Zynq® UltraScale+™ RFSoC DR Series, System On Chip (SoC)

Results:
16
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RAM Size
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Zynq® UltraScale+™ RFSoC DR
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradePackage / CaseSupplier Device PackageFlash SizeRAM SizeSeriesArchitectureCore ProcessorPeripheralsConnectivitySpeedPrimary AttributesQualification
XCZU55DR-1FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-1FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-1FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-2FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-L1FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-L2FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-1FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-2FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-L1FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq® UltraScale+™ RFSoC
-
XCZU55DR-L2FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-L2FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-
XCZU57DR-L2FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
-
Zynq® UltraScale+™ RFSoC DR
MPU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
DDR, DMA, PCIe, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq® UltraScale+™ RFSoC
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.