GenX3™ Series, Single IGBTs

Results:
136
Manufacturer
Series
Switching Energy
Vce(on) (Max) @ Vge, Ic
Td (on/off) @ 25°C
Gate Charge
Test Condition
Current - Collector Pulsed (Icm)
Current - Collector (Ic) (Max)
Power - Max
Reverse Recovery Time (trr)
Supplier Device Package
Package / Case
Voltage - Collector Emitter Breakdown (Max)
Operating Temperature
Mounting Type
IGBT Type
Input Type
Grade
Qualification
Results remaining136
Applied Filters:
GenX3™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperaturePackage / CaseSupplier Device PackageIGBT TypeVoltage - Collector Emitter Breakdown (Max)Power - MaxGradeSeriesCurrent - Collector (Ic) (Max)Current - Collector Pulsed (Icm)Vce(on) (Max) @ Vge, IcSwitching EnergyInput TypeGate ChargeTd (on/off) @ 25°CTest ConditionReverse Recovery Time (trr)Qualification
IXGA12N120A3-TRL
IXGA12N120A3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
1200 V
100 W
-
GenX3™
22 A
60 A
3V @ 15V, 12A
-
Standard
20.4 nC
35ns/62ns
960V, 12A, 10Ohm, 15V
-
-
IXGA48N60B3-TRL
IXGA48N60B3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
600 V
300 W
-
GenX3™
48 A
280 A
1.8V @ 15V, 32A
840µJ (on), 660µJ (off)
Standard
115 nC
22ns/130ns
480V, 30A, 5Ohm, 15V
25 ns
-
IXGA30N120B3-TRL
IXGA30N120B3 TRL
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263 (D2Pak)
PT
1200 V
300 W
-
GenX3™
60 A
150 A
3.5V @ 15V, 30A
3.47mJ (on), 2.16mJ (off)
Standard
87 nC
16ns/127ns
960V, 30A, 5Ohm, 15V
37 ns
-
IXGR60N60C3D1
IGBT 600V 75A 170W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
ISOPLUS247™
PT
600 V
170 W
-
GenX3™
75 A
260 A
2.5V @ 15V, 40A
800µJ (on), 450µJ (off)
Standard
115 nC
21ns/70ns
480V, 40A, 3Ohm, 15V
25 ns
-
IXGR72N60C3D1
IGBT 600V 75A 200W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
ISOPLUS247™
PT
600 V
200 W
-
GenX3™
75 A
400 A
2.7V @ 15V, 50A
1.03mJ (on), 480µJ (off)
Standard
175 nC
27ns/77ns
480V, 50A, 2Ohm, 15V
35 ns
-
IXGT60N60C3D1
IGBT 600V 75A 380W TO268
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
TO-268AA
PT
600 V
380 W
-
GenX3™
75 A
300 A
2.5V @ 15V, 40A
800µJ (on), 450µJ (off)
Standard
115 nC
21ns/70ns
480V, 40A, 3Ohm, 15V
25 ns
-
IXGX120N60B3
IGBT 600V 280A 780W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PLUS247™-3
PT
600 V
780 W
-
GenX3™
280 A
600 A
1.8V @ 15V, 100A
2.9mJ (on), 3.5mJ (off)
Standard
465 nC
40ns/227ns
480V, 100A, 2Ohm, 15V
-
-
IXGH20N120A3
IGBT 1200V 40A 180W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
180 W
-
GenX3™
40 A
120 A
2.5V @ 15V, 20A
2.85mJ (on), 6.47mJ (off)
Standard
50 nC
16ns/290ns
960V, 20A, 10Ohm, 15V
-
-
IXGH40N120C3D1
IGBT 1200V 75A 380W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
380 W
-
GenX3™
75 A
180 A
4.4V @ 15V, 30A
1.8mJ (on), 550µJ (off)
Standard
142 nC
17ns/130ns
600V, 30A, 3Ohm, 15V
100 ns
-
IXGH50N120C3
IGBT 1200V 75A 460W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1200 V
460 W
-
GenX3™
75 A
250 A
4.2V @ 15V, 40A
2.2mJ (on), 630µJ (off)
Standard
196 nC
20ns/123ns
600V, 40A, 2Ohm, 15V
-
-
IXGX120N60A3
IGBT 600V 200A 780W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PLUS247™-3
PT
600 V
780 W
-
GenX3™
200 A
600 A
1.35V @ 15V, 100A
2.7mJ (on), 6.6mJ (off)
Standard
450 nC
39ns/295ns
480V, 100A, 1.5Ohm, 15V
-
-
IXGX320N60B3
IGBT 600V 500A 1700W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-
TO-247-3 Variant
PLUS247™-3
PT
600 V
1700 W
-
GenX3™
500 A
1200 A
1.6V @ 15V, 100A
2.7mJ (on), 3.5mJ (off)
Standard
585 nC
44ns/250ns
480V, 100A, 1Ohm, 15V
-
-
IXGX72N60C3H1
IGBT 600V 75A 540W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PLUS247™-3
PT
600 V
540 W
-
GenX3™
75 A
360 A
2.5V @ 15V, 50A
1.03mJ (on), 480µJ (off)
Standard
174 nC
27ns/77ns
480V, 50A, 2Ohm, 15V
140 ns
-
IXGR60N60C3C1
IGBT 600V 75A 170W ISOPLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
ISOPLUS247™
PT
600 V
170 W
-
GenX3™
75 A
260 A
2.5V @ 15V, 40A
830µJ (on), 450µJ (off)
Standard
115 nC
24ns/70ns
480V, 40A, 3Ohm, 15V
-
-
IXGA30N60C3C1
IGBT 600V 60A 220W TO263
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-55°C ~ 150°C (TJ)
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
TO-263AA
PT
600 V
220 W
-
GenX3™
60 A
150 A
3V @ 15V, 20A
120µJ (on), 90µJ (off)
Standard
38 nC
17ns/42ns
300V, 20A, 5Ohm, 15V
-
-
IXGH20N140C3H1
IGBT 1400V 42A 250W TO247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
1400 V
250 W
-
GenX3™
42 A
108 A
5V @ 15V, 20A
1.35mJ (on), 440µJ (off)
Standard
88 nC
19ns/110ns
700V, 20A, 5Ohm, 15V
70 ns
-
IXGP30N120B3
IGBT 1200V 60A 300W TO220
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-220-3
TO-220-3
PT
1200 V
300 W
-
GenX3™
60 A
150 A
3.5V @ 15V, 30A
3.47mJ (on), 2.16mJ (off)
Standard
87 nC
16ns/127ns
960V, 30A, 5Ohm, 15V
-
-
IXGX120N120A3
IGBT 1200V 240A 830W PLUS247
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3 Variant
PLUS247™-3
PT
1200 V
830 W
-
GenX3™
240 A
600 A
2.2V @ 15V, 100A
10mJ (on), 33mJ (off)
Standard
420 nC
40ns/490ns
960V, 100A, 1Ohm, 15V
-
-
IXGH36N60B3D1
IGBT 600V 250W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
250 W
-
GenX3™
-
200 A
1.8V @ 15V, 30A
540µJ (on), 800µJ (off)
Standard
80 nC
19ns/125ns
400V, 30A, 5Ohm, 15V
25 ns
-
IXGH48N60B3
IGBT 600V 300W TO247AD
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Quantity
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PCB Symbol, Footprint & 3D Model
Through Hole
-55°C ~ 150°C (TJ)
TO-247-3
TO-247AD
PT
600 V
300 W
-
GenX3™
-
280 A
1.8V @ 15V, 32A
840µJ (on), 660µJ (off)
Standard
115 nC
22ns/130ns
480V, 30A, 5Ohm, 15V
-
-

