Olimex Ltd. is a Bulgarian company that specializes in open-source hardware and development tools. They offer a wide range of affordable products including single-board computers, development boards, modules, and electronic components. Olimex's user-friendly designs make it accessible for both beginners and experienced engineers to create innovative projects. They prioritize open-source principles by providing public access to their designs and actively collaborating with the global hardware community. Olimex also offers software tools, documentation, and tutorials to support users in their development endeavors. With their commitment to affordability, accessibility, and open-source principles, Olimex has become a trusted brand in the embedded systems and maker communities.
Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.