Thermoelectric, Peltier Assemblies

Results:
253
Manufacturer
Series
Dimensions - Overall
Power - Cooling
Current
Power - Input
Weight
Operating Temperature
Voltage
Heat Transfer Type
Fan Location
Thread/Screw/Hole Size
Material
Length - Center to Center
Mounting Type
Type
Height
Results remaining253
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperatureWeightHeat Transfer TypePower - CoolingVoltageFan LocationCurrentPower - InputDimensions - Overall
ATS-FF-200W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Air to Air
140 W
12 V
Cold Side / Warm Side
23 A
200 W
400mm L x 180mm W x 197.3mm H
Modulo X 400-24
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Quantity
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PCB Symbol, Footprint & 3D Model
Modulo
-
-
Air to Air
275 W
48 V
Cold Side / Warm Side
10 A
-
253mm L x 415mm W x 229mm H
Modulo X 275-48
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Quantity
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PCB Symbol, Footprint & 3D Model
Modulo
-
-
Air to Air
400 W
24 V
Cold Side / Warm Side
30 A
-
253mm L x 290mm W x 229mm H
Modulo X 275-24
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Quantity
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PCB Symbol, Footprint & 3D Model
Modulo
-
-
Air to Air
275 W
12 V
Cold Side / Warm Side
20 A
-
253mm L x 290mm W x 229mm H
Modulo X 150-12
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Quantity
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PCB Symbol, Footprint & 3D Model
Modulo
-
-
Air to Air
150 W
24 V
Cold Side / Warm Side
10 A
-
253mm L x 165mm W x 229mm H
Modulo X 150-24
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Quantity
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PCB Symbol, Footprint & 3D Model
Modulo
-
-
Air to Air
275 W
24 V
Cold Side / Warm Side
20 A
-
253mm L x 165mm W x 229mm H
DAC046-24-02-00-00
CASCADE SERIES, DIRECT-TO-AIR, T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
387001145
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
LAC046-24-02-00-00
LIQUID SERIES, LIQUID-TO-AIR, TH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
43700000166001
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
1237881
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Quantity
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PCB Symbol, Footprint & 3D Model
EV-HPC
-20°C ~ 50°C
-
Liquid to Air
-
24 V
Cold Side
1.97 A
-
403mm L x 198mm W x 534mm H
ATS-WFF-200W-24-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Air to Air
145 W
24 V
Cold Side / Warm Side
11.5 A
200 W
400mm L x 180mm W x 197.3mm H
ATS-WFF-150W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0°C ~ 70°C
-
Air to Air
83 W
12 V
Cold Side / Warm Side
16.5 A
150 W
300mm L x 160mm W x 170.1mm H
ATS-WFF-100W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0°C ~ 50°C
-
Air to Air
59 W
12 V
Cold Side / Warm Side
14 A
100 W
250mm L x 133mm W x 159.1mm H
ATS-FF-100W-24-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Air to Air
59 W
24 V
Cold Side / Warm Side
7 A
100 W
250mm L x 133mm W x 159.1mm H
ATS-FF-150W-24-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Air to Air
90 W
24 V
Cold Side / Warm Side
8.2 A
150 W
300mm L x 160mm W x 170.1mm H
ATS-FW-72W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Liquid to Air
72 W
12 V
Warm Side
9 A
72 W
190mm L x 94mm W x 104.3mm H
ATS-FP-70W-24-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0°C ~ 70°C
-
Direct to Air
59 W
24 V
Warm Side
4.2 A
70 W
200mm L x 130mm W x 117mm H
ATS-FP-70W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0°C ~ 70°C
-
Direct to Air
56 W
12 V
Warm Side
8.4 A
70 W
200mm L x 130mm W x 117mm H
ATS-WFF-60W-12-C
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-10°C ~ 70°C
-
Air to Air
28 W
12 V
Cold Side / Warm Side
7.3 A
60 W
200mm L x 133mm W x 146.6mm H

About  Thermoelectric, Peltier Assemblies

A thermoelectric (TE) module, also known as a Peltier assembly, is a semiconductor device that utilizes the Peltier effect to transfer heat from one side of the module to the other when a low voltage DC power source is applied. This unique phenomenon allows for cooling on one face of the module while simultaneously heating the opposite face. By reversing the polarity of the DC voltage, the direction of heat transfer can be reversed as well. TE modules can also generate an electric current when a temperature differential is applied across the device. This characteristic makes them versatile in applications where both heating and cooling are required, such as temperature regulation in electronic devices, environmental control systems, and scientific instrumentation. TE modules are classified based on various factors including the type of heat transfer, cooling power, current rating, voltage requirements, and overall dimensions. The choice of a specific TE module depends on the particular application's thermal management needs and desired performance characteristics. These modules find application in diverse industries, including automotive, aerospace, telecommunications, medical, and consumer electronics. They provide efficient and compact cooling solutions for electronic components, enabling precise temperature control and thermal stabilization. In summary, thermoelectric modules or Peltier assemblies harness the Peltier effect to achieve heat transfer and temperature control. Their ability to generate cooling or heating effects by applying a low voltage DC power source makes them invaluable in numerous industries where precise thermal management is essential.