Texas Instruments

Texas Instruments

Texas Instruments, commonly known as TI, is a global semiconductor company renowned for its broad portfolio of analog and embedded processing products. With a focus on empowering innovation, TI's semiconductor technologies enable a wide array of applications across industrial, automotive, consumer electronics, and communications sectors. The company's product offerings encompass analog integrated circuits, digital signal processors, microcontrollers, and power management solutions, catering to diverse industry needs. TI's dedication to quality and reliability is evident in its comprehensive testing and validation processes, ensuring that its products meet stringent industry standards. Furthermore, TI actively collaborates with customers to provide technical support, fostering strong partnerships and driving technological advancements. With a global presence and a legacy of over 90 years, Texas Instruments remains at the forefront of semiconductor innovation, delivering solutions that contribute to the advancement of technology and the improvement of everyday life.

System On Chip (SoC)

Results:
171
Series
Speed
Connectivity
Supplier Device Package
Package / Case
Core Processor
RAM Size
Operating Temperature
Architecture
Peripherals
Grade
Qualification
Flash Size
Primary Attributes
Results remaining171
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Texas Instruments
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperatureFlash SizeRAM SizePeripheralsPrimary AttributesArchitectureCore ProcessorSpeedPackage / CaseSupplier Device PackageConnectivityGradeQualification
TDA4VM88TGBALFRQ1
NEXT GENERATION SOC FAMILY FOR L
5+
$169.0141
10+
$157.7465
15+
$152.1127
Quantity
750 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
DRA821U4TCBALMQ1
5+
$57.4648
10+
$53.6338
15+
$51.7183
Quantity
713 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F
2GHz, 1GHz
433-BFBGA, FCBGA
433-FCBGA (17.2x17.2)
Ethernet, I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Automotive
AEC-Q100
TDA4AL88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
5+
$108.3803
10+
$101.1549
15+
$97.5423
Quantity
69 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1GHz
770-BFBGA, FCBGA
770-FCBGA (23x23)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
WDC6202GJL250X
WIRELESS 27MM 6202 WITH XBUS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
TDA3MVRBFABFRQ1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
512KB
DMA, PWM, WDT
-
DSP, MPU
ARM® Cortex®-M4, C66x
212.8MHz, 745MHz
367-BFBGA, FCBGA
367-FCBGA (15x15)
CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
-
-
DRA829VMTGBALFR
DUAL ARM CORTEX-A72, QUAD CORTEX
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 105°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
DRA829JMTGBALFRQ1
DUAL ARM CORTEX-A72, QUAD CORTEX
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 105°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
-
-
DRA829JMTGBALFR
DUAL ARM CORTEX-A72, QUAD CORTEX
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 105°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
-
-
DRA829VMTGBALFRQ1
DUAL ARM CORTEX-A72, QUAD CORTEX
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
-
-
TDA4VM88TGBALFR
NEXT GENERATION SOC FAMILY FOR L
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 105°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
TDA4VL21HGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP WITH
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1GHz
770-BFBGA, FCBGA
770-FCBGA (23x23)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
TDA4VE88TGAALZRQ1
AUTOMOTIVE SYSTEM-ON-A-CHIP FOR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
2MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1GHz
770-BFBGA, FCBGA
770-FCBGA (23x23)
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB
Automotive
AEC-Q100
DRA821U4TCBALMRQ1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F
2GHz, 1GHz
433-BFBGA, FCBGA
433-FCBGA (17.2x17.2)
Ethernet, I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Automotive
AEC-Q100
DRA829VMTGBALFQ1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
-
-
DRA829VMTGBALF
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 105°C (TJ)
-
1.5MB
DMA, PWM, WDT
-
DSP, MCU, MPU
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
2GHz, 1GHz, 1.35GHz, 1GHz
827-BFBGA, FCBGA
827-FCBGA (24x24)
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Automotive
AEC-Q100
TDA2LFBFQABCRQ1
SOC PROCESSOR FOR ADAS APPLICATI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
2.5MB
DMA, POR, PWM, WDT
-
DSP, MPU
Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
650MHz
760-BFBGA, FCBGA
760-FCBGA (23x23)
CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
-
-
TCI6630K2LXCMS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
KeyStone Multicore
0°C ~ 100°C (TC)
-
3MB
DDR, DMA, PCIe, POR, WDT
-
DSP, MPU
Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
1GHz
900-BFBGA, FCBGA
900-FCBGA (25x25)
Ethernet, I2C, PCIe, SPI, UART/USART, USB
-
-
TCI6636K2HDSAAW2L
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
KeyStone Multicore
0°C ~ 100°C (TC)
-
-
DDR, DMA, PCIe, POR, WDT
-
DSP, MPU
C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
1.2GHz
1517-BBGA, FCBGA
1517-FCBGA (40x40)
Ethernet, I²C, SPI, UART/USART, USB
-
-
TDA3MARBABFRQ1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
512KB
DMA, POR, PWM, WDT
-
DSP, MPU
ARM® Cortex®-M4, C66x
212.8MHz, 745MHz
367-BFBGA, FCBGA
367-FCBGA (15x15)
CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
-
-
TDA3LABBABFRQ1
LOW POWER SOC W/ VISION ACCELERA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 125°C (TJ)
-
512KB
DMA, POR, PWM, WDT
-
DSP, MPU
ARM® Cortex®-M4, C66x
212.8MHz, 355MHz
367-BFBGA, FCBGA
367-FCBGA (15x15)
CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
-
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.