System On Chip (SoC)

Results:
4,611
Manufacturer
Series
Supplier Device Package
Package / Case
Primary Attributes
Speed
Connectivity
Core Processor
Peripherals
RAM Size
Operating Temperature
Architecture
Flash Size
Type
Function
Voltage - Supply
Utilized IC / Part
Embedded
Grade
Mounting Type
Qualification
Serial Interfaces
Data Interface
Voltage Supply Source
Power - Output
Number of Channels
Supplied Contents
Current - Receiving
Modulation
Data Rate (Max)
Protocol
Number of Logic Elements/Cells
Resolution (Bits)
Sampling Rate (Per Second)
Current - Transmitting
Total RAM Bits
Number of LABs/CLBs
Number of I/O
RF Family/Standard
GPIO
Sensitivity
Memory Size
Number of Gates
Frequency
Results remaining4,611
Select
ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradePackage / CaseSupplier Device PackageFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivitySpeedPrimary AttributesQualification
XCZU2CG-1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$84.5070
10+
$78.8732
15+
$76.0563
Quantity
2,383 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
10AS032E3F29I2SG
IC SOC CORTEX-A9 1.5GHZ 780FBGA
5+
$1161.9718
10+
$1084.5070
15+
$1045.7746
Quantity
2,250 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
780-BBGA, FCBGA
780-FBGA, FC (29x29)
-
256KB
DMA, POR, WDT
Arria 10 SX
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
-
XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$116.1972
10+
$108.4507
15+
$104.5775
Quantity
2,200 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 275K Logic Cells
-
XCZU2CG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$802.8169
10+
$749.2958
15+
$722.5352
Quantity
2,115 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU9EG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
5+
$591.5493
10+
$552.1127
15+
$532.3944
Quantity
2,082 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
-
M2S010-FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
$80.2817
10+
$74.9296
15+
$72.2535
Quantity
2,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-BGA
484-FPBGA (23x23)
256KB
64KB
DDR, PCIe, SERDES
SmartFusion®2
MCU, FPGA
ARM® Cortex®-M3
CANbus, Ethernet, I²C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-
XCZU2CG-1SBVA484I
IC SOC CORTEX-A53 484FCBGA
5+
$528.1690
10+
$492.9577
15+
$475.3521
Quantity
2,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XC7Z020-3CLG484E
IC SOC CORTEX-A9 866MHZ 484BGA
5+
$19.6479
10+
$18.3380
15+
$17.6831
Quantity
2,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
866MHz
Artix™-7 FPGA, 85K Logic Cells
-
5CSEBA4U23I7N
IC SOC CORTEX-A9 800MHZ 672UBGA
5+
$48.5915
10+
$45.3521
15+
$43.7324
Quantity
1,930 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
672-FBGA
672-UBGA (23x23)
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 40K Logic Elements
-
XC7Z007S-1CLG225I
IC SOC CORTEX-A9 667MHZ 225BGA
5+
$21.1268
10+
$19.7183
15+
$19.0141
Quantity
1,920 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
225-LFBGA, CSPBGA
225-CSPBGA (13x13)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix™-7 FPGA, 23K Logic Cells
-
XC7Z100-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$147.8873
10+
$138.0282
15+
$133.0986
Quantity
1,872 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 444K Logic Cells
-
XA7Z020-1CLG400I
IC SOC CORTEX-A9 667MHZ 400BGA
5+
$26.4085
10+
$24.6479
15+
$23.7676
Quantity
1,854 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
Automotive
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
-
256KB
DMA
Zynq®-7000 XA
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix™-7 FPGA, 85K Logic Cells
AEC-Q100
5CSEBA2U19C8N
IC SOC CORTEX-A9 600MHZ 484UBGA
5+
$507.0423
10+
$473.2394
15+
$456.3380
Quantity
1,836 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
484-FBGA
484-UBGA (19x19)
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 25K Logic Elements
-
XC7Z030-1FFG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
5+
$69.7183
10+
$65.0704
15+
$62.7465
Quantity
1,820 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
676-BBGA, FCBGA
676-FCBGA (27x27)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Kintex™-7 FPGA, 125K Logic Cells
-
XCZU3CG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$950.7042
10+
$887.3239
15+
$855.6338
Quantity
1,766 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-
XCZU4CG-L1FBVB900I
IC SOC CORTEX-A53 900FCBGA
5+
$211.2676
10+
$197.1831
15+
$190.1408
Quantity
1,735 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XAZU5EV-1SFVC784Q
IC FPGA SOC ZU EV Q100 784SBGA
5+
$143.6620
10+
$134.0845
15+
$129.2958
Quantity
1,695 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 125°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EV
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
-
XC7Z035-3FFG900E
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$160.5634
10+
$149.8592
15+
$144.5070
Quantity
1,660 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1GHz
Kintex™-7 FPGA, 275K Logic Cells
-
XCZU2CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$464.7887
10+
$433.8028
15+
$418.3099
Quantity
1,658 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
M2S005S-TQG144
IC SOC CORTEX-M3 166MHZ 144TQFP
5+
$16.9014
10+
$15.7746
15+
$15.2113
Quantity
1,647 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
144-LQFP
144-TQFP (20x20)
128KB
64KB
-
SmartFusion®2
MCU, FPGA
ARM® Cortex®-M3
CANbus, Ethernet, I²C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
-

System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.