片上系统 (SoC)

Results:
4,611
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Series
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Package / Case
Primary Attributes
Speed
Connectivity
Core Processor
Peripherals
RAM Size
Operating Temperature
Architecture
Flash Size
Type
Function
Voltage - Supply
Utilized IC / Part
Embedded
Grade
Mounting Type
Qualification
Serial Interfaces
Data Interface
Voltage Supply Source
Power - Output
Number of Channels
Supplied Contents
Current - Receiving
Modulation
Data Rate (Max)
Protocol
Number of Logic Elements/Cells
Resolution (Bits)
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Current - Transmitting
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Results remaining4,611
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradePackage / CaseSupplier Device PackageCore ProcessorSpeedFlash SizeRAM SizePeripheralsSeriesArchitectureConnectivityPrimary AttributesQualification
5CSEBA5U19I7N
IC SOC CORTEX-A9 800MHZ 484UBGA
5+
$971.8310
10+
$907.0423
15+
$874.6479
Quantity
1,611 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-FBGA
484-UBGA (19x19)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 85K Logic Elements
-
5CSEBA4U19C8SN
IC SOC CORTEX-A9 600MHZ 484UBGA
5+
$253.5211
10+
$236.6197
15+
$228.1690
Quantity
1,600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
484-FBGA
484-UBGA (19x19)
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
600MHz
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
-
M2S010-VFG400
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
$38.0282
10+
$35.4930
15+
$34.2254
Quantity
1,600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
400-LFBGA
400-VFBGA (17x17)
ARM® Cortex®-M3
166MHz
256KB
64KB
DDR, PCIe, SERDES
SmartFusion®2
MCU, FPGA
CANbus, Ethernet, I²C, SPI, UART/USART, USB
FPGA - 10K Logic Modules
-
XCZU9CG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA
5+
$253.5211
10+
$236.6197
15+
$228.1690
Quantity
1,568 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
533MHz, 1.3GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
-
A2F500M3G-FGG484
IC SOC CORTEX-M3 80MHZ 484FBGA
5+
$528.1690
10+
$492.9577
15+
$475.3521
Quantity
1,566 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
484-BGA
484-FPBGA (23x23)
ARM® Cortex®-M3
80MHz
512KB
64KB
DMA, POR, WDT
SmartFusion®
MCU, FPGA
EBI/EMI, Ethernet, I²C, SPI, UART/USART
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
-
XC7Z035-3FFG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA
5+
$137.3239
10+
$128.1690
15+
$123.5915
Quantity
1,566 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
676-BBGA, FCBGA
676-FCBGA (27x27)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
1GHz
-
256KB
DMA
Zynq®-7000
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Kintex™-7 FPGA, 275K Logic Cells
-
XCZU2EG-1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$221.8310
10+
$207.0423
15+
$199.6479
Quantity
1,550 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
500MHz, 600MHz, 1.2GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XC7Z007S-2CLG225E
IC SOC CORTEX-A9 766MHZ 225BGA
5+
$84.5070
10+
$78.8732
15+
$76.0563
Quantity
1,510 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
225-LFBGA, CSPBGA
225-CSPBGA (13x13)
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
766MHz
-
256KB
DMA
Zynq®-7000
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Artix™-7 FPGA, 23K Logic Cells
-
5CSXFC2C6U23I7N
IC SOC CORTEX-A9 800MHZ 672UBGA
5+
$1161.9718
10+
$1084.5070
15+
$1045.7746
Quantity
1,500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
672-FBGA
672-UBGA (23x23)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
Cyclone® V SX
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
-
XC7Z020-2CLG400E
IC SOC CORTEX-A9 766MHZ 400BGA
5+
$27.0423
10+
$25.2394
15+
$24.3380
Quantity
1,500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
766MHz
-
256KB
DMA
Zynq®-7000
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Artix™-7 FPGA, 85K Logic Cells
-
XAZU3EG-1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$185.9155
10+
$173.5211
15+
$167.3239
Quantity
1,500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
500MHz, 1.2GHz
-
1.8MB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MPU, FPGA
CANbus, I²C, SPI, UART/USART, USB
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-
XA7Z020-1CLG400Q
IC SOC CORTEX-A9 667MHZ 400BGA
5+
$24.9296
10+
$23.2676
15+
$22.4366
Quantity
1,464 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 125°C (TJ)
Automotive
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
667MHz
-
256KB
DMA
Zynq®-7000 XA
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Artix™-7 FPGA, 85K Logic Cells
AEC-Q100
10AS066H3F34E2SG
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
5+
$792.2535
10+
$739.4366
15+
$713.0282
Quantity
1,460 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1152-BBGA, FCBGA
1152-FBGA, FC (35x35)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
1.5GHz
-
256KB
DMA, POR, WDT
Arria 10 SX
MCU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 660K Logic Elements
-
XC7Z030-2FBG484E
IC SOC CORTEX-A9 800MHZ 484FCBGA
5+
$169.0141
10+
$157.7465
15+
$152.1127
Quantity
1,450 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
484-BBGA, FCBGA
484-FCBGA (23x23)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
256KB
DMA
Zynq®-7000
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Kintex™-7 FPGA, 125K Logic Cells
-
XCZU2EG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$625.3521
10+
$583.6620
15+
$562.8169
Quantity
1,450 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
500MHz, 600MHz, 1.2GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU9EG-1FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
5+
$739.4366
10+
$690.1408
15+
$665.4930
Quantity
1,426 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
500MHz, 600MHz, 1.2GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
-
M2S005-VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
$32.7465
10+
$30.5634
15+
$29.4718
Quantity
1,420 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
400-LFBGA
400-VFBGA (17x17)
ARM® Cortex®-M3
166MHz
128KB
64KB
DDR
SmartFusion®2
MCU, FPGA
CANbus, Ethernet, I²C, SPI, UART/USART, USB
FPGA - 5K Logic Modules
-
XA7Z030-1FBV484Q
IC SOC CORTEX-A9 667MHZ 484FCBGA
5+
$179.5775
10+
$167.6056
15+
$161.6197
Quantity
1,358 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 125°C (TJ)
Automotive
484-BBGA, FCBGA
484-FCBGA (23x23)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
667MHz
-
256KB
DMA
Zynq®-7000 XA
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Kintex™-7 FPGA, 125K Logic Cells
AEC-Q100
XC7Z014S-1CLG400I
IC SOC CORTEX-A9 667MHZ 400BGA
5+
$179.5775
10+
$167.6056
15+
$161.6197
Quantity
1,350 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
667MHz
-
256KB
DMA
Zynq®-7000
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Artix™-7 FPGA, 65K Logic Cells
-
XCZU3EG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$120.4225
10+
$112.3944
15+
$108.3803
Quantity
1,330 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
533MHz, 600MHz, 1.3GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-

