NXP Semiconductors

NXP Semiconductors

NXP Semiconductors is a global leader in the semiconductor industry, providing high-performance mixed-signal and standard products for various applications. With a rich history dating back to 1953, NXP has established itself as a trusted provider of innovative solutions. Headquartered in the Netherlands, NXP operates in over 30 countries and employs approximately 30,000 people worldwide. Their mission is to create secure connections and infrastructure for a smarter world. NXP's product portfolio includes microcontrollers, secure identification solutions, automotive electronics, sensors, RF power amplifiers, connectivity solutions, and more. They actively collaborate with industry partners and research institutions to drive technological advancements and promote sustainability.

System On Chip (SoC)

Results:
35
Series
Supplier Device Package
Package / Case
Speed
Core Processor
RAM Size
Connectivity
Operating Temperature
Peripherals
Architecture
Serial Interfaces
Power - Output
Current - Receiving
Modulation
Voltage - Supply
Data Rate (Max)
Protocol
Primary Attributes
Current - Transmitting
Flash Size
Grade
Mounting Type
RF Family/Standard
GPIO
Type
Sensitivity
Qualification
Memory Size
Frequency
Results remaining35
Applied Filters:
NXP Semiconductors
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradeSpeedFlash SizeSeriesCore ProcessorPackage / CaseSupplier Device PackagePeripheralsPrimary AttributesArchitectureRAM SizeQualificationConnectivity
MIMX8MQ6DVAJZIB
5+
¥99.7183
10+
¥93.0704
15+
¥89.7465
Quantity
90 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.5GHz
-
i.MX8MQ
ARM® Cortex®-A53, ARM® Cortex®-M4
621-FBGA, FCBGA
621-FCPBGA (17x17)
DMA, PWM, WDT
-
MPU
160KB
-
AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
MIMX8ML8DVNLZCB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.8GHz, 800MHz
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i.MX8ML
ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
-
-
DMA, PWM, WDT
-
DSP, MCU, MPU
868KB
-
CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
MIMX9351DVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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MIMX8MN5DVPIZCA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.4GHz, 750MHz
-
i.MX8MN
ARM® Cortex®-A53, ARM® Cortex®-M7
306-TFBGA
306-TFBGA (11x11)
DMA, PWM, WDT
-
MPU
544KB
-
AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
MIMX9301DVVXDAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
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-
-
-
-
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MIMXRT1172CVM8AR
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 105°C (TJ)
-
800MHz
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RT1170
ARM Cortex-M7
289-LFBGA
289-LFBGA (14x14)
Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
-
MPU
2MB
-
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
MIMX9351XVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
-
-
-
-
-
-
-
-
-
-
-
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MIMX9331AVTXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
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-
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MIMX9331DVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
-
-
-
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MIMX8MN5DVPIZDA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.4GHz, 750MHz
-
i.MX8MN
ARM® Cortex®-A53, ARM® Cortex®-M7
306-TFBGA
306-TFBGA (11x11)
DMA, PWM, WDT
-
MPU
544KB
-
AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
QN9083CUK,019
QN908X: ULTRA-LOW-POWER BLUETOOT
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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*
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MIMX9321DVXXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
-
-
-
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MIMX8ML8DVNLZDB
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.8GHz, 800MHz
-
i.MX8ML
ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
-
-
DMA, PWM, WDT
-
DSP, MCU, MPU
868KB
-
CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
MIMX9331XVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
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MIMX9352DVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
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MIMX9352XVVXMAB
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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-
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MIMX8MM5DVTLZCA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 95°C (TJ)
-
1.8GHz, 400MHz
-
i.MX8MM
ARM® Cortex®-A53, ARM® Cortex®-M4
486-LFBGA, FCBGA
486-LFBGA (14x14)
DMA, PWM, WDT
-
MPU
288KB
-
AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
88MW322-A0-NXUE/AZ
88MW322 - 88MW32X 802.11n Wi-Fi
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Quantity
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PCB Symbol, Footprint & 3D Model
-30°C ~ 85°C
-
200MHz
-
-
ARM® Cortex®-M4F
88-VFQFN Exposed Pad
88-QFN (10x10)
DMA, PWM
-
MPU
512KB
-
I²C, SPI, SSP, UART
MSC7104ZQF
MSC7104 - INTEGRATED GPON OPTICA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
266MHz
-
-
PowerPC e300
456-BBGA
456-PBGA (35x35)
DDR2, JTAG
-
MPU
-
-
Ethernet, I²C, SPI, UART/USART
QN9021/D
ULTRA LOW POWER BLUETOOTH LE SOC
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 85°C (TA)
-
-
32-VFQFN Exposed Pad
32-HVQFN (5x5)
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.