Virtex® UltraScale+™ Series, System On Chip (SoC)

Results:
10
Manufacturer
Series
Supplier Device Package
Package / Case
Primary Attributes
Core Processor
Speed
Operating Temperature
Architecture
Flash Size
RAM Size
Grade
Peripherals
Qualification
Connectivity
Results remaining10
Applied Filters:
Virtex® UltraScale+™
Select
ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSeriesGradeFlash SizeRAM SizeArchitectureCore ProcessorPeripheralsConnectivitySpeedPackage / CaseSupplier Device PackagePrimary AttributesQualification
XCVM1502-2HSIVFVC1760
XCVM1502-2HSIVFVC1760
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVC1502-2HSINSVG1369
XCVC1502-2HSINSVG1369
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ AI Core FPGA, 800k Logic Cells
-
XCVC1502-2HSIVSVA1596
XCVC1502-2HSIVSVA1596
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1596-BFBGA, FCBGA
1596-FCBGA (37.5x37.5)
Versal™ AI Core FPGA, 800k Logic Cells
-
XCVC1702-2HSINSVG1369
XCVC1702-2HSINSVG1369
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ AI Core FPGA, 1M Logic Cells
-
XCVE1752-2HSIVSVA1596
XCVE1752-2HSIVSVA1596
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1596-BFBGA, FCBGA
1596-FCBGA (37.5x37.5)
Versal™ AI Edge FPGA, 1M Logic Cells
-
XCVE1752-2HSINSVG1369
XCVE1752-2HSINSVG1369
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ AI Edge FPGA, 1M Logic Cells
-
XCVC1502-2HSIVSVA2197
XCVC1502-2HSIVSVA2197
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ AI Core FPGA, 800k Logic Cells
-
XCVE1752-2HSIVSVA2197
XCVE1752-2HSIVSVA2197
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ AI Edge FPGA, 1M Logic Cells
-
XCVC1702-2HSIVSVA1596
XCVC1702-2HSIVSVA1596
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
1596-BFBGA, FCBGA
1596-FCBGA (37.5x37.5)
Versal™ AI Core FPGA, 1M Logic Cells
-
XCVC1702-2HSIVSVA2197
XCVC1702-2HSIVSVA2197
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 110°C (TJ)
Virtex® UltraScale+™
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz, 1.65GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ AI Core FPGA, 1M Logic Cells
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.