VC Series, Heat Pipes, Vapor Chambers

Results:
4
Manufacturer
Series
Thermal Resistance
Width
Platform
Length
Shape
Power - Cooling
Height
Operating Temperature
Wick Type
Material
Type
Features
Attachment Method
Diameter
Results remaining4
Applied Filters:
VC
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesShapeMaterialWidthHeightDiameterSeriesLengthTypeAttachment MethodPower - CoolingThermal ResistanceWick TypeOperating TemperaturePlatform
VC-106-70-3
STANDARD VAPOR CHAMBER 106X70X3M
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Rectangular
-
2.756" (70.00mm)
0.118" (3.00mm)
-
VC
4.173" (106.00mm)
Vapor Chamber
Bolt On
150W
0.150°C/W
-
40°C ~ 140°C
Intel 2011 Narrow
VC-90-90-3
STANDARD VAPOR CHAMBER 90X90X3.0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Square
-
3.543" (90.00mm)
0.118" (3.00mm)
-
VC
3.543" (90.00mm)
Vapor Chamber
Bolt On
150W
0.143°C/W
-
40°C ~ 140°C
Intel 2011 Square
VC-106-82-3
STANDARD VAPOR CHAMBER 106X82X3M
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Rectangular
-
3.228" (82.00mm)
0.118" (3.00mm)
-
VC
4.173" (106.00mm)
Vapor Chamber
Bolt On
150W
0.140°C/W
-
40°C ~ 140°C
Intel 2011 Narrow
VC-1131-8175-517
STANDARD VAPOR CHAMBER 113.1X81.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
Rectangular
-
3.219" (81.75mm)
0.204" (5.17mm)
-
VC
5.240" (113.00mm)
Vapor Chamber
Bolt On
180W
0.145°C/W
-
40°C ~ 140°C
VGA

Heat Pipes, Vapor Chambers

Thermal heat pipes and vapor chambers are essential devices used for transferring heat between two interfaces. They work by heating a liquid until it becomes a vapor on the hot interface, after which the vapor travels to the cold interface and condenses back into a liquid. This process allows for efficient thermal transfer across a wide range of temperatures and applications. These heat transfer devices come in various shapes such as flat, rectangular, round, and square, with each shape being suitable for different types of systems and spaces. The choice of shape depends on factors such as available space, power requirements, and desired cooling performance. Moreover, thermal heat pipes and vapor chambers are identified by their unique properties such as power cooling, thermal resistance, and wick type. These characteristics determine the efficiency and effectiveness of the device in transferring heat in different environments and applications. Power cooling refers to the rate at which the device can dissipate heat, while thermal resistance measures the ability of the device to resist heat flow. Wick type, on the other hand, refers to the material used to line the interior of the device, which affects the rate and efficiency of heat transfer. In summary, thermal heat pipes and vapor chambers are crucial devices used in various industries for efficient thermal management. Their ability to transfer heat between two interfaces with high efficiency and reliability makes them essential for achieving optimal performance and longevity of electronic devices, power systems, and other applications that require efficient heat dissipation. The choice of device depends on factors such as available space, power requirements, and desired cooling performance, with their unique properties determining their efficiency and effectiveness in different applications.