Solder

Results:
1,743
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Series
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Composition
Melting Point
Diameter
Wire Gauge
Storage/Refrigeration Temperature
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Shelf Life Start
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Ratings
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Jacket (Insulation) Diameter
Results remaining1,743
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
SMD2SW.031 .7OZ
SOLDER WIRE POCKET PACK 60/40 TI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD2
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 370°F (183 ~ 188°C)
No-Clean, Water Soluble
20 AWG, 21 SWG
Leaded
Tube, 0.7 oz (19.85g)
4933-112G
SOLDER LF SN100E NO CLEAN
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
65°F ~ 80°F (18°C ~ 27°C)
-
4933
Wire Solder
Sn99.5Cu0.5 (99.5/0.5)
0.020" (0.51mm)
442°F (228°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 4 oz (113.40g)
4926-454G
SOLDER LF SAC305 RA FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
65°F ~ 80°F (18°C ~ 27°C)
-
4926
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.040" (1.02mm)
423 ~ 430°F (217 ~ 221°C)
Rosin Activated (RA)
18 AWG, 19 SWG
Lead Free
Spool, 1 lb (454 g)
4915-112G
SOLDER LF SAC305 NO CLEAN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
65°F ~ 80°F (18°C ~ 27°C)
-
4915
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.040" (1.02mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 4 oz (113.40g)
4912-227G
SOLDER LF SAC305 NO CLEAN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
65°F ~ 80°F (18°C ~ 27°C)
-
4912
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 8 oz (227g), 1/2 lb
4885WS-454G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
4880
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
Water Soluble
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
49500-454G
SOLDER WIRE NO CLEAN 0.032" DIA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
65°F ~ 80°F (18°C ~ 27°C)
-
49500
Wire Solder
Sn99.5Cu0.5 (99.5/0.5)
0.032" (0.81mm)
442°F (228°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
4866-227G
SOLDER 63/37 NOCLEAN .04DIA .5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
No-Clean
18 AWG, 19 SWG
Leaded
Spool, 8 oz (227g), 1/2 lb
OS-S031
SOLDER NO-CLEAN .031" X 20'
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool
SMDSW.031 .7OZ
SOLDER WIRE POCKET PACK 63/37 TI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean, Water Soluble
20 AWG, 21 SWG
Leaded
Tube, 0.7 oz (19.85g)
2023628
LOCTITE GC 10 SAC305T3 885 52U
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
41°F ~ 77°F (5°C ~ 25°C)
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423°F (217°C)
No-Clean
-
Lead Free
Jar, 17.64 oz (500g)
1993881
LOCTITE GC 10 SAC305T4 885 52U
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
41°F ~ 77°F (5°C ~ 25°C)
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423°F (217°C)
No-Clean
-
Lead Free
Jar, 17.64 oz (500g)
SMDSWLT.040 50G
SN42/BI57/AG1 2.2 FLUX CORE SOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
18 AWG, 19 SWG
Lead Free
Spool, 1.8 oz (50g)
4884-454G
SOLDER RA 63/37 .025" 1 LBS
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
-
4880
Wire Solder
Sn63Pb37 (63/37)
0.025" (0.64mm)
361°F (183°C)
Rosin Activated (RA)
22 AWG, 23 SWG
Leaded
Spool, 1 lb (454 g)
SMD3SWLT.040 50G
SN42/BI58 2.2% FLUX CORE SOLDER
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
-
Lead Free
Spool, 1.8 oz (50g)
4895-454G
SOLDER RA 60/40 .032" 1 LB
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
-
4890
Wire Solder
Sn60Pb40 (60/40)
0.032" (0.81mm)
361 ~ 376°F (183 ~ 191°C)
Rosin Activated (RA)
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
SMDSWLF.020 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
24 AWG, 25 SWG
Lead Free
Spool, 8 oz (227g), 1/2 lb
SMD4300SNL250T3
SOLDER PASTE SAC305 250G T3
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
3
CHIPQUIK® SMD4300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
-
Lead Free
Jar, 8.8 oz (250g)
4900-112G
SOLDER LF SN96 21GAUGE .25LBS
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
-
4900
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 4 oz (113.40g)
24-6337-9710
SOLDER 63/37 20AWG 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
-
285
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.