Flux, Flux Remover

Results:
412
Manufacturer
Series
Form
Type
Storage/Refrigeration Temperature
Shelf Life
Shipping Info
Flux Type
Shelf Life Start
Melting Point
Diameter
Composition
Process
Wire Gauge
Mesh Type
Results remaining412
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypeFormShelf LifeShelf Life StartStorage/Refrigeration TemperatureShipping Info
RSF-R80-8G
ROSIN SOLDERING FLUX, SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - Rosin Mildly Activated (RMA)
Syringe, 0.28 oz (8g)
36 Months
Date of Manufacture
120°F (49°C) or Below
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1893165
LOCTITE HF108 RWF EFD 10CC SYRIN
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
-
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64-0000-0977
977 SOLDERING FLUX 5 GAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - Organic, Water-Soluble, Liquid
Container, 5 gal
36 Months
Date of Manufacture
40°F ~ 77°F (4°C ~ 25°C)
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63-0000-0979
979 SOLDERING FLUX 1 GAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean
Container, 1 gal
12 Months
Date of Manufacture
40°F ~ 77°F (4°C ~ 25°C)
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65-0000-0979
979 SOLDERING FLUX 53 GAL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean
Container, 53 gal
12 Months
Date of Manufacture
40°F ~ 77°F (4°C ~ 25°C)
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64-0002-2372
SOLDER FLUX NF372-TB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean, Liquid
Container, 5 gal
24 Months
Date of Manufacture
50°F ~ 77°F (10°C ~ 25°C)
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63-0002-2372
SOLDER FLUX NF372-TB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean, Liquid
Container, 1 gal
24 Months
Date of Manufacture
50°F ~ 77°F (10°C ~ 25°C)
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CQIRM-1.0
FLUX REMOVER (FOAM FREE) IN 30ML
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux Remover
Bottle, 1 oz (28.35g)
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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8341-10ML
FLUX PASTE NO CLEAN IN SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean
Syringe, 0.35 oz (9.8g)
24 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
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CQ4300-2OZ
NO-CLEAN WATER-WASHABLE FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - No Clean, Water-Soluble
Jar, 2 oz (56.7g)
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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RMA591NL-5M
TACK FLUX (FOR LEAD-FREE) W/ TIP
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - Rosin Mildly Activated (RMA)
Syringe, 0.18 oz (5g), 5cc
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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SMD291NL-5M
NO-CLEAN TACK FLUX W/TIPS
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - No Clean, Lead Free
Syringe, 0.18 oz (5g), 5cc
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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SMD4300-5M
NO-CLEAN WATER-WASHABLE W/ TIPS
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK® SMD4300
Flux - No Clean, Water-Soluble
Syringe, 0.18 oz (5g), 5cc
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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CQ2LF-B-R
LIQUID FLUX WATER-WASHABLE IN 6M
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - Water-Soluble, Lead Free, Liquid
Pen, 0.2 oz (5.669g)
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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CQ4LF-B-R
LIQUID FLUX NO-CLEAN IN 6ML (0.2
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - No Clean, Lead Free, Liquid
Pen, 0.2 oz (5.669g)
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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TF5000-2CC-6
TF5000 NO CLEAN TACKY FLUX - 2CC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean, Tacky Solder
Tube, 0.07 oz (2g), 2cc
24 Months
Date of Manufacture
-
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FLS135-TT
SRA135 W/ IRON TIP TINNER
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - Rosin Activated (RA)
Jar, 2 oz (56.7g)
24 Months
Date of Manufacture
-
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PEN-NC-VF-SET
SRA 312-VF VOC-FREEWATER BASED N
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Flux - No Clean, Lead Free
Pen, 0.35 oz (10g)
24 Months
Date of Manufacture
-
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SMD491
NC HALOGEN-FREE TACK FLUX 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - No Clean
Syringe, 0.35 oz (10g), 10cc
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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RMA591NL
RMA TACK FLUX FOR LEAD-FREE 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
Flux - Rosin Mildly Activated (RMA)
Syringe, 0.35 oz (10g), 10cc
24 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
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About  Flux, Flux Remover

Flux is a critical material used in the soldering process to ensure proper bonding between the solder and the materials being joined. Flux comes in different forms such as paste, spray, or liquid, and is applied to the materials being soldered to prevent the formation of metal oxides that can inhibit bonding and create weak joints. During the soldering process, flux also aids in cleaning the surfaces by removing any oxides, dirt, or other contaminants that may be present on the materials. This cleaning action helps to create a clean and even surface for the solder to flow around and adhere to the material. Some fluxes can leave residue after the soldering process is complete. This post-soldering residue can be removed using rosin activated, ionic, or lead-free flux remover. Rosin activated flux remover is typically used for removing rosin-based flux residues, while ionic flux remover is more effective for removing water-soluble flux residues. Lead-free flux remover is specifically designed for removing residues from lead-free soldering processes. It is important to choose the correct type of flux for the materials being soldered, as well as the specific application. Different types of fluxes are available, each with its own unique properties and characteristics. For example, some fluxes may contain lead, while others are lead-free. The choice of flux depends on the specific requirements of the task, as well as any regulatory or environmental considerations. In summary, flux is a crucial component of the soldering process that helps to prevent oxidation, clean surfaces, and create strong bonds between the materials being joined. By choosing the correct type of flux and using appropriate flux remover, technicians can ensure the quality and reliability of their soldering work, while also meeting regulatory and environmental requirements.