片上系统 (SoC)

片上系统(SoC)是指将计算机系统的各种组件集成到一颗芯片上的集成电路。它通常包括处理器核心、存储器、输入输出接口和其他必要的外设,以支持系统的运作。SoC技术使得嵌入式系统变得紧凑、功耗低且高度集成。 功能和特点:SoC将多个系统组件集成到一颗芯片中,以紧凑的形态提供完整的解决方案。它们通常包括处理器核心,如ARM Cortex-A系列或RISC-V核心,以及存储器单元(RAM和/或闪存)、输入输出接口(USB、以太网、UART等)、定时器、中断、模数转换器(ADC)和其他特定应用所需的外设。SoC可以根据应用需求进行定制和编程,以执行各种功能。 使用场景:SoC广泛应用于对空间、功耗效率和集成度要求较高的嵌入式系统中。它们在众多场景中发挥作用,包括消费电子(智能手机、平板电脑、智能电视)、汽车系统(信息娱乐、发动机控制、高级驾驶辅助系统)、工业自动化、医疗设备、物联网设备等。SoC能够开发功能丰富、紧凑、具有成本效益的嵌入式系统。 应用领域:SoC在各个行业和领域中被广泛应用。在消费电子领域,SoC为智能手机、平板电脑、可穿戴设备和家用电器提供动力。汽车系统依赖SoC实现车载娱乐、导航和安全功能。工业自动化利用SoC进行控制系统、机器人和监测设备。医疗设备,如植入式设备和诊断工具,受益于SoC提供的紧凑性和集成性。SoC在物联网设备中也起着重要作用,实现了连接性、传感器集成和智能处理。 关键优势: 集成度:SoC将多个系统组件集成到一颗芯片中,减小了尺寸、复杂度和功耗。 紧凑性:将各种组件组合到一颗芯片上,实现了紧凑和便携的嵌入式系统。 功耗效率:SoC设计优化了功耗,适用于电池供电和节能应用。 可定制性:SoC可以定制和编程,以满足特定的应用需求,提供灵活性和适应性。 成本效益:SoC通过将多个组件集成到一颗芯片上,减少了对额外硬件的需求,提供了经济实惠的解决方案。 总而言之,嵌入式系统片上系统(SoC)是将多个系统组件集成到一颗芯片上的集成电路。SoC具有紧凑性、功耗低、可定制性和成本效益等特点,非常适用于各行业中各种嵌入式系统应用。