Adhesives, Epoxies, Greases, Pastes

Results:
649
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining649
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ImageProduct DetailPriceAvailabilityECAD ModelFeaturesColorShelf LifeTypeSeriesSize / DimensionUsable Temperature RangeThermal ConductivityStorage/Refrigeration Temperature
G3380NA-120-KIT
NON-SILICONE THERMAL GREASE, 120
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
60 Months
Non-Silicone Grease
LiPOLY® G3380N
120 gram Cartridge
-76°F ~ 302°F (-60°C ~ 150°C)
1.30W/m-K
77°F (25°C) or Below
100500F00000G
THERMAL PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
24 Months
Silicone Compound
Therolink 1000
5 oz Tube
-40°F ~ 392°F (-40°C ~ 200°C)
0.73W/m-K
-
A14855-03
THERMAL GREASE .5KG TGREASE 1500
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Quantity
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PCB Symbol, Footprint & 3D Model
Low Outgassing (ASTM E595)
White
-
Silicone Compound
Tgrease™ 1500
500 gram Container
257°F (125°C)
1.20W/m-K
-
A16849-00
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Tgrease™ 300X
-
-
-
-
A14399-02
THERMAL GREASE 30CC TGREASE 2500
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Quantity
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PCB Symbol, Footprint & 3D Model
Low Outgassing (ASTM E595)
White
-
Non-Silicone Grease
Tgrease™ 2500
30cc Syringe
-67°F ~ 302°F (-50°C ~ 150°C)
3.80W/m-K
-
DM-TIM-15015-SY-30
Dycotec Materials Ltd
NON-SILICONE THERMAL GEL, 1.5 W/
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
-
Non-Silicone Paste
DM-TIM
30cc Syringe
-40°C ~ 125°C
1.50W/m-K
-
2746206
TGF3000SF-00-1500-7GAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Blue
6 Months
Liquid Gap Filler, 2 Part
Gap Filler 3000SF
7 gal Pail
-40°F ~ 212°F (-40°C ~ 100°C)
3.00W/m-K
77°F (25°C)
2641198
BERGQUIST LIQUIFORM TLF 6000HG 1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
12 Months
Silicone Gel
LIQUI FORM TLF 6000HG
-
-76°F ~ 392°F (-60°C ~ 200°C)
6.00W/m-K
77°F (25°C)
8327GF25-50CC
THERMAL GAP FILL LIQUID SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
6 Months
Silicone Gap Filler
8327GF25
50 ml Cartridges
-
2.50W/m-K
14°F ~ 104°F (-10°C ~ 40°C)
GL-08-10
ULTIMIFLUX GEL 10CC SYRINGE 2.4W
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Yellow
-
Gel Gap Filler
ulTIMiFlux™
10cc Syringe
-67°F ~ 392°F (-55°C ~ 200°C)
2.40W/m-K
-
65-00-T630-0300
THERM-A-GAP T630 0.7W/M-K 300CC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
18 Months
Gel Gap Filler
THERM-A-GAP™ GEL T630
300cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
0.70W/m-K
-
S606P-30
SILICONE THERMAL GREASE 30G JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
12 Months
Silicone Grease
S606
30 gram Jar
-40°F ~ 356°F (-40°C ~ 180°C)
8.00W/m-K
77°F (25°C) or Below
TG-A7000-1000
SILICONE PUTTY 1KG POT GREEN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Green
12 Months
Silicone Putty
TG
1 kg Container
-58°F ~ 356°F (-50°C ~ 180°C)
7.00W/m-K
-
TG-A7000-330CC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Green
12 Months
Silicone Putty
-
330cc Syringe
-58°F ~ 356°F (-50°C ~ 180°C)
7.00W/m-K
-
103900F00000G
12 OZ. SEMCO CARTRIDGE GREASE NO
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
24 Months
Non-Silicone Grease
-
12 oz Cartridge
-40°F ~ 356°F (-40°C ~ 180°C)
1.40W/m-K
-
TG-NSP35LV-1LB
NON-SILICONE THERMAL PUTTY 1LB L
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
60 Months
Non-Silicone Putty
TG-NSP35LV
1 lb Can
-40°F ~ 392°F (-40°C ~ 200°C)
3.50W/m-K
-
TG-NSP80-4OZ
NON-SILICONE PUTTY 4OZ GREY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
60 Months
Non-Silicone Putty
TG
4 oz Jar
-67°F ~ 392°F (-55°C ~ 200°C)
8.30W/m-K
-
TG-NSP35-30CC
NON-SILICONE PUTTY 30CC GREY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
60 Months
Non-Silicone Putty
TG
30cc Cartridge
-40°F ~ 392°F (-40°C ~ 200°C)
3.50W/m-K
-
1188135
STYCAST 2850KT BLU 20#
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Blue
12 Months
Epoxy, 2 Part (Order Catalyst Separately)
LOCTITE® Stycast 2850KT Catalyst 11
20 lb Container
-67°F ~ 311°F (-55°C ~ 155°C)
2.78W/m-K
-
TG-NSP80-1LB
NON-SILICONE PUTTY 1LB GREY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
60 Months
Non-Silicone Putty
TG
1 lb Can
-67°F ~ 392°F (-55°C ~ 200°C)
8.30W/m-K
-

About  Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.