Zynq® UltraScale+™ MPSoC CG Series, System On Chip (SoC)

Results:
111
Manufacturer
Series
Primary Attributes
Supplier Device Package
Package / Case
Speed
Operating Temperature
Architecture
Connectivity
Core Processor
Flash Size
RAM Size
Grade
Peripherals
Qualification
Results remaining111
Applied Filters:
Zynq® UltraScale+™ MPSoC CG
Select
ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureGradePackage / CaseSupplier Device PackageFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivitySpeedPrimary AttributesQualification
XCZU6CG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA
5+
$185.9155
10+
$173.5211
15+
$167.3239
Quantity
2,392 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
-
XCZU2CG-1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$84.5070
10+
$78.8732
15+
$76.0563
Quantity
2,383 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU2CG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$802.8169
10+
$749.2958
15+
$722.5352
Quantity
2,115 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU2CG-1SBVA484I
IC SOC CORTEX-A53 484FCBGA
5+
$528.1690
10+
$492.9577
15+
$475.3521
Quantity
2,000 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU3CG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$950.7042
10+
$887.3239
15+
$855.6338
Quantity
1,766 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-
XCZU4CG-L1FBVB900I
IC SOC CORTEX-A53 900FCBGA
5+
$211.2676
10+
$197.1831
15+
$190.1408
Quantity
1,735 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XCZU2CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$464.7887
10+
$433.8028
15+
$418.3099
Quantity
1,658 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU9CG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA
5+
$253.5211
10+
$236.6197
15+
$228.1690
Quantity
1,568 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
-
XCZU4CG-1FBVB900I
IC SOC CORTEX-A53 900FCBGA
5+
$210.2113
10+
$196.1972
15+
$189.1901
Quantity
1,202 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XCZU2CG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$591.5493
10+
$552.1127
15+
$532.3944
Quantity
1,200 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU4CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
5+
$190.1408
10+
$177.4648
15+
$171.1268
Quantity
1,186 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XCZU5CG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$1901.4085
10+
$1774.6479
15+
$1711.2676
Quantity
966 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
-
XCZU4CG-L1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$739.4366
10+
$690.1408
15+
$665.4930
Quantity
700 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XCZU3CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$1848.5915
10+
$1725.3521
15+
$1663.7324
Quantity
658 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-
XCZU6CG-1FFVC900E
IC SOC CORTEX-A53 900FCBGA
5+
$591.5493
10+
$552.1127
15+
$532.3944
Quantity
620 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
-
XCZU5CG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$1859.1549
10+
$1735.2113
15+
$1673.2394
Quantity
565 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
-
XCZU7CG-L1FFVF1517I
IC SOC CORTEX-A53 1517FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU7CG-L2FFVC1156E
IC SOC CORTEX-A53 1156FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU7CG-L2FFVF1517E
IC SOC CORTEX-A53 1517FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
XCZU2CG-2SFVA625E
IC SOC CORTEX-A53 625FCBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
625-BFBGA, FCBGA
625-FCBGA (21x21)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.