pulsed collector current rating specifies the maximum current that the IGBT can endure for short durations, typically in pulsed or transient conditions. VCE(ON) signifies the voltage drop across the collector-emitter junction when the IGBT is fully turned on and conducting current. This parameter is crucial for power loss calculations and efficiency analysis. Switching energy refers to the amount of energy dissipated during the switching process of the IGBT. Minimizing switching energy is vital for reducing power losses and enhancing overall efficiency. Lastly, gate charge denotes the amount of charge required to turn the IGBT on or off. Gate charge influences the switching speed and control characteristics of the device. By considering these parameters, engineers and designers can carefully select the most suitable single IGBT that aligns with the specific requirements of their application, ensuring optimal performance and reliability.