Chip Quik, Inc.

Chip Quik, Inc.

Chip Quik, Inc. is a renowned company specializing in the development and manufacturing of advanced soldering and desoldering products. With a strong emphasis on quality and reliability, Chip Quik offers a wide range of solutions including solder paste, flux, and desoldering braid that are essential for electronic assembly and repair processes. These products are widely used in industries such as electronics manufacturing, aerospace, and telecommunications, enabling efficient and precise soldering operations. Chip Quik's commitment to innovation and customer satisfaction has established it as a trusted provider of soldering solutions worldwide. The company continues to push the boundaries of soldering technology, delivering products that facilitate the assembly and repair of complex electronic systems.

Solder

Results:
457
Series
Form
Melting Point
Diameter
Composition
Wire Gauge
Flux Type
Type
Mesh Type
Shelf Life
Process
Storage/Refrigeration Temperature
Shelf Life Start
Results remaining457
Applied Filters:
Chip Quik, Inc.
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
RASW.020 1LB
SOLDER WIRE 63/37 TIN/LEAD ROSIN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
RASW.031 .7OZ
SOLDER WIRE POCKET PACK 63/37 TI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Rosin Activated (RA)
21 AWG, 20 SWG
Leaded
Tube, 0.7 oz (19.85g)
SMD291AX10T5
SOLDER PASTE NO CLEAN T5 10CC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
5
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 1.23 oz (35g), 10cc
SMD291SNL10
SOLDER PASTE NO-CLEAN 10CC SYR
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
3
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Syringe, 1.23 oz (35g), 10cc
SMDIN52SN48
INDIUM SOLDER WIRE (IN52/SN48) 0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD
-
-
-
-
Wire Solder
In52Sn48 (52/48)
0.031" (0.79mm)
244°F (118°C)
-
20 AWG, 21 SWG
Lead Free
Spool
SMD291AX
SOLDER PASTE NO-CLEAN 63/37 5CC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
3
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 0.53 oz (15g), 5cc
SMDSWLF.059 3.3 1LB
SOLDER WIRE SN96.5/AG3.0/CU0.5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.059" (1.50mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
-
Lead Free
Spool, 1 lb (453.59g)
NCSWLF.015 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 1 lb (453.592g)
SMD2SWLF.012 100G
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD2
-
-
-
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.012" (0.31mm)
441°F (227°C)
No-Clean, Water Soluble
28 AWG, 30 SWG
Lead Free
Spool, 3.53 oz (100g)
SMDSW.020 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
No-Clean, Water Soluble
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
SMD2060-25000
SOLDER SPHERES SAC305 .030" DIAM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD2
24 Months
Date of Manufacture
-
-
Solder Sphere
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.030" (0.76mm)
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Jar
SMDSW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean, Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
SMD2SW.031 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD2
-
-
-
-
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 370°F (183 ~ 188°C)
No-Clean, Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
NC4SW.020 1LB
SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Pb93.5Sn5Ag1.5 (93.5/5/1.5)
0.020" (0.51mm)
565 ~ 574°F (296 ~ 301°C)
No-Clean
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
NC191SNL50T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Smooth Flow™
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
5
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Jar, 1.76 oz (50g)
EXB-SN96.5AG3.0CU0.5-0.5LB
SOLDER BAR SN96.5/AG3.0/CU0.5 0.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Super Low Dross™
-
-
-
-
Bar Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Bar, 0.5 lb (227g)
SMD291AX10T4
SLDR PST NO-CLEAN 63/37 T4 10CC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
4
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 1.23 oz (35g), 10cc
EXB-SN63PB37
SOLDER BAR SN63/PB37 1LB (454G)
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Super Low Dross™
-
-
-
-
Bar Solder
Sn63Pb37 (63/37)
-
361°F (183°C)
-
-
Leaded
Bar, 1 lb (454g)
SMDLTLFPT5
SOLDER PASTE NO CLEAN SN42/BI57.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
5
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
281°F (138°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
SMD2055-25000
SOLDER SPHERES SAC305 DIAMETER 2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SMD2
24 Months
Date of Manufacture
-
-
Solder Sphere
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.025" (0.64mm)
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Jar

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.