Zynq® UltraScale+™ RFSoC Series, System On Chip (SoC)

Results:
124
Manufacturer
Series
Peripherals
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Package / Case
Primary Attributes
Speed
Operating Temperature
Connectivity
Core Processor
Architecture
Flash Size
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Qualification
Results remaining124
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Zynq® UltraScale+™ RFSoC
Select
ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradePackage / CaseSupplier Device PackageSpeedFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivityPrimary AttributesQualification
XCZU47DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
5+
$739.4366
10+
$690.1408
15+
$665.4930
Quantity
910 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU67DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
5+
$1478.8732
10+
$1380.2817
15+
$1330.9859
Quantity
240 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
-
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
Zynq® UltraScale+™ RFSoC
-
XCZU47DR-2FFVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
5+
$5704.2254
10+
$5323.9437
15+
$5133.8028
Quantity
186 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU49DR-2FFVF1760E
IC ZUP RFSOC A53 FPGA 1760BGA
5+
$21126.7606
10+
$19718.3099
15+
$19014.0845
Quantity
100 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU49DR-L2FFVF1760I
IC ZUP RFSOC A53 FPGA LP 1760BGA
5+
$6760.5634
10+
$6309.8592
15+
$6084.5070
Quantity
17 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU42DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
-
XCZU49DR-2FFVF1760I
IC ZUP RFSOC A53 FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L1FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FFVG1517E
IC ZUP RFSOC A53 FPGA 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU48DR-1FSVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-2FSVH1760I
IC ZUP RFSOC A53 FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-2FSVG1517I
IC ZUP RFSOC A53 FPGA 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-L1FFVH1760I
IC ZUP RFSOC A53 FPGA LP 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
500MHz, 1.2GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU46DR-2FSVH1760E
IC ZUP RFSOC A53 FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU43DR-L2FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DDR, DMA, PCIe
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU47DR-L2FFVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-
XCZU47DR-L2FSVG1517I
IC ZUP RFSOC A53 FPGA LP 1517BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1517-BBGA, FCBGA
1517-FCBGA (40x40)
533MHz, 1.333GHz
-
256KB
DMA, WDT
Zynq® UltraScale+™ RFSoC
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.