QUAD Clip™ Series, IC Clips

Test clips for ICs are essential tools used to establish temporary electrical connections between an IC chip and a measurement device. These clips are specifically designed with multiple contact points and a spring-loaded mechanism to ensure reliable and secure connections to the leads of an IC. There are several types of IC packages commonly used in electronic circuits, and test clips are available to accommodate various IC package styles. Some of the commonly supported IC package types include: DIP (Dual In-Line Package): DIP test clips are designed to connect to ICs with pins arranged in two parallel rows. This package style is commonly found in older through-hole technology. LCC (Leadless Chip Carrier): LCC test clips are used for ICs with a leadless chip carrier package. This package style features leads on all four sides of the IC. PLCC (Plastic Leaded Chip Carrier): PLCC test clips are designed for ICs with a plastic leaded chip carrier package. This package style has leads around the periphery of the IC and requires a clip with a matching configuration. QFP (Quad Flat Package): QFP test clips are used for ICs with a quad flat package. This package style features a square or rectangular shape with leads on all four sides. SOIC (Small Outline Integrated Circuit): SOIC test clips are designed for ICs with a small outline integrated circuit package. This package style typically has leads on two sides of the IC. SSOP (Shrink Small Outline Package): SSOP test clips are used for ICs with a shrink small outline package. This package style features smaller dimensions compared to SOIC and has leads on two sides of the IC. The number of positions refers to the total number of leads or pins on an IC package. Test clips are available in different configurations to support various IC sizes, ranging from 8 positions (1 x 8 or 2 x 4) to larger packages with up to 240 positions (17 x 17). In summary, test clips for ICs provide a temporary electrical connection between an IC chip and a measurement device. These clips are designed with multiple contact points and a spring-loaded mechanism to ensure a reliable and secure connection. They support various IC package types, such as DIP, LCC, PLCC, QFP, SOIC, and SSOP, with the number of positions ranging from 8 to 240. These test clips are invaluable tools for testing and troubleshooting ICs in electronic circuits.