Solder

Results:
1,756
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Wire Gauge
Storage/Refrigeration Temperature
Flux Type
Type
Shelf Life
Mesh Type
Process
Shelf Life Start
Cable Type
Shield Type
Jacket (Insulation) Material
Ratings
Voltage
Conductor Material
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Number of Conductors
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Usage
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Qualification
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Jacket (Insulation) Diameter
Results remaining1,756
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterCompositionSeriesTypeMelting PointFlux TypeMesh TypeProcessForm
1051208
63S4 MP218 ACP89V PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
-
MP218
Solder Paste
-
No-Clean
4
Leaded
Cartridge, 22.93 oz (650g)
1394819
92A DA100 DAP85V
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-0.4°F (-18°C), 41°F ~ 50°F (5°C ~ 10°C)
-
-
-
DA100
Solder Paste
546 ~ 567°F (286 ~ 297°C)
-
4
-
Syringe, 1.06 oz (30g)
1817250
SAC0307 HF212AGS88.5
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
-
32°F ~ 50°F (0°C ~ 10°C)
-
-
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
Solder Paste
423°F (217°C)
-
-
Lead Free
Cartridge, 21.16 oz (600g)
721473
LF318 TACKY FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
-
-
Solder Paste
-
No-Clean
3
Lead Free
Syringe, 1.06 oz (30g)
24-0063-0010
SOLDER RA 63/36.65/0.35 0.02"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
24 AWG, 25 SWG
0.020" (0.51mm)
Sn63Pb36.65Sb0.35 (63/36.65/0.35)
44
Wire Solder
-
Rosin Activated (RA)
-
Leaded
Spool, 1 lb (454 g)
44-0015-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Pb97.5Ag1.5Sn1 (97.5/1.5/1)
-
Bar Solder
588°F (309°C)
-
-
Leaded
Bar, 1.66 lbs (750g)
04-0123-0000
SOLDER BAR "123" E-BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Pb75Sn23Sb2 (75/23/2)
-
Bar Solder
-
-
-
Leaded
Bar, 1.66 lbs (750g)
04-1090-0000
SOLDER BAR E-BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Pb90Sn10 (90/10)
-
Bar Solder
-
-
-
Leaded
Bar, 1.66 lbs (750g)
403674
63/37 381 5C 0.38MM 0.25KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
27 AWG, 28 SWG
0.015" (0.38mm)
Sn63Pb37 (63/37)
381™
Wire Solder
361°F (183°C)
Rosin Mildly Activated (RMA)
-
Leaded
Spool, 8.8 oz (250g)
6044
SOLDER 60/40 ROSIN CORE 14G 1/2
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
-
-
14 AWG, 16 SWG
0.062" (1.57mm)
Sn60Pb40 (60/40)
*
Wire Solder
361°F (183°C)
-
-
Leaded
Spool, 8 oz (227g), 1/2 lb
14-0595-0062
SOLDER SOLID WIRE .062" 1LB SPL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
14 AWG, 16 SWG
0.062" (1.57mm)
Pb95Sn5 (95/5)
Solid Core Wire
Wire Solder
574 ~ 597°F (301 ~ 314°C)
-
-
Leaded
Spool, 1 lb (454 g)
4935-454G
SOLDER LF SN100E NO CLEAN
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
65°F ~ 80°F (18°C ~ 27°C)
20 AWG, 21 SWG
0.032" (0.81mm)
Sn99.5Cu0.5 (99.5/0.5)
4935
Wire Solder
442°F (228°C)
No-Clean
-
Lead Free
Spool, 1 lb (454 g)
14-6040-0062
SOLDER SOLID WIRE 14AWG 60/40
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
14 AWG, 16 SWG
0.062" (1.57mm)
Sn60Pb40 (60/40)
-
Wire Solder
361 ~ 374°F (183 ~ 190°C)
-
-
Leaded
Spool, 1 lb (454 g)
4942-454G
SOLDER LF SN100E RA FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
65°F ~ 80°F (18°C ~ 27°C)
20 AWG, 21 SWG
0.032" (0.81mm)
Sn99.5Cu0.5 (99.5/0.5)
4942
Wire Solder
442°F (228°C)
Rosin Activated (RA)
-
Lead Free
Spool, 1 lb (454 g)
24-6040-0069
SOLDER FLUX-CORED/44 .125" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
8 AWG, 10 SWG
0.125" (3.18mm)
Sn60Pb40 (60/40)
44
Wire Solder
361 ~ 374°F (183 ~ 190°C)
Rosin Activated (RA)
-
Leaded
Spool, 1 lb (454 g)
4944-454G
SOLDER LF SN100E RA FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
20 AWG, 21 SWG
0.032" (0.81mm)
Sn99.5Cu0.5 (99.5/0.5)
4944
Wire Solder
442°F (228°C)
Rosin Activated (RA)
-
Lead Free
Spool, 1 lb (454 g)
14-6337-0125
SOLDER 63/37 8AWG 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
8 AWG, 10 SWG
0.125" (3.18mm)
Sn63Pb37 (63/37)
Solid Core Wire
Wire Solder
361°F (183°C)
-
-
Leaded
Spool, 1 lb (454 g)
1434501
LOCTITE LF 318M 97SCAGS88.5V 600
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
LF318M
Solder Paste
350°F (177°C)
No-Clean
-
Lead Free
Cartridge, 21.16 oz (600g)
24-6337-0652
SOLDER FLUX-CORED/OR421 63/37 .0
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
18 AWG, 19 SWG
0.040" (1.02mm)
Sn63Pb37 (63/37)
OR421
Wire Solder
361°F (183°C)
Water Soluble
-
Leaded
Spool, 1 lb (454 g)
1844657
LOCTITE HF 212 90ISCDAP88.5 600G
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
HF212
Solder Paste
410 ~ 424°F (209 ~ 218°C)
No-Clean
-
Lead Free
Jar, 21.16 oz (600g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.