Xcede® HD Series, Specialized

Results:
99
Manufacturer
Series
Number of Positions
Contact Layout, Typical
Number of Rows
Connector Type
Mounting Type
Connector Style
Number of Columns
Contact Finish Thickness
Connector Usage
Pitch
Features
Color
Contact Finish
Termination
Number of Positions Loaded
Results remaining99
Applied Filters:
Xcede® HD
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ImageProduct DetailPriceAvailabilityECAD ModelColorFeaturesMounting TypeNumber of RowsContact FinishContact Finish ThicknessNumber of PositionsPitchTerminationSeriesConnector UsageConnector TypeConnector StyleNumber of Positions LoadedNumber of ColumnsContact Layout, Typical
923-6M0C-40H
CONN HEADER VERT HD 6 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Through Hole
-
Gold
-
-
-
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®
All
6
-
923-3L0J-40H
CONN HEADER VERT HD 3 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
10
Gold
-
38
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®, Left Wall
All
4
12 Differential Pairs
923-3Y0E-30H
CONN HEADER VERT HD 3 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
-
Gold
-
8
-
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®, Guide Right
All
-
-
923-3J0C-40H
CONN HEADER VERT HD 3 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
10
Gold
-
57
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®, Guide Left
All
6
18 Differential Pairs
BSP-196383-01
XCEDE HD HIGH-DENSITY BACKPLANE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
Xcede® HD
Backplane
-
XCede®
-
-
-
BSP-196386-01
XCEDE HD HIGH-DENSITY BACKPLANE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
Xcede® HD
Backplane
-
XCede®
-
-
-
HPTS-4-S-D-VT
CONN RCPT XCEDE 4PAIR PWR MOD
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
Through Hole
2
Gold
30.0µin (0.76µm)
6
-
Press-Fit
Xcede® HD
Backplane
Receptacle, Female Blade Sockets
XCede®
All
-
6 Power
923-6J0E-40H
CONN HEADER VERT HD 6 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
19
Gold
-
148
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®, Guide Left
All
8
48 Differential Pairs
923-301C-20H
CONN HEADER VERT HD 3 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
10
Gold
-
57
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®
All
6
18 Differential Pairs
923-3B0C-20H
CONN HEADER VERT HD 3 PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Guide Pin
Through Hole
10
Gold
-
57
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Pins
XCede®, Guide Left
All
6
18 Differential Pairs
HDTM-3-06-1-S-VT-5-R-2
CONN HEADER XCEDE 18PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
Through Hole
-
Gold
30.0µin (0.76µm)
36
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Blades
XCede®, Guide Right
All
6
18 Differential Pairs
HPTS-3-S-D-VT
CONN RCPT XCEDE 3PAIR PWR MOD
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
Through Hole
2
Gold
30.0µin (0.76µm)
4
-
Press-Fit
Xcede® HD
Backplane
Receptacle, Female Blade Sockets
XCede®
All
-
4 Power
HPTS-6-S-D-VT
CONN RCPT XCEDE 6PAIR PWR MOD
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
Through Hole
2
Gold
30.0µin (0.76µm)
8
-
Press-Fit
Xcede® HD
Backplane
Receptacle, Female Blade Sockets
XCede®
All
-
8 Power
HDTF-4-08-S-RA-HS-100
CONN BACKPLANE RCPT RA 32PAIR
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
-
Board Edge, Through Hole, Right Angle
-
Gold
30.0µin (0.76µm)
64
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Receptacle, Female Sockets
XCede®
All
8
32 Differential Pairs
BSP-226769-01
XCEDE HD DAUGHTER CARD ASSEMBLY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Through Hole, Right Angle
-
-
-
-
0.071" (1.80mm)
-
Xcede® HD
Daughtercard
Receptacle, Female Sockets and Blade Sockets
XCede®
-
-
-
HDTM-3-08-1-S-VT-1-2
XCEDE HD 1.80 MM HIGH-DENSITY BA
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
Board Guide
Through Hole
6
Gold
50.0µin (1.27µm)
48
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Blades
XCede®, Guide Left
All
8
-
HDTM-6-08-1-S-VT-4-L-1
XCEDE HD 1.80 MM HIGH-DENSITY BA
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
Board Guide
Through Hole
12
Gold
30.0µin (0.76µm)
96
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Blades
XCede®, Guide Left
All
8
-
HDTM-6-08-1-S-VT-5-R-1
XCEDE HD 1.80 MM HIGH-DENSITY BA
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
Board Guide
Through Hole
12
Gold
30.0µin (0.76µm)
96
0.071" (1.80mm)
Press-Fit
Xcede® HD
Backplane
Header, Male Blades
XCede®, Guide Right
All
8
-
JX435-50064
XCEDE HD2, 4-PAIR, 8 COLUMN, WIT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Through Hole, Right Angle
-
Gold
-
-
0.073" (1.85mm)
Press-Fit
Xcede® HD
Daughtercard
Receptacle, Female Sockets
XCede®
-
4
32 Differential Pairs
JX419-50139
XCEDE HD PLUS, 4-PAIR, 8 COLUMN,
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Through Hole, Right Angle
-
Gold
-
-
0.071" (1.80mm)
Press-Fit
Xcede® HD
Daughtercard
Receptacle, Female Sockets
XCede®
All
8
-

About  Specialized

Specialized backplane connectors adhere to a defined set of specifications and are specifically designed for use with daughterboards, midplane, coplanar, or front boards in a backplane or rack and panel system. These connectors are distinguished by their connector type, number of positions, pitch, number of rows, and contact layout. Their primary purpose is to facilitate the connection and communication between various electronic modules within the system. These connectors are tailored to meet the unique requirements of daughterboards, midplane, coplanar, or front boards, ensuring seamless integration and reliable interconnectivity. The specifications of specialized backplane connectors encompass the type of connector, the quantity of positions available, the pitch (distance between contact points), the number of rows, and the arrangement of contacts. Adhering to these specifications ensures compatibility, reliability, and optimal performance within the specific context of backplane or rack and panel systems. In summary, specialized backplane connectors play a crucial role in enabling the efficient and dependable interconnection of electronic modules within complex systems. Their design and specifications are tailored to meet the distinct needs of daughterboards, midplane, coplanar, or front boards, ensuring seamless integration and reliable performance within backplane or rack and panel configurations.