Military, MIL-PRF-19500/382 Series, Bipolar Transistor Arrays

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Frequency - Transition
Current - Collector (Ic) (Max)
Vce Saturation (Max) @ Ib, Ic
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Military, MIL-PRF-19500/382
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeOperating TemperaturePackage / CaseVoltage - Collector Emitter Breakdown (Max)Current - Collector (Ic) (Max)Power - MaxSupplier Device PackageGradeSeriesTransistor TypeVce Saturation (Max) @ Ib, IcCurrent - Collector Cutoff (Max)DC Current Gain (hFE) (Min) @ Ic, VceFrequency - TransitionQualification
JANTXV2N2945AUB/TR
TRANSISTOR SMALL-SIGNAL BJT
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PCB Symbol, Footprint & 3D Model
Surface Mount
-65°C ~ 200°C (TJ)
4-SMD, No Lead
20 V
100 mA
400 mW
UB
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Military, MIL-PRF-19500/382
PNP
-
10µA (ICBO)
70 @ 1mA, 500mV
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-

Bipolar Transistor Arrays

Bipolar transistor arrays are electronic components that integrate two or more individual transistors within a single package. These discrete transistors may function as separate entities, or they may be interconnected within the package. When the devices within the array exhibit closely matched or complementary characteristics, the co-packaged nature of the array serves to minimize temperature differentials between the individual transistors during operation. By housing multiple transistors within a shared package, bipolar transistor arrays offer several advantages. For instance, the compact design and interconnections within the package can simplify circuit board layout and assembly. Additionally, closely matched or complementary characteristics among the integrated transistors ensure consistent performance and minimize variations in operation, particularly in response to temperature changes. The use of bipolar transistor arrays is beneficial in applications where precise control, uniformity, and thermal stability are critical. Common applications include analog signal processing, precision voltage references, and current mirrors, among others. In summary, bipolar transistor arrays integrate two or more discrete transistors within a shared package, with the potential for interconnections between them. When the integrated transistors exhibit closely matched or complementary characteristics, the co-packaged nature of the array minimizes temperature variations during operation, making it well-suited for applications that require uniform performance and thermal stability.