PolarFire® Series, System On Chip (SoC)

Results:
161
Manufacturer
Series
Package / Case
Supplier Device Package
Operating Temperature
RAM Size
Primary Attributes
Connectivity
Core Processor
Speed
Architecture
Flash Size
Grade
Peripherals
Qualification
Results remaining161
Applied Filters:
PolarFire®
Select
ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureSeriesPackage / CaseSupplier Device PackageGradeSpeedFlash SizeCore ProcessorArchitectureRAM SizePeripheralsConnectivityPrimary AttributesQualification
MPFS250T-1FCG1152I
5+
$606.9718
10+
$566.5070
15+
$546.2746
Quantity
20 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
1152-BBGA, FCBGA
1152-FCBGA (35x35)
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250T-1FCSG536I
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-LFBGA, CSPBGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250TS-1FCSG536I
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-LFBGA, CSPBGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS160T-1FCSG536E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
536-BGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
1.4125MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 161K Logic Modules
-
MPFS160T-1FCVG484E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
1.4125MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 161K Logic Modules
-
MPFS095TL-FCSG536E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
536-BGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-FCVG784E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
784-BGA
784-BGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-FCVG484E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-1FCVG484E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-1FCVG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
784-BGA
784-BGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-1FCVG484I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-FCVG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
784-BGA
784-BGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095TS-1FCSG536I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-BGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095T-FCSG536I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-BGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS095TL-FCVG484E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
857.6KB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 93K Logic Modules
-
MPFS250TS-FCVG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250TL-FCG1152E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C
PolarFire®
1152-BBGA, FCBGA
1152-FCBGA (35x35)
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250TLS-FCVG484I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250TS-FCSG536I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-LFBGA, CSPBGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-
MPFS250TLS-FCSG536I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C
PolarFire®
536-LFBGA, CSPBGA
536-LFBGA
-
-
128KB
RISC-V
MPU, FPGA
2.2MB
DMA, PCI, PWM
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
FPGA - 254K Logic Modules
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.