Adhesives, Epoxies, Greases, Pastes

Results:
648
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining648
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ImageProduct DetailPriceAvailabilityECAD ModelColorFeaturesShelf LifeStorage/Refrigeration TemperatureTypeSeriesSize / DimensionUsable Temperature RangeThermal Conductivity
152-KA-NC
DELTABOND KIT (7 OZ RESIN, 0.5 O
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
36 Months
-
Epoxy, 2 Part
DeltaBond™ 152
0.5 oz, 7.5 oz Bottles
149°F (65°C)
0.83W/m-K
TH949-1-50G-2JAR
SILICONE THERMAL PUTTY (2 PACKS)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
Low Outgassing
18 Months
-
Silicone Putty
TH949-1
50 gram Jar
-40°F ~ 392°F (-40°C ~ 200°C)
11.00W/m-K
TH855-5-30G-4SYR
SILICONE THERMAL PUTTY (4 PACKS)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
18 Months
-
Silicone Putty
TH855-5LB
30 gram Syringe
-40°F ~ 392°F (-40°C ~ 200°C)
5.00W/m-K
TH235-2-500G-JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
-
18 Months
-
Non-Silicone Putty
TH235-2
500 gram Container
5°F ~ 248°F (-15°C ~ 200°C)
4.00W/m-K
TH855-5-50G-4JAR
SILICONE THERMAL PUTTY (4 PACKS)
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
18 Months
-
Silicone Putty
TH855-5LB
50 gram Jar
-40°F ~ 392°F (-40°C ~ 200°C)
5.00W/m-K
A18000-04
TFLEX CR350 400CC,CARTRIDGE
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Pink
-
9 Months
-
Silicone Gap Filler
Tflex™ CR350
400cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
3.60W/m-K
A15028-01
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
24 Months
-
Silicone Grease
Tgrease™ 880
500 gram Container
-40°F ~ 302°F (-40°C ~ 150°C)
3.10W/m-K
2711510
GF4500CVO-00-240-400CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Pink
-
6 Months
77°F (25°C)
Liquid Gap Filler, 2 Part
Gap Filler 4500CVO
400cc Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
4.50W/m-K
A16849-13
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
-
-
Silicone Grease
Tgrease™ 300X
-
-
3.00W/m-K
A16412-01
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Quantity
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PCB Symbol, Footprint & 3D Model
Turquoise
Low Outgassing (ASTM E595), Odorless
-
-
Silicone Putty
Tputty™ 506
75cc Cartridge
-49°F ~ 392°F (-45°C ~ 200°C)
3.50W/m-K
S-PUTTY-100-KIT
THERMAL PUTTY 100G PLUS APPLICAT
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
-
-
-
Silicone Putty
LiPOLY® S-Putty
100 gram Cartridge
-76°F ~ 356°F (-60°C ~ 180°C)
3.50W/m-K
EPDM20-135
NON-SILICONE TWO-PART THERMAL LI
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, White
-
60 Months
77°F (25°C) or Below
Liquid Gap Filler, 2 Part
LiPOLY® EPDM20
50 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
2.2W/m-K
101700F00000G
THERMAL PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
60 Months
-
Non-Silicone Compound
Sil-Free™
1.5 oz Syringe
-40°F ~ 392°F (-40°C ~ 200°C)
0.79W/m-K
8329TFS-50ML
SLOW CURE THERM COND ADH FLOW
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
36 Months
50°F ~ 86°F (10°C ~ 30°C)
Epoxy, 2 Part
8329TFS
45 ml Cartridge
-40°F ~ 302°F (-40°C ~ 150°C)
1.20W/m-K
GF1500-00-60-50CC
GF1500 50CC DUAL CARTRIDGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Yellow
-
6 Months
77°F (25°C)
Liquid Gap Filler, 2 Part
Gap Filler 1500
50cc Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
1.80W/m-K
1978-DP
SILICONE FREE HEAT SINK COMP.
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
60 Months
Ambient Temperature
Non-Silicone Compound
-
4 oz Tube
-
-
GCS-045-GS-WE-1KG
European Thermodynamics Ltd
THERMAL GREASE, 4.5W/M K, 1KG
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
24 Months
-
Silicone Grease
GCS
1 kg Container
-40°F ~ 392°F (-40°C ~ 200°C)
4.50W/m-K
TG-PP10-1000
ONE-PART THERMAL PUTTY 1000G POT
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
6 Months
-58°F ~ 392°F (-50°C ~ 200°C)
Silicone Putty
TG-PP-10
1 kg Container
-58°F ~ 392°F (-50°C ~ 200°C)
10.00W/m-K
EPDM30-135-KIT
NON-SILICONE TWO-PART THERMAL LI
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, White
-
60 Months
77°F (25°C) or Below
Liquid Gap Filler, 2 Part
LiPOLY® EPDM30
50 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
3.00W/m-K
TIC1000A-00-00-25CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
-
-
-
TIC™ 1000A
25cc Tube
302°F (150°C)
1.50W/m-K

Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.