Agilex F Series, System On Chip (SoC)

Results:
636
Manufacturer
Series
Primary Attributes
Supplier Device Package
Package / Case
Operating Temperature
Core Processor
Speed
Architecture
Flash Size
RAM Size
Grade
Peripherals
Qualification
Connectivity
Results remaining636
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Agilex F
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ImageProduct DetailPriceAvailabilityECAD ModelSupplier Device PackagePackage / CaseGradeOperating TemperatureFlash SizeRAM SizeSpeedPeripheralsArchitectureConnectivityPrimary AttributesCore ProcessorQualificationSeries
AGFB027R25A2E2V
IC FPGA AGILEX-F 2581FBGA
5+
$950.7042
10+
$887.3239
15+
$855.6338
Quantity
240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 2.7M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB008R24C2E3V
IC FPGA AGILEX-F 2340FBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB006R16A2E1V
IC FPGA AGILEX-F 1546FBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA006R16A2E1V
IC FPGA AGILEX-F 1546FBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB006R24C3E4X
IC FPGA AGILEX-F 2340FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB006R16A2I3E
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB006R16A2I2V
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB008R16A2E2V
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA008R16A2E3E
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA008R16A2E2V
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB008R24D2I2V
IC FPGA AGILEX-F 2340FBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
2340-BGA (45x42)
2340-BFBGA Exposed Pad
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA008R16A2I3V
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 764K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA014R24B3I3E
IC FPGA AGILEX-F 2486FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 1.4M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA006R16A2E4X
IC FPGA AGILEX-F 1546FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA006R24C2E1V
IC FPGA AGILEX-F 2340FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB014R24B3I3E
IC FPGA AGILEX-F 2486FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 1.4M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFA012R24C3I3V
IC FPGA AGILEX-F 2340FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 1.2M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB006R24C2E1V
IC FPGA AGILEX-F 2340FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 573K Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB012R24C3I3V
IC FPGA AGILEX-F 2340FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 1.2M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F
AGFB012R24B2E3E
IC FPGA AGILEX-F 2486FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
0°C ~ 100°C (TJ)
-
256KB
1.4GHz
DMA, WDT
MPU, FPGA
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 1.2M Logic Elements
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
Agilex F

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.