About  Single IGBTs

Single Insulated-Gate Bipolar Transistors (IGBTs) are sophisticated semiconductor devices composed of multiple layers and equipped with three terminals. These devices are specifically designed to handle high currents and offer rapid switching capabilities. They are highly valued in a wide range of applications. The performance and characteristics of single IGBTs are defined by several key parameters. These parameters include the device type, collector-emitter breakdown voltage, collector current rating, pulsed collector current rating, VCE(ON), switching energy, and gate charge. The device type refers to the specific model or variant of the IGBT. Different models may possess distinct features and characteristics tailored to meet the requirements of different applications. The collector-emitter breakdown voltage represents the maximum voltage that the device can withstand across its collector and emitter terminals without experiencing a breakdown or failure. The collector current rating indicates the maximum continuous current that the IGBT can handle while maintaining proper functionality. The pulsed collector current rating specifies the maximum current that the IGBT can endure for short durations, typically in pulsed or transient conditions. VCE(ON) signifies the voltage drop across the collector-emitter junction when the IGBT is fully turned on and conducting current. This parameter is crucial for power loss calculations and efficiency analysis. Switching energy refers to the amount of energy dissipated during the switching process of the IGBT. Minimizing switching energy is vital for reducing power losses and enhancing overall efficiency. Lastly, gate charge denotes the amount of charge required to turn the IGBT on or off. Gate charge influences the switching speed and control characteristics of the device. By considering these parameters, engineers and designers can carefully select the most suitable single IGBT that aligns with the specific requirements of their application, ensuring optimal performance and reliability.