eGaN® Series, FET, MOSFET Arrays

Results:
21
Manufacturer
Series
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
Rds On (Max) @ Id, Vgs
Vgs(th) (Max) @ Id
Current - Continuous Drain (Id) @ 25°C
Drain to Source Voltage (Vdss)
Configuration
Operating Temperature
FET Feature
Supplier Device Package
Package / Case
Mounting Type
Technology
Grade
Qualification
Power - Max
Results remaining21
Applied Filters:
eGaN®
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypePower - MaxPackage / CaseSupplier Device PackageOperating TemperatureSeriesGradeFET FeatureDrain to Source Voltage (Vdss)Current - Continuous Drain (Id) @ 25°CRds On (Max) @ Id, VgsVgs(th) (Max) @ IdGate Charge (Qg) (Max) @ VgsInput Capacitance (Ciss) (Max) @ VdsTechnologyQualificationConfiguration
EPC2103
GAN TRANS SYMMETRICAL HALF BRIDG
1+
$12.6761
5+
$11.9718
10+
$11.2676
Quantity
2,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
80V
28A
5.5mOhm @ 20A, 5V
2.5V @ 7mA
6.5nC @ 5V
760pF @ 40V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2102
GAN TRANS SYMMETRICAL HALF BRIDG
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
60V
23A
4.4mOhm @ 20A, 5V
2.5V @ 7mA
6.8nC @ 5V
830pF @ 30V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2108
GANFET 3 N-CH 60V/100V 9BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
9-VFBGA
9-BGA (1.35x1.35)
-40°C ~ 150°C (TJ)
eGaN®
-
-
60V, 100V
1.7A, 500mA
190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
2.5V @ 100µA, 2.5V @ 20µA
0.22nC @ 5V, 0.044nC @ 5V
22pF @ 30V, 7pF @ 30V
GaNFET (Gallium Nitride)
-
3 N-Channel (Half Bridge + Synchronous Bootstrap)
EPC2100
GAN TRANS ASYMMETRICAL HALF BRID
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
30V
10A (Ta), 40A (Ta)
8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
2.5V @ 4mA, 2.5V @ 16mA
4.9nC @ 15V, 19nC @ 15V
475pF @ 15V, 1960pF @ 15V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2101
GAN TRANS ASYMMETRICAL HALF BRID
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
60V
9.5A, 38A
11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
2.5V @ 3mA, 2.5V @ 12mA
2.7nC @ 5V, 12nC @ 5V
300pF @ 30V, 1200pF @ 30V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2110ENGRT
GAN TRANS 2N-CH 120V BUMPED DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
120V
3.4A
60mOhm @ 4A, 5V
2.5V @ 700µA
0.8nC @ 5V
80pF @ 60V
GaNFET (Gallium Nitride)
-
2 N-Channel (Dual) Common Source
EPC2100ENGRT
GANFET 2 N-CH 30V 9.5A/38A DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
30V
10A (Ta), 40A (Ta)
8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
2.5V @ 4mA, 2.5V @ 16mA
4.9nC @ 15V, 19nC @ 15V
475pF @ 15V, 1960pF @ 15V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2107
GANFET 3 N-CH 100V 9BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
9-VFBGA
9-BGA (1.35x1.35)
-40°C ~ 150°C (TJ)
eGaN®
-
-
100V
1.7A, 500mA
320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
2.5V @ 100µA, 2.5V @ 20µA
0.16nC @ 5V, 0.044nC @ 5V
16pF @ 50V, 7pF @ 50V
GaNFET (Gallium Nitride)
-
3 N-Channel (Half Bridge + Synchronous Bootstrap)
EPC2106
GANFET TRANS SYM 100V BUMPED DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
100V
1.7A
70mOhm @ 2A, 5V
2.5V @ 600µA
0.73nC @ 5V
75pF @ 50V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2104
GAN TRANS SYMMETRICAL HALF BRIDG
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
100V
23A
6.3mOhm @ 20A, 5V
2.5V @ 5.5mA
7nC @ 5V
800pF @ 50V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2103ENGRT
GANFET TRANS SYM HALF BRDG 80V
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-
eGaN®
-
-
80V
23A
5.5mOhm @ 20A, 5V
2.5V @ 7mA
6.5nC @ 5V
7600pF @ 40V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2105ENGRT
GANFET 2NCH 80V 9.5A DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
80V
9.5A
14.5mOhm @ 20A, 5V
2.5V @ 2.5mA
2.5nC @ 5V
300pF @ 40V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2105
GAN TRANS ASYMMETRICAL HALF BRID
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
80V
9.5A, 38A
14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
2.5V @ 2.5mA, 2.5V @ 10mA
2.5nC @ 5V, 10nC @ 5V
300pF @ 40V, 1100pF @ 40V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2110
GANFET 2NCH 120V 3.4A DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
120V
3.4A
60mOhm @ 4A, 5V
2.5V @ 700µA
0.8nC @ 5V
80pF @ 60V
GaNFET (Gallium Nitride)
-
2 N-Channel (Dual) Common Source
EPC2106ENGRT
GAN TRANS 2N-CH 100V BUMPED DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
100V
1.7A
70mOhm @ 2A, 5V
2.5V @ 600µA
0.73nC @ 5V
75pF @ 50V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2104ENGRT
GANFET 2NCH 100V 23A DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
100V
23A
6.3mOhm @ 20A, 5V
2.5V @ 5.5mA
7nC @ 5V
800pF @ 50V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2101ENGRT
GAN TRANS ASYMMETRICAL HALF BRID
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
60V
9.5A, 38A
11.5mOhm @ 20A, 5V
2.5V @ 2mA
2.7nC @ 5V
300pF @ 30V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC2102ENGRT
GANFET 2 N-CHANNEL 60V 23A DIE
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
Die
Die
-40°C ~ 150°C (TJ)
eGaN®
-
-
60V
23A (Tj)
4.4mOhm @ 20A, 5V
2.5V @ 7mA
6.8nC @ 5V
830pF @ 30V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
EPC7018DC
GAN FET HEMT 100V 74A COTS 4UD
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
4-SMD, No Lead
4-SMD
-55°C ~ 150°C (TJ)
eGaN®
-
Standard
100V
70A (Tc)
6.5mOhm @ 70A, 5V
2.5V @ 5mA
17nC @ 5V
1700pF @ 50V
GaNFET (Gallium Nitride)
-
2 N-Channel (Half Bridge)
FBG30N04CSH
GAN FET HEMT 300V 4A 4FSMD-C
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Quantity
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PCB Symbol, Footprint & 3D Model
Surface Mount
-
4-SMD, No Lead
4-SMD
-55°C ~ 150°C (TJ)
eGaN®
-
-
300V
4A (Tc)
404mOhm @ 4A, 5V
2.8V @ 600µA
2.6nC @ 5V
450pF @ 150V
GaNFET (Gallium Nitride)
-
2 N-Channel

