ulTIMiFlux™ Series, Pads, Sheets

Results:
75
Manufacturer
Series
Outline
Usage
Thermal Conductivity
Color
Thickness
Shape
Adhesive
Type
Backing, Carrier
Material
Thermal Resistivity
Results remaining75
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ulTIMiFlux™
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ImageProduct DetailPriceAvailabilityECAD ModelUsageColorShapeMaterialSeriesBacking, CarrierTypeOutlineThicknessAdhesiveThermal ResistivityThermal Conductivity
PL-2-1-254
THERM PAD 25.4MMX25.4MM GRAY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0790" (2.000mm)
Tacky - Both Sides
-
1.0W/m-K
PL-2-1-1016
THERM PAD 101.6MMX101.6MM GRAY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
101.60mm x 101.60mm
0.0790" (2.000mm)
Tacky - Both Sides
-
1.0W/m-K
PL-2-5-1016
THERM PAD 101.6MMX101.6MM GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gold
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
101.60mm x 101.60mm
0.0790" (2.000mm)
Tacky - Both Sides
-
5.0W/m-K
PL-2-5-254-H
THERM PAD 25.4MMX25.4MM GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gold
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0790" (2.000mm)
Tacky - One Side
-
5.0W/m-K
CD-02-05-C-22
THERM PAD 21.49MMX21.49MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Orange
Square
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
21.49mm x 21.49mm
0.0030" (0.076mm)
-
-
-
CD-02-05-LED-1
THERM PAD 25.4MM DIA ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
LED
Orange
Round
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
25.40mm Dia
0.0030" (0.076mm)
-
-
-
CD-02-05-REC-125
THERM PAD 31.75MMX31.75MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectifier
Orange
Square
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
31.75mm x 31.75mm
0.0030" (0.076mm)
-
-
-
CD-02-05-3-8
THERM PAD 39.37X26.67MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TO-3
Orange
Rhombus
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
39.37mm x 26.67mm
0.0030" (0.076mm)
-
-
-
CD-02-05-3-4
THERM PAD 39.37X26.67MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TO-3
Orange
Rhombus
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
39.37mm x 26.67mm
0.0030" (0.076mm)
-
-
-
CD-02-05-247
THERM PAD 24.13MMX19.05MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TO-247
Orange
Rectangular
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
24.13mm x 19.05mm
0.0030" (0.076mm)
-
-
-
PL-1-5-1016-H
THERM PAD 101.6MMX101.6MM GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gold
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
101.60mm x 101.60mm
0.0390" (0.991mm)
Tacky - One Side
-
5.0W/m-K
PL-1-14-76X127-65
THERM PAD 127MMX76.2MM PURP
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Quantity
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PCB Symbol, Footprint & 3D Model
Multi
Purple
Rectangular
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
127.00mm x 76.20mm
0.0394" (1.000mm)
Tacky - One Side
-
14W/m-K
PL-1-3-254
THERM PAD 25.4MMX25.4MM GREEN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Green
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0390" (0.991mm)
Tacky - Both Sides
-
3.0W/m-K
PL-1-5-254
THERM PAD 25.4MMX25.4MM GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gold
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0390" (0.991mm)
Tacky - Both Sides
-
5.0W/m-K
PL-05-3-254-H
THERM PAD 25.4MMX25.4MM GREEN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Green
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0197" (0.500mm)
Tacky - One Side
-
3.0W/m-K
PL-05-3-254
THERM PAD 25.4MMX25.4MM GREEN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Green
Square
Silicone Elastomer
ulTIMiFlux™
-
Gap Filler Pad, Sheet
25.40mm x 25.40mm
0.0197" (0.500mm)
Tacky - Both Sides
-
3.0W/m-K
CD-02-05-247-2
THERM PAD 38.1X24.13MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TO-247
Orange
Rectangular
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
38.10mm x 24.13mm
0.0030" (0.076mm)
-
-
-
CD-02-05-C-18
THERM PAD 17.5MMX17.5MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Orange
Square
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
17.50mm x 17.50mm
0.0030" (0.076mm)
-
-
-
CD-02-05-220-2
THERM PAD 25.4MMX12.7MM ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TO-220
Orange
Rectangular
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
25.40mm x 12.70mm
0.0030" (0.076mm)
-
-
-
CD-02-05-DO5
THERM PAD 25.4MM DIA ORANGE
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Quantity
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PCB Symbol, Footprint & 3D Model
DO-5
Orange
Round
Phase Change Compound
ulTIMiFlux™
Polyimide
Pad, Sheet
25.40mm Dia
0.0030" (0.076mm)
-
-
-

About  Pads, Sheets

Thermal interface pads and thermal interface materials are designed to provide heat transfer between components and heatsinks. They are made from a variety of different materials and thicknesses, which determine their thermal conductivity and/or resistance. Some thermal interface pads and materials are coated on one or both sides with an adhesive to help maintain contact with the surfaces they are applied to. The main purpose of these thermal interface materials is to fill in small gaps and irregular shapes that exist between components and heatsinks. These imperfections slow down heat transfer, causing the component temperature to rise and decreasing performance. By filling these gaps, thermal interface pads and materials can enhance the efficiency of the interface's heat transfer, resulting in more effective heat dissipation. Thermal interface pads and materials can be made from a variety of materials such as silicon-based compounds, lubricant-like substances, phase-change materials, and synthetic graphite sheets. Each material has its unique combination of thermal properties, such as thermal conductivity and thermal resistance, which determine its effectiveness in promoting heat transfer. Thickness is also a critical factor that affects the thermal performance of thermal interface pads and materials. Thinner pads and materials typically offer lower thermal resistance and better thermal conductivity, while thicker pads and materials may have other advantages, such as better adaptability and less susceptibility to surface roughness. Some thermal interface pads and materials come with adhesive coatings, which serve several purposes. They enhance the contact between the thermal interface pad or material and the surfaces it is applied to, ensuring optimal heat transfer. Adhesives also help maintain the mechanical stability of the thermal interface pad or material, preventing displacement or separation caused by vibration or other external factors. In summary, thermal interface pads, thermal interface materials, and similar materials aim to improve heat transfer efficiency between components and heatsinks by filling in micro-imperfections. They use different materials and thicknesses, where each material provides specific thermal properties. Adhesive coatings help maintain contact and stability. By using thermal interface pads, thermal interface materials, and similar materials, significant improvements in overall thermal management in electronic devices can be achieved, resulting in improved performance, reliability, and lifespan.