Zynq® UltraScale+™ MPSoC EG Series, System On Chip (SoC)

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233
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Zynq® UltraScale+™ MPSoC EG
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePackage / CaseSupplier Device PackageFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivitySpeedPrimary Attributes
XCZU19EG-1FFVE1924E
IC SOC CORTEX-A53 1924FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1924-BBGA, FCBGA
1924-FCBGA (45x45)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
XCZU4EG-3FBVB900E
IC SOC CORTEX-A53 900FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
XCZU7EG-L2FFVF1517E
IC SOC CORTEX-A53 1517FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU6EG-3FFVC900E
IC SOC CORTEX-A53 900FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
XCZU7EG-L2FFVC1156E
IC SOC CORTEX-A53 1156FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU6EG-L2FFVB1156E
IC SOC CORTEX-A53 1156FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
XCZU7EG-L1FFVF1517I
IC SOC CORTEX-A53 1517FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU6EG-L2FFVC900E
IC SOC CORTEX-A53 900FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
XCZU7EG-1FFVF1517I
IC SOC CORTEX-A53 1517FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU11EG-L2FFVB1517E
IC SOC CORTEX-A53 1517FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
XCZU15EG-3FFVC900E
IC SOC CORTEX-A53 900FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
XCZU11EG-L1FFVB1517I
IC SOC CORTEX-A53 1517FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
XCZU6EG-3FFVB1156E
IC SOC CORTEX-A53 1156FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
XCZU7EG-3FBVB900E
IC SOC CORTEX-A53 900FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU2EG-2SFVA625I
IC SOC CORTEX-A53 625FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
625-BFBGA, FCBGA
625-FCBGA (21x21)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU2EG-2SBVA484I
IC SOC CORTEX-A53 484FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU17EG-3FFVD1760E
IC SOC CORTEX-A53 1760FCBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
XCZU17EG-3FFVE1924E
IC SOC CORTEX-A53 1924FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1924-BBGA, FCBGA
1924-FCBGA (45x45)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
XCZU17EG-3FFVC1760E
IC SOC CORTEX-A53 1760FCBGA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
XCZU11EG-3FFVF1517E
IC SOC CORTEX-A53 1517FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 667MHz, 1.5GHz
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.