About  FET, MOSFET Arrays

Field-effect transistors (FETs) are electronic devices that utilize an electric field to regulate the flow of current. By applying a voltage to the gate terminal, the conductivity between the drain and source terminals can be modified. Unlike bipolar junction transistors, FETs are unipolar transistors, which means they rely on a single type of charge carrier for their operation. This can either be electrons or holes, but not both. One of the key advantages of FETs is their high input impedance at low frequencies. This property arises due to the fact that the gate terminal of an FET doesn't draw any current, as it's designed to function in a voltage-driven mode. As a result, the input impedance of an FET can be several orders of magnitude greater than that of a similarly configured bipolar transistor. Field-effect transistors come in various types, with the most common ones being Junction FETs (JFETs) and Metal Oxide Semiconductor FETs (MOSFETs). JFETs employ a reverse-biased pn-junction to control the flow of current, while MOSFETs use an oxide layer to insulate the gate from the channel region. FETs have numerous applications in electronics, including amplifiers, switches, oscillators, and voltage regulators. Due to their high input impedance, FETs are often used in circuits where low power consumption and minimal loading effects are crucial considerations. In summary, field-effect transistors (FETs) are electronic devices that utilize an electric field to control current flow. They are unipolar transistors that rely on a single type of charge carrier for their operation. FETs offer high input impedance at low frequencies, making them ideal for use in low power applications where signal quality is a critical factor.